Electronic device
    1.
    发明公开
    Electronic device 审中-公开
    电子设备

    公开(公告)号:EP2838330A3

    公开(公告)日:2016-06-01

    申请号:EP14179772.0

    申请日:2014-08-04

    申请人: FUJITSU LIMITED

    发明人: Taguchi, Jun

    IPC分类号: H05K7/20

    摘要: An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member.

    摘要翻译: 描述了一种电子装置,其包括:第一冷却构件,其具有第一重叠部分和第二重叠部分,第一重叠部分中形成有第一插入孔,并且设置成抵靠设置在基板上的待冷却的第一部件; 第二冷却构件,其具有形成有第二插入孔的第二重叠部分,并且设置为抵靠在设置在基板上的第二待冷却构件上,第二重叠部分与第一重叠部分重叠; 以及联接构件,所述联接构件插入穿过第一插入孔和第二插入孔以通过弹性构件将第一重叠部分联接到第二重叠部分。

    Electronic device
    2.
    发明公开
    Electronic device 审中-公开
    Elektronische Vorrichtung

    公开(公告)号:EP2838330A2

    公开(公告)日:2015-02-18

    申请号:EP14179772.0

    申请日:2014-08-04

    申请人: FUJITSU LIMITED

    发明人: Taguchi, Jun

    IPC分类号: H05K7/20

    摘要: An electronic device is described, which includes: a first cooling member having a first overlapping portion in which a first insertion hole is formed, and provided to be abutted on a first component to be cooled provided on a substrate; a second cooling member having a second overlapping portion in which a second insertion hole is formed, and provided to be abutted on a second component to be cooled provided on the substrate, the second overlapping portion overlapping the first overlapping portion; and a coupling member inserted through the first insertion hole and the second insertion hole to couple the first overlapping portion to the second overlapping portion through an elastic member.

    摘要翻译: 描述了一种电子设备,其包括:第一冷却构件,具有第一重叠部分,第一重叠部分形成有第一插入孔,并且设置成抵靠设置在基板上的要冷却的第一部件; 第二冷却构件,具有第二重叠部分,其中形成有第二插入孔,并且设置成抵接在设置在基板上的待冷却的第二部件上,第二重叠部分与第一重叠部分重叠; 以及通过所述第一插入孔插入的联接构件和所述第二插入孔,以通过弹性构件将所述第一重叠部分联接到所述第二重叠部分。