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1.发明授权A PROCESS FOR ENHANCING THE RESOLUTION OF A THERMALLY TRANSFERRED PATTERN 有权方法用于提高热TRANSMITTED图案的分辨率
公开(公告)号：EP2041626B1
公开(公告)日：2013-04-10
申请号：EP07836085.6
申请日：2007-07-16
发明人： ANDREWS, Gerald, D. , BAILEY, Richard, Kevin , BLANCHET, Graciela, Beatriz , CATRON, John, W. , GAO, Feng , JAYCOX, Gary, Delmar , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , METH, Jeffrey, Scott , PRINCIPE, Frank, S. , SCHIFFINO, Rinaldo, S. , YOHANNAN, Robert, Mar
CPC分类号： B41M5/38207 , B41M5/38214 , H01L51/0013 , H01L51/0052 , H01L51/0068 , H01L51/052 , H01L51/0545 , H05K3/046 , H05K3/26 , H05K2201/0761 , H05K2203/0191 , H05K2203/0528 , H05K2203/107
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2.发明公开THIN FILM TRANSISTOR COMPRISING NOVEL CONDUCTOR AND DIELECTRIC COMPOSITIONS 审中-公开用新的头和介电组合DÜNNSCHICHTTRANSISITOR
公开(公告)号：EP2041816A2
公开(公告)日：2009-04-01
申请号：EP07810505.3
申请日：2007-07-16
发明人： BAILEY, Richard, Kevin , BLANCHET, Graciela, Beatriz , CATRON, John, W. , CHESTERFIELD, Reid, John , GAO, Feng , GLICKSMAN, Howard, David , GOLDFINGER, Marc, B. , JAYCOX, Gary, Delmar , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , MALAJOVICH, Irina , MENG, Hong , METH, Jeffrey, Scott , NUNES, Geoffrey , O'NEIL, Gerard , SHARP, Kenneth, George , TASSI, Nancy, G.
IPC分类号： H01L51/10
CPC分类号： H01L51/052 , H01L51/0013 , H01L51/0035 , H01L51/0052 , H01L51/0068 , H01L51/0541 , H01L51/0545 , H01L51/055 , H01L51/102
摘要： The invention relates to thin film transistors comprising novel dielectric layers and novel electrodes comprising metal compositions that can be provided by a dry thermal transfer process.
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3.发明公开A PROCESS FOR ENHANCING THE RESOLUTION OF A THERMALLY TRANSFERRED PATTERN 有权方法用于提高热TRANSMITTED图案的分辨率
公开(公告)号：EP2041626A2
公开(公告)日：2009-04-01
申请号：EP07836085.6
申请日：2007-07-16
发明人： ANDREWS, Gerald, D. , BAILEY, Richard, Kevin , BLANCHET, Graciela, Beatriz , CATRON, John, W. , GAO, Feng , JAYCOX, Gary, Delmar , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , METH, Jeffrey, Scott , PRINCIPE, Frank, S. , SCHIFFINO, Rinaldo, S. , YOHANNAN, Robert, Mar
CPC分类号： B41M5/38207 , B41M5/38214 , H01L51/0013 , H01L51/0052 , H01L51/0068 , H01L51/052 , H01L51/0545 , H05K3/046 , H05K3/26 , H05K2201/0761 , H05K2203/0191 , H05K2203/0528 , H05K2203/107
摘要： Provided are processes for improving a thermally transferred pattern on an imaged thermal transfer receiver, wherein the imaged thermal transfer receiver comprises a surface having an exposed portion and a non-exposed portion of one or more thermally transferred layer(s), comprising: (a) contacting said surface with an adhesive layer for a contact period to provide a laminate; (b) separating said adhesive layer from the laminate to provide a treated thermal transfer receiver having a surface substantially free of said non-exposed portion of one or more thermally transferred layer(s). The processes are useful in the fabrication of electronic devices including thin film transistors, circuits, electromagnetic interference shields, touchpad sensors and other electronic devices.
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4.发明公开METAL COMPOSITIONS, THERMAL IMAGING DONORS AND PATTERNED MULTILAYER COMPOSITIONS DERIVED THEREFROM 审中-公开金属组成，热图捐助者和它们的衍生物结构性多层合成
公开(公告)号：EP2042006A2
公开(公告)日：2009-04-01
申请号：EP07810501.2
申请日：2007-07-16
发明人： BAILEY, Richard, Kevin , BLANCHET, Graciela, Beatriz , CASPAR, Jonathan, V. , CATRON, John, W. , CHESTERFIELD, Reid, John , FELDER, Thomas, C. , GAO, Feng , JOHNSON, Lynda, Kaye , KEUSSEYAN, Roupen, Leon , KEYS, Dalen, E. , MALAJOVICH, Irina , METH, Jeffrey, Scott , NUNES, Geoffrey , O'NEIL, Gerard , SCHIFFINO, Rinaldo, S. , TASSI, Nancy, G.
IPC分类号： H05K1/02 , H05K1/09 , H05K3/12 , H05K3/04 , C08K3/08 , H05K3/10 , G06F3/041 , G06F3/044 , B41M5/382
CPC分类号： B41M5/38207 , B41M3/006 , B41M5/385 , B41M5/395 , B41M5/41 , B41M5/44 , B41M5/465 , B41M2205/02 , B41M2205/38 , H01B1/22 , H01L51/0013 , H01L51/0035 , H01L51/0036 , H05K1/095 , H05K3/046 , H05K2201/0329 , H05K2203/0528 , H05K2203/107 , Y10T428/24893 , Y10T428/24909 , Y10T428/24917
摘要： The invention provides metal compositions, including silver compositions, and thermal imaging donors prepared with the compositions. The donors are useful for thermal transfer patterning of a metal layers and optionally, a corresponding proximate portion of an additional transfer layer onto a thermal imaging receiver. The compositions are useful for dry fabrication of electronic devices. Also provided are patterned multilayer compositions comprising one or more base film(s), and one or more patterned metal layers, including EMI shields and touchpad sensors.
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