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13 条记录 (耗时 0.01 秒)

    Abrasive machine
    1.
    发明公开
    Abrasive machine 审中-公开
    Schleifmaschine

    公开(公告)号：EP1029632A3

    公开(公告)日：2002-12-04

    申请号：EP00301129.3

    申请日：2000-02-15

    申请人： Fujikoshi Kikai Kogyo Kabushiki Kaisha

    发明人： Nakamura, Yoshio, c/o Fujikoshi Kikai Kogyo K.K. ,  Fujii, Kanji, c/o Fujikoshi Kikai Kogyo K.K.

    IPC分类号： B24B37/04 ,  B24B41/06 ,  H01L21/306

    CPC分类号： B24B37/30 ,  B24B41/06 ,  H01L21/30625

    摘要： An abrasive machine is capable of solving the liquation of metal ions, and improving abrading accuracy. In the abrasive machine, an abrasive plate 52 has an abrasive face 50 capable of abrading a wafer 20. A holding section 10 includes: a head member 12 located above the abrasive face 50; a holding plate 16 provided between the head member 12 and the abrasive face 50, the holding plate 16 having a holding face 17 capable of holding the wafer 20; and a bellows 24 fixed between the holding plate 16 and the head member 12, the bellows 24 allowing the holding plate 16 to move close to and away from and incline with respect to the head member 12, the bellows 24 forming a pressure chamber 26. Pressing means 28 presses the wafer 20 onto the abrasive face 50, with the holding plate 16, by pressurizing the pressure chamber 26. The bellows 24 is made by cutting a block of plastic without forming seams.

    摘要翻译： 研磨机能够解决金属离子的液化，提高研磨精度。 在研磨机中，研磨板52具有能够研磨晶片20的研磨面50.保持部10包括：位于研磨面50上方的头部构件12; 设置在头部构件12和研磨面50之间的保持板16，保持板16具有能够保持晶片20的保持面17; 以及固定在保持板16和头部构件12之间的波纹管24，波纹管24允许保持板16相对于头部构件12移动靠近和远离并且倾斜，波纹管24形成压力室26。 按压装置28通过对压力室26加压，将晶片20与保持板16按压在研磨面50上。波纹管24通过切割一块塑料而不形成接缝而制成。

    Polishing machine
    2.
    发明公开
    Polishing machine 失效
    抛光机

    公开(公告)号：EP0940221A3

    公开(公告)日：2002-06-12

    申请号：EP98305766.2

    申请日：1998-07-20

    申请人： Fujikoshi Kikai Kogyo Kabushiki Kaisha

    发明人： Kotagiri, Fuminari ,  Nakamura, Yoshio ,  Denda, Yasuhide ,  Sumizawa, Haruo ,  Kajikura, Atsushi ,  Kanda, Satoki

    IPC分类号： B24B37/04 ,  B24B41/06

    CPC分类号： B24B37/08 ,  B24B41/067 ,  B24B47/04

    摘要： The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier (12) is formed into a thin plate having a through-hole (12a) in which a work piece (10) is accommodated. An upper polishing plate (14) polishes an upper face of the work piece (10). A lower polishing plate (16) pinches the work piece (10) with the upper polishing plate (14) and polishes a lower face of the work piece (10). A driving mechanism (20) moves the carrier (12) along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece (10), which has been pinched between the polishing plates (14, 16), are polished by the polishing plates (14, 16).

