摘要:
A method of cooling an assembly (30) including at least one heat-generating electronic device (30) and at least one peripheral heat-generating device (30) includes cooling the at least one heat-generating electronic device (50) with a primary cooling fluid (C1) and cooling the at least one heat-generating electronic device (50) and the at least one peripheral heat-generating device (50) with a secondary cooling fluid (C1). The secondary cooling fluid (C1) is distinct from the primary cooling fluid (C2).
摘要:
An immersion cooling device (100) includes a housing, at least one heating component (120), at least one heat dissipation component (142), and at least one fluid-driving unit (1442). The housing (105) includes a tank (110) and at least one cover (1441) and has a containing structure (S1). The heating component (120) is located in the containing structure (S1). The immersion cooling device is adapted to cool the heating component (120) in a single phase. The heat dissipation component (142) is disposed on the heating component (120). The cover (1441) has a flow-guiding structure (S2) and covers the heat dissipation component (142), such that the heat dissipation component (142) is located in the flow-guiding structure (S2). The flow-guiding structure (S2) communicates between the fluid-driving unit (1442) and the containing structure (S1). Additionally, an active heat dissipation module (140) and an active flow-guiding module (144) are also provided.
摘要:
A fluid conditioner 1 for use in a tank 110 containing electronic devices, immersed in fluid F, comprises a housing 10 having a chamber 38, an outlet 14, a heat exchanger 18 located in the chamber, and one or more pumps 16 such that the fluid passes into contact with the heat exchanger. The heat exchanger 18 has an inlet 30 for cooling medium to enter and an outlet 32 for cooling medium to exit. In the upright, operational orientation, the pumps 16 and the heat exchanger 18 are vertically spaced relative to one another and the heat exchanger 18 is located above the outlet. Fluid F is moved through the pumps 16 and passes into contact with the heat exchanger 18. The cooled fluid F exits via the outlet 14 of the fluid conditioner 1 and passes into the lower region of the tank 110 for circulation therethrough.
摘要:
A cooling unit includes a radiator, a rigid supply pipe which is connected to the radiator, and in which a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.
摘要:
A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.
摘要:
Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.
摘要:
A system (100) for immersion cooling computing system equipment includes a container (102) containing a volume (104) of immersion cooling fluid. At least one heat generating computing system equipment component (106) and a liquid-liquid heat exchanger (108) are disposed in the volume of immersion cooling fluid. A manifold system (110) is disposed between the heat generating computing system equipment component and the liquid-liquid heat exchanger to direct a flow of immersion cooling fluid between the heat generating computing system component and the liquid-liquid heat exchanger and to isolate the flow of immersion cooling fluid from a bulk amount of immersion cooling fluid. The flow of immersion cooling fluid and the bulk amount of immersion cooling fluid constitutes the volume of immersion cooling fluid.
摘要:
Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.