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    COPPER ALLOY SHEET MATERIAL HAVING LOW YOUNG'S MODULUS AND METHOD FOR PRODUCING SAME
    3.
    发明公开
    COPPER ALLOY SHEET MATERIAL HAVING LOW YOUNG'S MODULUS AND METHOD FOR PRODUCING SAME 有权
    VERFAHREN ZUR HERSTELLUNG EINER KUPFERLEGIERUNGS - FOLIENMATERIAL MIT GERINGEM YOUNG-MODULUS

    公开(公告)号：EP2508634A1

    公开(公告)日：2012-10-10

    申请号：EP10834584.4

    申请日：2010-12-01

    Applicant: Furukawa Electric Co., Ltd.

    Inventor： SATO, Koji ,  KANEKO, Hiroshi ,  EGUCHI, Tatsuhiko

    IPC: C22C9/06 ,  B21B3/00 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  H01B13/00 ,  C22F1/00

    CPC classification number: C22C9/06 ,  B21B2003/005 ,  C22C9/10 ,  C22F1/08 ,  H01B1/026

    Abstract: {Problems} To provide a copper alloy material, having a low Young's modulus that is required of electrical or electronic parts, such as connectors.
    {Means to solve} A copper alloy sheet material for electrical or electronic parts, having an alloy composition containing any one or both of Ni and Co in an amount of 0.5 to 5.0 mass% in total, and Si in an amount of 0.2 to 1.5 mass%, with the balance being Cu and inevitable impurities, wherein the copper alloy sheet material has a 0.2% proof stress in the rolling direction of 500 MPa or more, an electrical conductivity of 30 %IACS or more, a Young's modulus of 110 GPa or less, and a factor of bending deflection of 105 GPa or less.

    Abstract translation: {问题}提供一种铜合金材料，其具有诸如连接器等电气或电子部件所需的低杨氏模量。 {解决方案}一种用于电气或电子部件的铜合金板材，其合金组成含有总量为0.5-5.0质量％的Ni和Co中的一种或两种，Si为0.2-1.5 质量％，余量为Cu和不可避免的杂质，其中铜合金板材在轧制方向上具有0.2％的屈服应力为500MPa以上，电导率为30％IACS以上，杨氏模量为110GPa 或更小，弯曲偏转系数为105GPa以下。

    COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT
    4.
    发明公开
    COPPER ALLOY MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT 审中-公开
    VERFAHREN ZUR HERSTELLUNG VON KUPFERLEGIERUNGSMATERIALFÜRELEKTRISCHE / ELEKTRONISCHE BAUTEILE

    公开(公告)号：EP2333128A1

    公开(公告)日：2011-06-15

    申请号：EP09804913.3

    申请日：2009-07-30

    Applicant: The Furukawa Electric Co., Ltd.

    Inventor： MIHARA, Kuniteru ,  MATSUO, Ryosuke ,  EGUCHI, Tatsuhiko

    IPC: C22C9/06 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  C22F1/00

    CPC classification number: C22C9/06 ,  C22F1/08 ,  H01B1/026

    Abstract: A copper alloy material for electrical/electronic components containing Co and Si as additional elements, wherein a compound A composed of Co and Si and having an average particle diameter of not less than 5 nm but less than 50 nm is dispersed, and at least one compound selected from the group consisting of a compound B containing one or neither of Co and Si and having an average particle diameter of not less than 50 nm but not more than 500 nm, a compound C containing both of Co and Si and an additional element and having an average particle diameter of not less than 50 nm but not more than 500 nm, and a compound D composed of Co and Si and having an average particle diameter of not less than 50 nm but not more than 500 nm, is also dispersed. The copper alloy material for electrical/electronic components is also characterized in that the matrix copper alloy has a crystal grain size of 3-35 [mu]m, and that the copper alloy material has a conductivity of not less than 50% IACS.

    Abstract translation: 一种含有Co和Si作为附加元素的电气/电子部件用铜合金材料，其中由Co和Si组成的平均粒径不小于5nm但小于50nm的化合物A被分散，并且至少一个 选自由含有Co和Si中的一种或两种但平均粒径不小于50nm但不大于500nm的化合物B的化合物，包含Co和Si两者的化合物C和另外的元素 平均粒径为50nm以上且500nm以下，平均粒径为50nm以上且500nm以下的Co和Si构成的化合物D也分散 。 用于电气/电子部件的铜合金材料的特征还在于基体铜合金的晶粒尺寸为3-35μm，铜合金材料具有不小于50％IACS的电导率。

    COPPER ALLOY
    5.
    发明公开
    COPPER ALLOY 有权
    KUPFERLEGIERUNG

    公开(公告)号：EP1873266A1

    公开(公告)日：2008-01-02

    申请号：EP06728554.4

    申请日：2006-02-28

    Applicant: The Furukawa Electric Co., Ltd.

