公开(公告)号：EP1664192A1

公开(公告)日：2006-06-07

申请号：EP04782820.7

申请日：2004-09-01

Applicant: GENERAL ELECTRIC COMPANY

Inventor： RUBINSZTAJN, Slawomir ,  TONAPI, Sandeep ,  CAMPBELL, John ,  PRABHAKUMAR, Ananth

IPC: C08L63/00 ,  H01L23/29

CPC classification number: C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/73203 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01066 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T428/31511 ,  H01L2924/00

Abstract: A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

公开(公告)号：EP1665375A1

公开(公告)日：2006-06-07

申请号：EP04779798.0

申请日：2004-08-03

Applicant: General Electric Company, (a New York Corporation)

Inventor： RUBINSZTAJN, Slawomir ,  TONAPI, Sandeep ,  GIBSON, David, Alexander, III ,  CAMPBELL, John, Robert ,  PRABHAKUMAR, Ananth ,  MILLS, Ryan, Christopher

IPC: H01L23/29 ,  C08L63/00 ,  C01B33/14

CPC classification number: C08G59/62 ,  C08G59/24 ,  C08K9/06 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L2223/54426 ,  H01L2224/274 ,  H01L2224/83856 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/00

Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

公开(公告)号：EP1565520A1

公开(公告)日：2005-08-24

申请号：EP03783377.9

申请日：2003-11-14

Applicant: General Electric Company, (a New York Corporation)

Inventor： RUBINSZTAJN, Slawomir ,  PRABHAKUMAR, Ananth ,  SHERMAN, Donna, Marie ,  TONAPI, Sandeep

IPC: C08K3/36 ,  C08G59/00 ,  C08L63/00 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L23/293 ,  C08K9/06 ,  C08L63/00 ,  H01L2224/16227 ,  H01L2224/73104 ,  H01L2224/73204 ,  Y10T428/31511 ,  C08L2666/54 ,  C08L2666/28

Abstract: A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica, cure catalyst, and optional reagents. Further embodiments of the present invention include a method for making the epoxy formulation and a semiconductor package comprising the curable epoxy formulation.

公开(公告)号：EP1665376A1

公开(公告)日：2006-06-07

申请号：EP04779800.4

申请日：2004-08-03

Applicant: GENERAL ELECTRIC COMPANY

Inventor： RUBINSZTAJN, Slawomir ,  TONAPI, Sandeep ,  GIBSON, David, III ,  CAMPBELL, John ,  PRABHAKUMAR, Ananth

IPC: H01L23/29 ,  C08K3/34 ,  C08K9/06 ,  C01B33/14

CPC classification number: B82Y30/00 ,  C01P2004/64 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.