公开(公告)号：EP3121237A4

公开(公告)日：2017-10-18

申请号：EP15764663

申请日：2015-02-13

Applicant: DEXERIALS CORP

Inventor： NAMIKI HIDETSUGU ,  KANISAWA SHIYUKI ,  ISHIGAMI AKIRA ,  AOKI MASAHARU

IPC: C09J201/00 ,  C08K3/08 ,  C08K3/22 ,  C08K7/16 ,  C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01L23/00 ,  H01L33/60 ,  H01L33/62 ,  H05K3/32

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

公开(公告)号：EP3166372A1

公开(公告)日：2017-05-10

申请号：EP15821293.6

申请日：2015-07-10

Applicant: Material Concept, Inc.

Inventor： KOIKE, Junichi ,  ANDO, Daisuke ,  SUTOU, Yuji

IPC: H05K3/38 ,  H01G2/06 ,  H05K1/09 ,  H01L31/0224

CPC classification number: H05K1/09 ,  H01G2/06 ,  H01G4/008 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K3/10 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4007 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2203/086 ,  H05K2203/087

Abstract: To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.

Abstract translation: 本发明提供一种电子部件，该电子部件在无机材料基板上具有铜电极，该基板与铜电极之间的密合强度高，能够提高铜电极的密合性。 以及该电子部件的制造方法。 一种电子部件，在无机材料基板上具有铜电极，在基板和铜电极的界面设置含有铜，锰，硅和氧的界面层，界面层含有主要形成的晶粒 的铜并分散在界面层中。 该电子部件的制造方法包括：界面层形成工序，在基板上形成界面层; 以及用于在界面层上形成铜电极的电极形成步骤。

公开(公告)号：EP1864750B1

公开(公告)日：2016-11-09

申请号：EP06730438.6

申请日：2006-03-29

Applicant: Koki Company Limited

Inventor： TANAKA, Norihito ,  SHIMAMURA, Yasuki

IPC: B23K35/26 ,  B23K35/30 ,  B22F1/00 ,  B23K35/14 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B22F1/0059 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  H05K2201/0272

公开(公告)号：EP1952934B1

公开(公告)日：2015-03-18

申请号：EP06832493.8

申请日：2006-11-10

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  Murata Manufacturing Co. Ltd.

Inventor： NAKANO, Kosuke ,  TAKAOKA, Hidekiyo ,  UESHIMA, Minoru

IPC: B23K35/14 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/362 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272

公开(公告)号：EP1837119B1

公开(公告)日：2015-02-11

申请号：EP05814212.6

申请日：2005-12-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： TAKAOKA, Hidekiyo ,  NAKANO, Kosuke

IPC: B23K35/22 ,  H05K3/34 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

公开(公告)号：EP2816089A1

公开(公告)日：2014-12-24

申请号：EP14172470.8

申请日：2014-06-16

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Hamada, Yoshitaka

IPC: C09D11/52 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01L21/288 ,  C08K3/08 ,  C08K2003/0806 ,  C09D11/03 ,  C09D11/52 ,  C09D183/04 ,  H01L23/58 ,  H01L2924/0002 ,  H05K1/09 ,  H05K1/095 ,  H05K3/12 ,  H05K3/1216 ,  H05K2201/0272 ,  H01L2924/00

Abstract: A conductive circuit is formed by printing a pattern of an ink composition and curing the pattern. The ink composition is a substantially solvent-free, liquid, addition curable, ink composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two SiH groups, (C) conductive particles having an average particle size ≥ 5 µm, (D) conductive micro-particles having an average particle size

Abstract translation: 的导体电路是通过印刷的油墨组合物的图案和固化所述图案形成。 的油墨组合物是平均具有一个基本上无溶剂的，液体，可加成固化的，油墨组合物包括（A）有机聚硅氧烷具有至少两个链烯基，（B）有机氢聚硅氧烷具有至少两个SiH基团，（C）导电性粒子 ‰具有平均粒度<5微米，（e）中的触变剂，和（F）氢化硅烷化催化剂¥5微米，（D）导电性微粒的粒径。

公开(公告)号：EP2647467A3

公开(公告)日：2014-04-02

申请号：EP13170700.2

申请日：2007-07-03

Applicant: Fuji Electric Holdings Co., Ltd. ,  NIHON HANDA CO., LTD.