    Inventor： MIHARA, Kuniteru ,  TANAKA, Nobuyuki ,  EGUCHI, Tatsuhiko ,  HIROSE, Kiyoshige

    IPC: C22C9/06 ,  C22F1/00 ,  C22F1/08

    CPC classification number: C22C9/06

    Abstract: A copper alloy, containing: Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, with a balance being Cu and inevitable impurities; the copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 µm.

    Abstract translation: 含有Ni和/或Si以及B，Al，As，Hf，Zr，Cr，Ti，C，Fe，P，In，Sb，Mn，Ta，V，S中的至少一种以上的铜合金 ，O，N，杂质金属（MM），Co和Be，余量为Cu和不可避免的杂质; 该铜合金具有由Ni和Si构成的析出物X; 以及由Ni和/或Si构成的析出物Y，以及B，Al，As，Hf，Zr，Cr，Ti，C，Fe，P，In，Sb，Mn，Ta，V，S中的至少一种以上 ，O，N，杂质金属（MM），Co和Be，其中沉淀物Y的粒径为0.01〜2μ​​m。

    COPPER ALLOY SHEET MATERIAL AND PROCESS FOR PRODUCING SAME
    8.
    发明公开
    COPPER ALLOY SHEET MATERIAL AND PROCESS FOR PRODUCING SAME 审中-公开
    哈佛大学医学学士学位论文

    公开(公告)号：EP2612934A1

    公开(公告)日：2013-07-10

    申请号：EP11821733.0

    申请日：2011-08-29

    Applicant: Furukawa Electric Co., Ltd.

    Inventor： ISOMATSU, Takemi ,  EGUCHI, Tatsuhiko ,  KANEKO, Hiroshi

    IPC: C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08

    CPC classification number: C22F1/08 ,  C22C9/00

    Abstract: {Problems} To provide a copper alloy sheet material and a method of producing the same, which sheet material is excellent in a bending property, and has an excellent mechanical strength, and which is suitable for lead frames, connectors, terminal materials, and the like in electrical/electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like.
    {Means to solve} A copper alloy sheet material, containing Ti in an amount of 1.0 to 5.0 mass%, with the balance being copper and unavoidable impurities, wherein an area ratio of Cube orientation {0 0 1} is 5 to 50%, in crystal orientation analysis by an EBSD analysis in the sheet thickness of the sheet material; and a method of producing the same.

    Abstract translation: {问题}为了提供铜合金板材及其制造方法，该片材具有优异的弯曲性能，并且具有优异的机械强度，并且适用于引线框架，连接器，端子材料和 例如在电气/电子设备中，用于连接器，例如安装在机动车辆上，以及用于端子材料，继电器，开关等。 {解决方案}一种铜合金板材，其含有1.0〜5.0质量％的Ti，余量为铜和不可避免的杂质，其中立方取向{0 0 1} <1 0 0的面积比为 5〜50％，通过EBSD分析在片材厚度的晶体取向分析; 及其制造方法。

    COPPER ALLOY MATERIAL, ELECTRIC AND ELECTRONIC PARTS, AND COPPER ALLOY MATERIAL MANUFACTURING METHOD
    10.
    发明公开
    COPPER ALLOY MATERIAL, ELECTRIC AND ELECTRONIC PARTS, AND COPPER ALLOY MATERIAL MANUFACTURING METHOD 有权
    铜合金板，电子电器元件和方法的铜合金板

    公开(公告)号：EP2351862A1

    公开(公告)日：2011-08-03

    申请号：EP09822070.0

    申请日：2009-10-22

    Applicant: Furukawa Electric Co., Ltd.

    Inventor： KANEKO, Hiroshi ,  HIROSE, Kiyoshige ,  EGUCHI, Tatsuhiko

    IPC: C22C9/06 ,  C22C9/00 ,  C22C9/01 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/10 ,  C22F1/08 ,  H01B1/02 ,  C22F1/00

    CPC classification number: H01B1/026 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01B13/0016

    Abstract: A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass% in total, and Si in an amount of 0.1 to 1.5 mass%, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1} is within 30° is 60% or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.

    Abstract translation: 一种铜合金材料，其具有上的合金组合物中所含有的从总计0.4〜5.0质量％的量的任何一者或两者的Ni和Co的，和Si中的杂质在按质量计的0.1〜1.5％的量，余量为铜和不可避免的 ，worin在取向的角度中哪晶粒的面积的比率从S取向偏离{231} <3 4 6>是于30°为60％或更多，雅鼎在EBSD测量中的结晶取向分析; 在通过加工铜合金材料形成的电或电子部件; 和制造铜合金材料的制造方法。

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