METHOD FOR MANUFACTURING ORGANIC LAYER PATTERN, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:EP4210089A1

    公开(公告)日:2023-07-12

    申请号:EP21864370.8

    申请日:2021-09-01

    摘要: There is provided a manufacturing method for an organic layer pattern, including a step of forming an interlayer that dissolves in water or a water-soluble solvent and a resist layer in this order on an organic layer to obtain a laminate, a step of producing a pattern of the resist layer, a step of carrying out etching of the organic layer using the pattern of the resist layer as a mask, a step of carrying out insolubilization of a surface of the interlayer with respect to water or a water-soluble solvent, after the etching, and a step of carrying out washing of the laminate after the step of carrying out the insolubilization, with water or a water-soluble solvent. In addition, there is also provided a manufacturing method for a semiconductor device.