Semiconductor device having a thin film field-shaping structure
    1.
    发明公开
    Semiconductor device having a thin film field-shaping structure 审中-公开
    Halbleiteranordnung mit einemDünnschicht-Feldformungsstruktur

    公开(公告)号:EP1032046A1

    公开(公告)日:2000-08-30

    申请号:EP00101883.7

    申请日:2000-01-31

    IPC分类号: H01L29/41 H01L29/78 H01L27/06

    摘要: A semiconductor device comprising: a semiconductor substrate (10), a dielectric film (18) formed on the semiconductor substrate, a first electrode (2) and a second electrode (3) separated from each other on the dielectric film; a spiral thin film layer (6) having both ends connected to the first electrode and the second electrode, respectively, the spiral thin film layer surrounding the first electrode, the thin film layer being formed on the dielectric layer, and a plurality (51) of p-n diodes (4,5) such as Zener diodes formed in series in the spiral thin film layer along a longitudinal direction of the spiral thin film layer to provide a uniform potential distribution in the spiral thin film layer.

    摘要翻译: 一种半导体器件,包括:半导体衬底(10),形成在所述半导体衬底上的电介质膜(18),在所述电介质膜上彼此分离的第一电极(2)和第二电极(3) 分别具有连接到第一电极和第二电极的螺旋薄膜层(6),围绕第一电极的螺旋形薄膜层,薄膜层形成在电介质层上,以及多个(51) 的pn二极管(4,5),例如齐纳二极管,沿着螺旋形薄膜层的纵向串联形成在螺旋形薄膜层中,以在螺旋形薄膜层中提供均匀的电势分布。