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公开(公告)号：EP0946330A1
公开(公告)日：1999-10-06
申请号：EP97918275.0
申请日：1997-05-01
CPC分类号： H01L24/32 , B23K35/025 , B23K35/26 , B23K35/262 , B23K2201/36 , H01L24/29 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29298 , H01L2224/325 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H05K3/3463 , H05K3/3484 , H05K2201/0272 , H01L2924/00 , H01L2924/01083 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A soldered composition formed as a paste by use of a fugitive carrier medium including up to 5-15 % (by weight) flux, the solder composition being useful for soldering electronic components and packages to a circuit on a substrate consisting of a low cost thermoplastic or polymer having a heat deflection temperature. The composition comprises: (a) a ternary or binary eutectic powder of the alloy system Sn-Bi-In that melts below the heat deflection temperature, (b) a second powder admixed with the first, the second powder consisting of a tin-based powder that reacts with the first powder at 150 °C or less in 15 minutes or less and has a melting temperature above the heat deflection temperature, said powders containing less than .1 % Pb as an impurity and being proportioned in a weight ratio of 3:1 to 1:3, and (c) other alloying additives selected from the group of Cu, Ni, Ag, Ce, In, Bi, and Au which enhance the mechanical properties of the soldered joints at elevated temperatures and which do not inhibit metallurgical interactions of the first and second powders during soldering. A method of soldering electronic components to a substrate is also disclosed.
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