    摘要翻译： 本发明的抛光机能够改善工件的平整度。 在抛光机中，载体（12）形成为具有容纳工件（10）的通孔（12a）的薄板。 上抛光板（14）抛光工件（10）的上表面。 下抛光板（16）用上抛光板（14）夹紧工件（10）并抛光工件（10）的下表面。 驱动机构（20）使载体（12）沿平面上的圆形轨道运动而不旋转。 利用这种结构，被抛光板（14,16）夹住的工件（10）的上下表面被抛光板（14,16）抛光。

    Polishing machine
    3.
    发明公开
    Polishing machine 失效
    抛光机

    公开(公告)号：EP0803329A2

    公开(公告)日：1997-10-29

    申请号：EP97302667.7

    申请日：1997-04-18

    申请人： Fujikoshi Kikai Kogyo Kabushiki Kaisha

    发明人： Kudo, Michio, c/o Fujikoshi Kikai Kogyo K.K. ,  Inada, Yasuo, c/o Fujikoshi Kikai Kogyo K.K. ,  Nakajima, Makoto, Fujikoshi Kikai Kogyo K.K. ,  Fukushima, Masanori, Fujikoschi Kikai Kogyo K.K.

    IPC分类号： B24B37/04

    CPC分类号： B24B37/105 ,  B24B47/10

    摘要： A polishing machine of the present invention is capable of uniformly polishing a member (20) to be polished with high flatness, and polishing cloth, which is employed in the polishing machine, can be uniformly abraded. In the polishing machine, a polishing plate (10) is capable of rotating. A supporting table (22) rotatably supports the polishing plate (10). A rotary driving mechanism (25) is mounted on the supporting table (22), and it (25) rotates the polishing plate (10). A base (30) supports the supporting table (22). An orbital driving mechanism (32) moves the supporting table (22) along a circular orbit without spinning about its own axis.

    摘要翻译： 本发明的抛光机能够以高的平坦度均匀地抛光要被抛光的构件（20），并且可以均匀地研磨抛光机中使用的抛光布。 在抛光机中，抛光板（10）能够旋转。 支撑台（22）可旋转地支撑抛光板（10）。 旋转驱动机构（25）安装在支撑台（22）上，并且它（25）旋转抛光板（10）。 底座（30）支撑支撑台（22）。 轨道驱动机构（32）使支撑台（22）沿着圆形轨道移动，而不绕其自身轴线旋转。

    Abrasive machine
    4.
    发明公开
    Abrasive machine 审中-公开
    磨料机

    公开(公告)号：EP1029632A2

    公开(公告)日：2000-08-23

    申请号：EP00301129.3

    申请日：2000-02-15

    申请人： Fujikoshi Kikai Kogyo Kabushiki Kaisha

    发明人： Nakamura, Yoshio, c/o Fujikoshi Kikai Kogyo K.K. ,  Fujii, Kanji, c/o Fujikoshi Kikai Kogyo K.K.

    IPC分类号： B24B37/04 ,  B24B41/06 ,  H01L21/306

    CPC分类号： B24B37/30 ,  B24B41/06 ,  H01L21/30625

    摘要： An abrasive machine is capable of solving the liquation of metal ions, and improving abrading accuracy. In the abrasive machine, an abrasive plate 52 has an abrasive face 50 capable of abrading a wafer 20. A holding section 10 includes: a head member 12 located above the abrasive face 50; a holding plate 16 provided between the head member 12 and the abrasive face 50, the holding plate 16 having a holding face 17 capable of holding the wafer 20; and a bellows 24 fixed between the holding plate 16 and the head member 12, the bellows 24 allowing the holding plate 16 to move close to and away from and incline with respect to the head member 12, the bellows 24 forming a pressure chamber 26. Pressing means 28 presses the wafer 20 onto the abrasive face 50, with the holding plate 16, by pressurizing the pressure chamber 26. The bellows 24 is made by cutting a block of plastic without forming seams.

