COPPER ALLOY SHEET AND METHOD FOR PRODUCING SAME
    1.
    发明公开
    COPPER ALLOY SHEET AND METHOD FOR PRODUCING SAME 审中-公开
    KUPFERLEGIERUNGSBLECH UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号:EP2610359A1

    公开(公告)日:2013-07-03

    申请号:EP11820070.8

    申请日:2011-08-29

    摘要: {Problems} To provide a copper alloy sheet material, excellent in bending property and mechanical strength, and suitable for lead frames, connectors, terminal materials, and the like in electrical/electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like; and to provide a method of producing the same.
    {Means to solve} A copper alloy sheet material, containing at least one of Cr, Zr, and Ti in an amount of 0.05 to 1.0 mass% in total, with the balance being copper and unavoidable impurities, wherein an area ratio of Cube orientation {0 0 1} is 5% or more and 70% or less, in crystal orientation analysis by an EBSD analysis, and wherein a Vickers hardness is 120 or more; and a method of producing the same.

    摘要翻译: {问题}提供弯曲性能和机械强度优异的铜合金板材,适用于电气/电子设备中的引线框架,连接器,端子材料等,用于连接器,例如安装在汽车上 车辆,以及终端材料,继电器,开关等; 并提供其制备方法。 {解决方案}一种铜合金板材,其含有总量为0.05〜1.0质量%的Cr,Zr和Ti中的至少一种,余量为铜和不可避免的杂质,其中立方体取向 在通过EBSD分析的晶体取向分析中,{0 0 1} <1 0 0>为5%以上且70%以下,维氏硬度为120以上。 及其制造方法。

    COPPER ALLOY SHEET MATERIAL AND PROCESS FOR PRODUCING SAME
    3.
    发明公开
    COPPER ALLOY SHEET MATERIAL AND PROCESS FOR PRODUCING SAME 审中-公开
    哈佛大学医学学士学位论文

    公开(公告)号:EP2706125A1

    公开(公告)日:2014-03-12

    申请号:EP12779988.0

    申请日:2012-04-27

    摘要: {Problems} To provide a copper alloy sheet material, which is excellent in the bending property, which has an excellent mechanical strength, which is less in anisotropy in those characteristics in the parallel direction to rolling and the perpendicular direction to rolling, and which is suitable for lead frames, connectors, terminal materials, and the like in electrical or electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like.
    {Means to solve} A copper alloy sheet material, having a composition containing Ni in an amount of 1.0 mass% to 5.0 mass%, and Si in an amount of 0.1 mass% to 2.0 mass%, with the balance being copper and unavoidable impurities, wherein, in a crystal orientation analysis by an electron backscatter diffraction method, an area ratio of grains having an orientation in which a deviation from the Cube orientation {0 0 1} is within 15° is 5% to 50%, and 40 to 100 grains having the orientation in which the deviation from the Cube orientation {0 0 1} is within 15° are dispersed within 60 µm square; and a method of producing the same.

    摘要翻译: {问题}为了提供弯曲性优异的铜合金板材,其具有优异的机械强度,在轧制平行方向和垂直轧制方向上的那些特性中的各向异性较小,并且其是 适用于电气或电子设备中的引线框架,连接器,端子材料等,用于连接器,例如安装在机动车辆上,以及端子材料,继电器,开关等。 {解决方案}具有含有1.0质量%至5.0质量%的Ni的组成和0.1质量%至2.0质量%的Si的组成的铜合金板材,余量为铜和不可避免的杂质 其中,在通过电子反向散射衍射法的晶体取向分析中,具有与立方体取向{0 1} <10 0>的偏差在15°以内的取向的晶粒的面积比为5〜50 %和40至100个具有与立方体取向{0 1} <10 0>的偏离在15°以内的取向的晶粒分散在60μm正方形内; 及其制造方法。

    COPPER ALLOY SHEET AND PROCESS FOR PRODUCING SAME
    4.
    发明公开
    COPPER ALLOY SHEET AND PROCESS FOR PRODUCING SAME 审中-公开
    KUPFERLEGIERUNGSFOLIE UND HERSTELLUNGSVERFAHRENDAFÜR

