SPACE-SAVING MEMORY MODULE
    3.
    发明公开
    SPACE-SAVING MEMORY MODULE 失效
    RAUMSPARENDER SPEICHERMODUL

    公开(公告)号:EP0710431A4

    公开(公告)日:1997-05-02

    申请号:EP95906193

    申请日:1994-07-19

    摘要: A low-profile printed circuit board (11) has discrete components (19) mounted within openings (21) provided in a rigid substrate forming art of the board. The components (19) are mounted with leads soldered to mounting pads on the surface of the board (11), and arranged around the periphery of the openings (21). The stand-off design of discrete components (19) for mounting to the surfaces of boards (11) allows such components (19) to be mounted within openings (21) simply by reversing the orientation of the components (19) relative to the board (11). In a preferred embodiment, a DRAM card is a four-level board with circuitry on each side of a thin, flexible substrate (18) and each side of a rigid substrate (11), the two substrates spaced apart by a thin, insulating layer (15). The rigid substrate (11) has openings (21) with DRAM modules (19) mounted within the openings (21), and further modules (19) are mounted on the opposite surface in the conventional manner.

    摘要翻译: 薄型印刷电路板具有安装在设置在基板的刚性基板中的开口内的分立部件,该基板形成板的技术。 组件安装有焊接到板的表面上的安装焊盘的引线,并且围绕开口的周边布置。 用于安装到板表面的分立组件的间接设计允许这样的组件通过相对于板的反向取向而安装在开口内。 在优选实施例中,DRAM卡是四层电路板,其在薄的柔性衬底的每一侧上具有电路,并且刚性衬底的每一侧,两个衬底被薄的绝缘层隔开。 刚性基板具有安装在开口内的DRAM模块的开口,并且其它模块以常规方式安装在相对表面上。