Inventor： Yamashita, Mitsuo ,  Goto, Tomoaki ,  Asagi, Takeshi

IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34 ,  B23K1/00 ,  B23K101/42 ,  B23K35/02 ,  C22C1/04 ,  C22C12/00 ,  C22C28/00

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2201/36 ,  B23K2201/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

Abstract: The present invention aims at providing a high-temperature lead-free solder material which can form a solder joint of improved heat resistance and reliability, and is suitable for application to dual-temperature solder connection, and a method of soldering an electronic part. According to the invention a solder cream is obtained by kneading an Sn-Ag-Cu alloy with a flux, wherein the Sn-Ag-Cu alloy comprises a mixture of a first powder alloy containing 10 to 30% by weight of Ag and 2 to 20% by weight of Cu with a balance consisting of Sn and unavoidable impurities, and a second powder alloy containing smaller compositions (% by weight) of Ag and Cu than the first powder alloy, and having a melting point lower than that of the first powder alloy, the mixture containing a total of not more than 35% by weight of Ag and Cu.

公开(公告)号：EP1724050B1

公开(公告)日：2013-12-04

申请号：EP04718726.5

申请日：2004-03-09

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： TAKAURA, Kunihito ,  TSURUTA, Kaichi ,  KAWANAKAGO, Hiroshi ,  TAKAHASHI, Hiroshi

IPC: C22C13/00 ,  B23K35/26 ,  B23K35/02 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  C22C13/00 ,  H05K3/3463 ,  H05K2201/0272

公开(公告)号：EP2658357A1

公开(公告)日：2013-10-30

申请号：EP11851519.6

申请日：2011-12-06

Applicant: Panasonic Corporation ,  Kyoto Elex Co., Ltd.

Inventor： HIMORI, Tsuyoshi ,  HIRAI, Shogo ,  HIGUCHI, Takayuki ,  TOMEKAWA, Satoru ,  NAKAYAMA, Yutaka

IPC: H05K3/46 ,  H01B1/22 ,  H05K1/09

CPC classification number: H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2203/0425

Abstract: A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings, wherein: the via-hole conductors each include copper, tin, and bismuth, namely, a first metal region including a link of copper particles in plane-to-plane contact with one another, the link electrically connecting the wirings, a second metal region mainly composed of one or more of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region mainly composed of bismuth; at least a part of the second metal region is in contact with the surface of the copper particles, the surface excluding the area of the plane-to-plane contact portion of the link; and the Cu, Sn, and Bi in the metal portion are of a composition having a specific weight ratio (Cu:Sn:Bi).

Abstract translation: 具有通孔导体电连接的方式搜索布置布线的多个多层布线基板并在绝缘树脂层的布线，worin之间放置：所述通孔导体的每一个包括铜，锡和铋，即 包括铜粒子在平面至平面彼此接触，一个链路的第一金属区域，电连接所述布线链路，第二金属区域主要由一种或多种锡的，锡 - 铜合金，和锡的 - 铜金属间化合物，以及主要由铋的第三金属区域; 至少第二金属区域的一部分与所述铜粒子的表面接触，但不包括该链路的平面至平面接触部分的区域中的表面上; 和铜，锡，和Bi在金属部分是具有特定的重量比（铜：锡：Bi）的一种组合物的。

公开(公告)号：EP2555599A1

公开(公告)日：2013-02-06

申请号：EP11765641.3

申请日：2011-03-30

Applicant: Fujikura Co., Ltd.

Inventor： KOSHIMIZU, Kazutoshi

IPC: H05K1/09 ,  H01L23/12 ,  H05K3/12 ,  H05K3/28

CPC classification number: H01L23/4985 ,  C08F2222/1026 ,  C08K3/08 ,  C08K7/00 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/014 ,  C08K2201/016 ,  C09D4/00 ,  C09D11/52 ,  H01B1/22 ,  H01L21/4867 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4664 ,  H05K2201/0245 ,  H05K2201/0272 ,  H01L2924/00

Abstract: The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more.

Abstract translation: 本发明是一种具有绝缘基板和至少一个电路部分的膜布线板，所述电路部分设置在所述绝缘基板上并且通过用绝缘涂层涂覆由包含导电粒子的导电浆料形成的电路层而获得， 其中电路层含有凝胶分数为90％或更高的树脂组分。