    公开(公告)号:EP2508633A1

    公开(公告)日:2012-10-10

    申请号:EP10834576.0

    申请日:2010-12-01

    摘要: {Problems} To provide a copper alloy sheet material, which is excellent in the bending property, and has an excellent mechanical strength, and which is thus suitable for lead frames, connectors, terminal materials, and the like, for electrical/electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like; and to provide a production method of the same.
    {Means to solve} A copper alloy sheet material, wherein, in crystal orientation analysis by an EBSD (electron back scatter diffraction) analysis, in connection with accumulation of atomic planes oriented toward the transverse direction (TD) of a rolled sheet, an area ratio of a region having atomic planes in which the angle formed by the normal direction of (1 1 1) plane and the TD is 20° or less, is 50% or less, a proof stress is 500 MPa or greater, and an electrical conductivity is 30 %IACS or higher; and a production method of the same.

    摘要翻译: {问题}为了提供弯曲性优异,机械强度优异的铜合金板材,适用于电气电子设备的引线框架,连接器,端子材料等, 用于连接器,例如安装在机动车辆上,以及用于端子材料,继电器,开关等; 并提供其制备方法。 {解决手段}铜合金板材,其中,在通过EBSD(电子背散射衍射)分析进行的结晶取向分析中,与向轧制板的横向(TD)取向的原子面的积聚相关联, (111)面和TD所成的角度为20°以下的具有原子面的区域的比例为50%以下,耐应力为500MPa以上, 电导率为30%IACS以上; 及其制造方法。

    COPPER ALLOY SHEET
    5.
    发明公开
    COPPER ALLOY SHEET 有权
    KUPFERLEGIERUNGSFOLIE

    公开(公告)号:EP2508632A1

    公开(公告)日:2012-10-10

    申请号:EP10834574.5

    申请日:2010-12-01

    CPC分类号: C22F1/08 H01B1/026

    摘要: {Problems} To provide a Corson-based copper alloy sheet material which satisfies characteristics required of terminals and connectors, such as mechanical strength and bending property.
    {Means to solve} A copper alloy sheet material for electrical or electronic parts, which is composed of a copper alloy composition containing, in terms of mass%, any one or both of Ni or Co in an amount of 0.8 to 5%, and Si in an amount of 0.2 to 1.5%, with the balance being Cu and inevitable impurities, wherein an area ratio of grains having a deviation angle of less than 15° from the Cube orientation is controlled to less than 10%, and an area ratio of grains having a deviation angle of 15° to 30° from the Cube orientation is controlled to 15% or greater, and wherein the copper alloy sheet material has excellent mechanical strength and bending property.

    摘要翻译: {问题}提供满足诸如机械强度和弯曲性能的端子和连接器所要求的特性的科森基铜合金板材。 {解决方案}一种电气电子部件用铜合金板材,其由铜合金组合物构成,所述铜合金组合物以质量%计含有0.8〜5%的Ni或Co中的任一种或两者,以及 Si的量为0.2〜1.5%,余量为Cu和不可避免的杂质,其中具有小于10°的偏离角小于15°的晶粒的面积比控制在小于10%,面积比 从Cube方向偏离角度为15°〜30°的晶粒被控制在15%以上,其中铜合金板材具有优异的机械强度和弯曲性能。

    COPPER ALLOY SHEET AND PROCESS FOR PRODUCING SAME
    9.
    发明公开
    COPPER ALLOY SHEET AND PROCESS FOR PRODUCING SAME 有权
    铜合金板材及其生产方法

    公开(公告)号:EP2508635A1

    公开(公告)日:2012-10-10

    申请号:EP10834585.1

    申请日:2010-12-01

    CPC分类号: C22C9/06 C22F1/08 H01B1/026

    摘要: {Problems} To provide a copper alloy sheet material, which is excellent in the bending property, and has an excellent mechanical strength, and which is thus suitable for lead frames, connectors, terminal materials, and the like, for electrical/electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like; and to provide a production method of the same.
    {Means to solve} A copper alloy sheet material, having an R value of 1 or greater, which is defined by: R = BR + RDW + W / C + S + B
    wherein [BR], [RDW], [W], [C], [S], and [B] represent an area ratio of crystal texture orientation component of BR orientation {3 6 2} , RD-rotated-cube orientation {0 1 2} , cube orientation {1 0 0} , copper orientation {1 2 1} , S-orientation {2 3 1} , and brass orientation {1 1 0} , respectively, in crystal orientation analysis in an EBSD (electron back scatter diffraction) analysis, and having a proof stress of 500 MPa or greater, and an electrical conductivity of 30%IACS or higher; and a production method of the same.

