公开(公告)号：EP2674971A4

公开(公告)日：2017-12-27

申请号：EP11858194

申请日：2011-09-02

申请人： FUJI ELECTRIC CO LTD

发明人： UEZATO YOSHINORI ,  SOUTOME MASAYUKI ,  MARUYAMA RIKIHIRO ,  GOTO TOMOAKI

IPC分类号： H01L23/00 ,  H01L23/12 ,  H01L23/36 ,  H05K7/20

CPC分类号： H01L21/4882 ,  B23P15/26 ,  F28F3/00 ,  H01L21/4803 ,  H01L21/4878 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  Y10T29/49366 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a semiconductor module which, at the time of soldering insulating substrates of different shapes to a radiator plate, makes the management of a curve formed on the radiator plate before soldering easy, prevents the appearance of a crack in solder, and narrows a gap between the radiator plate and a cooling fin. When insulating substrates (1 and 2) of different shapes are soldered to a radiator plate (3), a third concave curve (11) is formed in advance on an insulating substrate (1 and 2) side of the radiator plate (3). The third curve (11) is determined by adding a second concave curve (7) which is expected at the time of actually soldering the insulating substrates (1 and 2) of different shapes to the radiator plate (3) to a first concave curve (6) obtained by moving upside down a convex curve which appears at the time of soldering the insulating substrates (1 and 2) of different shapes to a flat radiator plate (3). A bottom (11a) of the third curve (11) is positioned under the large insulating substrate (2) and a curvature of a portion for which the distance between the bottom (11a) and a reference point (5a) of the radiator plate (3) is longer is made smaller than a curvature of a portion for which the distance between the bottom (11a) and a reference point (5b) of the radiator plate (3) is shorter.

公开(公告)号：EP3007219A4

公开(公告)日：2017-02-22

申请号：EP14879151

申请日：2014-12-10

申请人： FUJI ELECTRIC CO LTD

发明人： MARUYAMA RIKIHIRO ,  HARADA TAKAHITO

IPC分类号： H01L25/07 ,  H01L23/053 ,  H01L25/18

CPC分类号： H01L23/053 ,  H01L21/52 ,  H01L23/08 ,  H01L23/24 ,  H01L23/28 ,  H01L23/49838 ,  H01L25/07 ,  H01L25/071 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/13055 ,  H01L2924/19107 ,  H05K3/0011 ,  H05K3/303 ,  H05K3/46 ,  H01L2924/00

摘要： Provided is a semiconductor module in which electrical connection between insulating circuit boards is achieved readily, and heat produced from a semiconductor chip can be radiated efficiently under suppression of warpage deformation, even though the semiconductor module has a structure with a plurality of insulating circuit boards. The semiconductor module comprises a plurality of insulating circuit boards 9, a resin frame body 5 having a crosspiece 5a being in contact with first outer edges of the insulating circuit boards 9 opposed to each other and a frame element 5c being in contact with second outer edges of the plurality of insulating circuit boards 9 except the first outer edges, a conductive component 7 striding over the crosspiece 5a to achieve the connection between the insulating circuit boards 9 electrically, and an upper lid 8 having a lid element 8c covering an opening disposed at an upper part of the resin frame body 5 and a partition 8b abutting on a part of the crosspiece 5a.

摘要翻译： 本发明提供一种半导体模块，即使半导体模块具有多个绝缘电路板的结构，也能够容易地实现绝缘电路板之间的电连接，并且能够在抑制翘曲变形的同时有效地散发从半导体芯片产生的热量。 半导体模块包括多个绝缘电路板9，具有与绝缘电路板9的彼此相对的第一外边缘接触的挡条5a的树脂框体5以及与第二外边缘接触的框架元件5c 多个绝缘电路板9中的除了第一外边缘之外的导电部件7跨过横梁5a以实现绝缘电路板9之间的电连接;以及上盖8，其具有盖元件8c， 树脂框体5的上部以及与挡条5a的一部分抵接的隔壁8b。