-
公开(公告)号：EP0803329A2
公开(公告)日：1997-10-29
申请号：EP97302667.7
申请日：1997-04-18
发明人： Kudo, Michio, c/o Fujikoshi Kikai Kogyo K.K. , Inada, Yasuo, c/o Fujikoshi Kikai Kogyo K.K. , Nakajima, Makoto, Fujikoshi Kikai Kogyo K.K. , Fukushima, Masanori, Fujikoschi Kikai Kogyo K.K.
IPC分类号： B24B37/04
CPC分类号： B24B37/105 , B24B47/10
摘要： A polishing machine of the present invention is capable of uniformly polishing a member (20) to be polished with high flatness, and polishing cloth, which is employed in the polishing machine, can be uniformly abraded. In the polishing machine, a polishing plate (10) is capable of rotating. A supporting table (22) rotatably supports the polishing plate (10). A rotary driving mechanism (25) is mounted on the supporting table (22), and it (25) rotates the polishing plate (10). A base (30) supports the supporting table (22). An orbital driving mechanism (32) moves the supporting table (22) along a circular orbit without spinning about its own axis.
摘要翻译： 本发明的抛光机能够以高的平坦度均匀地抛光要被抛光的构件（20），并且可以均匀地研磨抛光机中使用的抛光布。 在抛光机中，抛光板（10）能够旋转。 支撑台（22）可旋转地支撑抛光板（10）。 旋转驱动机构（25）安装在支撑台（22）上，并且它（25）旋转抛光板（10）。 底座（30）支撑支撑台（22）。 轨道驱动机构（32）使支撑台（22）沿着圆形轨道移动，而不绕其自身轴线旋转。
-
公开(公告)号：EP0803328A1
公开(公告)日：1997-10-29
申请号：EP97302603.2
申请日：1997-04-16
发明人： Nakajima, Makoto, Fujikoshi Kikai Kogyo K.K. , Nakamura, Yoshio, Fujikoshi Kikai Kogyo K.K. , Denda, Yasuhide, Fujikoshi Kikai Kogyo K.K. , Yanagisawa, Toshihisa, Fujikoshi Kikai Kogyo K.K. , Seki, Toshiaki, Fujikoshi Kikai Kogyo K.K. , Arakawa, Satoru, Fujikoshi Kikai Kogyo K.K. , Takeuchi, Masahiro, Fujikoshi Kikai Kogyo K.K. , Ogawa, Mitsue, Fujikoshi Kikai Kogyo K.K. , Fukushima, Masanori, Fujikoshi Kikai Kogyo K.K.
CPC分类号： B24B37/345 , B23Q41/04
摘要： In the polishing system of the present invention, a sticking unit (15) sticks the wafer (11) on a carrying plate (12) by liquid. A polishing unit (50) polishes the wafer (11) by a polishing plate. A feeding unit (51) conveys the carrying plate (12) from the sticking unit (15) to the polishing unit (50). A peeling unit (71) peels off the wafer (11) from the carrying plate (12). A first discharging unit (63) conveys the carrying plate (12) from the polishing unit (50) to the peeling unit (71). A cleaning unit (77) cleans the vacant carrying plate (12). A second discharging unit conveys the carrying plate (12) from the peeling unit (71) to the cleaning unit (77). A third discharging unit (81) conveys the carrying plate (12) from the cleaning unit (77) to the sticking unit (77). The units are formed into a loop line, so that the carrying plate (12) is circulated in the loop line and the wafers (11) are polished therein.
摘要翻译： 在本发明的抛光系统中，粘贴单元（15）通过液体将晶片（11）粘在载板（12）上。 抛光单元（50）通过抛光板抛光晶片（11）。 馈送单元（51）将携带板（12）从粘贴单元（15）传送到抛光单元（50）。 剥离单元（71）从承载板（12）剥离晶片（11）。 第一排出单元（63）将承载板（12）从抛光单元（50）传送到剥离单元（71）。 清洁单元（77）清洁空载板（12）。 第二排出单元将承载板（12）从剥离单元（71）传送到清洁单元（77）。 第三排出单元（81）将承载板（12）从清洁单元（77）传送到粘贴单元（77）。 这些单元形成为环线，使得承载板（12）在环线中循环，并且晶片（11）在其中被抛光。
-
公开(公告)号：EP0803329B1
公开(公告)日：2002-03-27
申请号：EP97302667.7
申请日：1997-04-18
发明人： Kudo, Michio, c/o Fujikoshi Kikai Kogyo K.K. , Inada, Yasuo, c/o Fujikoshi Kikai Kogyo K.K. , Nakajima, Makoto, Fujikoshi Kikai Kogyo K.K. , Fukushima, Masanori, Fujikoschi Kikai Kogyo K.K.
CPC分类号： B24B37/105 , B24B47/10
-
公开(公告)号：EP0803328B1
公开(公告)日：2001-11-21
申请号：EP97302603.2
申请日：1997-04-16
发明人： Nakajima, Makoto, Fujikoshi Kikai Kogyo K.K. , Nakamura, Yoshio, Fujikoshi Kikai Kogyo K.K. , Denda, Yasuhide, Fujikoshi Kikai Kogyo K.K. , Yanagisawa, Toshihisa, Fujikoshi Kikai Kogyo K.K. , Seki, Toshiaki, Fujikoshi Kikai Kogyo K.K. , Arakawa, Satoru, Fujikoshi Kikai Kogyo K.K. , Takeuchi, Masahiro, Fujikoshi Kikai Kogyo K.K. , Ogawa, Mitsue, Fujikoshi Kikai Kogyo K.K. , Fukushima, Masanori, Fujikoshi Kikai Kogyo K.K.
CPC分类号： B24B37/345 , B23Q41/04
-
公开(公告)号：EP0803329A3
公开(公告)日：1998-04-15
申请号：EP97302667.7
申请日：1997-04-18
发明人： Kudo, Michio, c/o Fujikoshi Kikai Kogyo K.K. , Inada, Yasuo, c/o Fujikoshi Kikai Kogyo K.K. , Nakajima, Makoto, Fujikoshi Kikai Kogyo K.K. , Fukushima, Masanori, Fujikoschi Kikai Kogyo K.K.
IPC分类号： B24B37/04
CPC分类号： B24B37/105 , B24B47/10
摘要： A polishing machine of the present invention is capable of uniformly polishing a member (20) to be polished with high flatness, and polishing cloth, which is employed in the polishing machine, can be uniformly abraded. In the polishing machine, a polishing plate (10) is capable of rotating. A supporting table (22) rotatably supports the polishing plate (10). A rotary driving mechanism (25) is mounted on the supporting table (22), and it (25) rotates the polishing plate (10). A base (30) supports the supporting table (22). An orbital driving mechanism (32) moves the supporting table (22) along a circular orbit without spinning about its own axis.
-
-
-
-
搜索结果
5 条记录 (耗时 0.009 秒)