    摘要翻译： 研磨机能够解决金属离子的液化，并提高研磨精度。 在研磨机中，研磨板52具有能够研磨晶片20的研磨面50.保持部10包括：位于研磨面50上方的头部件12; 设置在头部件12与研磨面50之间的保持板16，保持板16具有能够保持晶片20的保持面17; 以及固定在保持板16和头部件12之间的波纹管24，波纹管24允许保持板16相对于头部件12靠近和远离并且相对于头部件12倾斜，波纹管24形成压力室26。 压力装置28通过压力室26将晶片20与保持板16一起压到研磨面50上。波纹管24通过切割一块塑料而不形成接缝而制成。

    Double side polishing device
    8.
    发明公开
    Double side polishing device 有权
    Doppelseitenpoliermaschine

    公开(公告)号：EP1044765A3

    公开(公告)日：2003-03-26

    申请号：EP00303063.2

    申请日：2000-04-12

    申请人： Fujikoshi Kikai Kogyo Kabushiki Kaisha

    发明人： Inada, Yasuo, Fujikoshi Kikai Kogyo K.K.

    IPC分类号： B24B7/17 ,  B24B37/04 ,  B24B41/06 ,  H01L21/00 ,  H01L21/304 ,  B24B49/12

    CPC分类号： B24B37/08 ,  B24B37/345 ,  B24B49/12

    摘要： The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces (10). In the abrasive system, an upper abrasive plate (14) and a lower abrasive plate (16) pinch the work pieces (10), which are provided in through-holes (12a) of a carrier (12) and abrade both faces of each work piece (10). A carrier driving mechanism (20) moves the carrier (12), along a circular orbit, without spinning, together with the work pieces (10). Stopping means (43) stops the movement of the carrier (12) at a predetermined position. The feeding-and-discharging means (50) includes: an arm robot (54, 90) having a work holding unit (52), which is provided to a front end and capable of holding and releasing the work piece (10); and an image processing unit (55) for recognizing shapes and positions of the through-holes (12a) of the carrier (12) and the work pieces (10).

    摘要翻译： 本发明的磨料系统能够自动且有效地进给和排出工件（10）。 在研磨系统中，上磨料板（14）和下研磨板（16）夹紧设置在载体（12）的通孔（12a）中的工件（10），并研磨每个 工件（10）。 载体驱动机构（20）与工件（10）一起沿着圆形轨道移动载体（12）而不旋转。 停止装置（43）停止载体（12）在预定位置的移动。 送料装置（50）包括：具有工件保持单元（52）的臂机器人（54,90），其设置在前端并能够保持和释放工件（10）; 以及用于识别载体（12）和工件（10）的通孔（12a）的形状和位置的图像处理单元（55）。

    Polishing machine
    10.
    发明公开
    Polishing machine 失效
    Poliermaschine

    公开(公告)号：EP0940221A2

    公开(公告)日：1999-09-08

    申请号：EP98305766.2

    申请日：1998-07-20

    申请人： Fujikoshi Kikai Kogyo Kabushiki Kaisha

    发明人： Kotagiri, Fuminari ,  Nakamura, Yoshio ,  Denda, Yasuhide ,  Sumizawa, Haruo ,  Kajikura, Atsushi ,  Kanda, Satoki

    IPC分类号： B24B37/04 ,  B24B41/06

    CPC分类号： B24B37/08 ,  B24B41/067 ,  B24B47/04

    摘要： The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier (12) is formed into a thin plate having a through-hole (12a) in which a work piece (10) is accommodated. An upper polishing plate (14) polishes an upper face of the work piece (10). A lower polishing plate (16) pinches the work piece (10) with the upper polishing plate (14) and polishes a lower face of the work piece (10). A driving mechanism (20) moves the carrier (12) along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece (10), which has been pinched between the polishing plates (14, 16), are polished by the polishing plates (14, 16).

    摘要翻译： 本发明的研磨机能够提高工件的平坦度。 在抛光机中，载体（12）形成为具有容纳工件（10）的通孔（12a）的薄板。 上抛光板（14）抛光工件（10）的上表面。 下抛光板（16）用上抛光板（14）夹住工件（10）并抛光工件（10）的下表面。 驱动机构（20）使载体（12）沿着圆形轨道在平面内不旋转地移动。 利用这种结构，被抛光板（14,16）之间的工件（10）的上表面和下表面被抛光板（14,16）抛光。