Conductive pattern forming method and conductive pattern forming system
    1.
    发明公开
    Conductive pattern forming method and conductive pattern forming system 审中-公开
    一种用于生产导电结构和系统,用于制备导电结构的方法

    公开(公告)号:EP2597694A2

    公开(公告)日:2013-05-29

    申请号:EP12193796.5

    申请日:2012-11-22

    发明人: Katsumura, Manabu

    IPC分类号: H01L51/00 H01L51/10

    摘要: According to a mode of the present invention, since a conductive pattern (a source wiring (3) and a drain wiring (4)) having a graded composition structure in which a content ratio of a conductive polymer decreases while a content ratio of metal nanoparticles increases from a base material (a flexible film (1) and an organic TFT (2)) is formed with respect to a thickness direction, adhesion with the base material is secured at a bonding portion between the base material and the conductive pattern due to the high content ratio of the conductive polymer and, at the same time, favorable electrical performance is produced by increasing the content ratio of the metal nanoparticles.

    摘要翻译: 。根据本发明的一个模式中,因为一个导体图案(源极布线(3)和(4)漏极布线)具有梯度组成的结构,其中的导电性聚合物的含有比例降低,而金属微粒的含量比 从基材增加(柔性电影(1)和有机TFT(2)的)被形成为相对于厚度方向,与基底材料的粘附固定在基体材料,并且由于导电图案之间的接合部分 导电聚合物和高含量比,在同一时间,良好的电性能,通过增加金属纳米粒子的含量比率产生。

    Conductive pattern forming method and conductive pattern forming system
    2.
    发明公开
    Conductive pattern forming method and conductive pattern forming system 审中-公开
    一种用于生产导电结构和系统,用于制备导电结构的方法

    公开(公告)号:EP2597694A3

    公开(公告)日:2014-10-22

    申请号:EP12193796.5

    申请日:2012-11-22

    发明人: Katsumura, Manabu

    IPC分类号: H01L51/00 H01L51/10 H05K3/12

    摘要: According to a mode of the present invention, since a conductive pattern (a source wiring (3) and a drain wiring (4)) having a graded composition structure in which a content ratio of a conductive polymer decreases while a content ratio of metal nanoparticles increases from a base material (a flexible film (1) and an organic TFT (2)) is formed with respect to a thickness direction, adhesion with the base material is secured at a bonding portion between the base material and the conductive pattern due to the high content ratio of the conductive polymer and, at the same time, favorable electrical performance is produced by increasing the content ratio of the metal nanoparticles.