    摘要翻译: 发明内容发明要解决的问题为了提供弯曲性优异且机械强度优异,适用于电气电子设备用引线框,连接器,端子材料等的铜合金板材, 用于连接器,例如安装在汽车上,用于终端材料,继电器,开关等; 并提供其制造方法。 {解决手段}一种R值为1以上的铜合金板材,其特征在于:R = BR + RDW + W / C + S + B其中[BR],[RDW],[W] ,[C],[S]和[B]表示BR取向{3 6 2} <8 5 3>,RD旋转立方体取向{0 1 2} <1 0的晶体织构取向分量的面积比 0>,立方体取向{1 0 0} <0 0 1>,铜取向{1 2 1} <1 1 1>,S取向{2 3 1} <3 4 6>和黄铜取向{1 1 0 在EBSD(电子背散射衍射)分析中的晶体取向分析中,分别具有500MPa或更高的屈服应力和30%IACS或更高的电导率; 及其制造方法。

    COPPER ALLOY SHEET MATERIAL, CONNECTOR USING SAME, AND COPPER ALLOY SHEET MATERIAL PRODUCTION METHOD FOR PRODUCING SAME
    10.
    发明公开
    COPPER ALLOY SHEET MATERIAL, CONNECTOR USING SAME, AND COPPER ALLOY SHEET MATERIAL PRODUCTION METHOD FOR PRODUCING SAME 审中-公开
    薄膜材料铜合金连接器订单,并产生箔片材料铜合金方法

    公开(公告)号:EP2508631A1

    公开(公告)日:2012-10-10

    申请号:EP10834571.1

    申请日:2010-12-01

    CPC分类号: C22C9/06 C22F1/08

    摘要: {Problems} To provide a copper alloy sheet material, which is excellent in the bending property, has an excellent mechanical strength, and is also excellent in the stress relaxation resistance, and which is thus suitable for lead frames, connectors, terminal materials, and the like, for electrical/electronic equipments, for connectors, for example, to be mounted on automotive vehicles, and for terminal materials, relays, switches, and the like.
    {Means to solve} A copper alloy sheet material, having a copper alloy composition containing 0.5 to 5.0 mass% in total of at least one of Ni and Co, and 0.1 to 1.2 mass% of Si, with the balance being Cu and inevitable impurities, wherein, in a crystal orientation analysis by an electron back scatter diffraction analysis, when an area ratio of the Cube orientation {0 0 1} at a surface layer of the material is designated as W0, and an area ratio of the Cube orientation at a 1/4 position of the total depth of the material is designated as W4, a ratio of W0/W4 is 0.8 or more, W0 is 5% to 48%, and an average grain size is 12 to 100 µm, and wherein the copper alloy sheet material is excellent in 180° tight bending property and stress relaxation resistance.

    摘要翻译: {版本}是提供一种铜合金板材,其全部具有优异的弯曲加工性,具有优良的机械强度,并因此具有优异的耐应力松弛特性,和所有其因此适于引线框,连接器,端子材料,和 等,用于电气/电子设备,用于连接器,例如,被安装在机动车辆,和用于终端的材料,继电器,开关等。 {用于解决}一种铜合金板材,具有铜合金组合物中总的Ni和Co中的至少一种的含有0.5〜5.0质量%,和Si为0.1〜1.2质量%,剩余部分由Cu和不可避免的杂质 在电子背散射衍射分析中,由一个晶体取向分析worin当Cube取向{001} <100>在材料的表面层的面积比被指定为W0,并且面积比 在该材料的总深度的第四位置处的Cube取向被指定为W4,W0 / W4的比率为0.8以上,W0是5%至48%,平均粒径为12至100 微米,worin所述铜合金板材具有优异的180°紧弯曲加工性和耐应力松弛特性。