VERFAHREN UND VORRICHTUNG FÜR THERMISCHES SPRITZVERFAHREN
    7.
    发明公开
    VERFAHREN UND VORRICHTUNG FÜR THERMISCHES SPRITZVERFAHREN 有权
    方法的热喷涂工艺

    公开(公告)号:EP2104748A2

    公开(公告)日:2009-09-30

    申请号:EP07856100.8

    申请日:2007-12-13

    摘要: The invention relates to a process for coating a substrate by means of a thermal spraying process, in which the deposited layer and also the substrate are cooled after the spray transit. According to the invention, defined cooling of the deposited layer and also the substrate takes place in such a way that the average temperature level in the layer/substrate composite is at least 200 K above ambient temperature. It is advantageous for a time of less than 100 ms, in particular less than 10 ms and in particular in the range from 0.1 to 5 ms, to elapse between the spray transit and the defined cooling of this deposited layer. The increased temperature level associated with the defined cooling after application makes it possible, by means of this process, firstly to produce thin, gastight layers having a thickness of 100 µm) having a high segmentation crack density.