公开(公告)号：EP3290474A1

公开(公告)日：2018-03-07

申请号：EP15890740.2

申请日：2015-04-30

Applicant: Sumitomo Bakelite Co.,Ltd.

Inventor： NAKAO Masaru ,  KURODA Hirofumi

IPC: C08L63/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09J11/06 ,  C08G59/686 ,  C08K5/08 ,  C08K5/20 ,  C08K5/3415 ,  C08K5/50 ,  C08K5/5403 ,  C08L63/00 ,  C09J163/00 ,  C09K3/1006 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01204 ,  C08K3/34 ,  C08K5/09

Abstract: A resin composition for sealing of the present invention contains an epoxy resin (A), a curing agent (B), an inorganic filler (C), and a compound (D) represented by Formula (1). In Formula (1), R 1 represents a polar group or a hydrocarbon group. An electronic component device (10) of the present invention has an electronic component (11) and a sealing material (12) sealing the electronic component (11), in which the sealing material (12) is a cured substance of the resin composition for sealing.

Abstract translation: 本发明的密封用树脂组合物含有环氧树脂（A），固化剂（B），无机填充剂（C）和式（1）所示的化合物（D）。 式（1）中，R 1表示极性基团或烃基。 本发明的电子部件装置（10）具有电子部件（11）和密封电子部件（11）的密封材料（12），密封材料（12）是树脂组合物的固化物 密封。

公开(公告)号：EP3243217A4

公开(公告)日：2018-01-10

申请号：EP16735133

申请日：2016-01-04

Applicant: SAMSUNG ELECTRONICS CO LTD

Inventor： BEAK O-HYUN ,  KUK KEON ,  KO YOUNG-CHUL ,  KIM WOON-BAE

IPC: H01L23/60 ,  H01L21/56 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/291 ,  H01L23/295 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/15331 ,  H04W4/001 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

公开(公告)号：EP2277179B1

公开(公告)日：2017-11-29

申请号：EP09749972.7

申请日：2009-03-05

Applicant: Nokia Technologies Oy

Inventor： SEPPÄLÄ, Eira ,  HEINO, Markku ,  OKSANEN, Markku ,  LEHTINIEMI, Reijo ,  IKONEN, Pekka ,  POHJAKALLIO, Maija ,  JOHANS, Christoffer ,  RAS, Robin ,  TIMONEN, Jaakko

IPC: H01F1/28 ,  H01F1/44 ,  H05K1/02 ,  H05K3/30 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/552 ,  H01L23/64 ,  B05D3/06 ,  H01Q9/04

CPC classification number: H01F1/44 ,  B05D3/06 ,  C08J3/24 ,  C08K3/08 ,  C08K3/22 ,  H01F1/28 ,  H01L21/563 ,  H01L23/295 ,  H01L23/552 ,  H01L23/645 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/83222 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/351 ,  H01Q9/0407 ,  H01Q9/0421 ,  H05K1/0233 ,  H05K3/305 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/086 ,  H05K2201/10371 ,  H05K2201/10689 ,  H05K2203/101 ,  H05K2203/104 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T428/249986 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31938 ,  Y10T428/32 ,  H01L2924/00

Abstract: A material contains a curable liquid polymer containing suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are present in a concentration sufficient to cause the curable liquid polymer to flow in response to application of a magnetic field, enabling the material to be guided into narrow regions to completely fill such regions prior to the polymer being cured. A method includes applying a filler material to at least one component, the filler material including a heat curable polymer containing nanoparticles, and applying an electromagnetic field to at least part of the filler material. The nanoparticles contain a core capable of experiencing localized heating sufficient to at least partially cure surrounding polymer. Also disclosed is an assembly for use at radio frequencies. The assembly includes a substrate and at least one component supported by the substrate. The substrate contains a thermoplastic or thermoset polymer with suspended nanoparticles capable of exhibiting a magnetic property. The nanoparticles are of a type and have a concentration in the polymer selected to provide a certain dielectric permittivity, magnetic permeability and dissipation factor.

公开(公告)号：EP3239211A1

公开(公告)日：2017-11-01

申请号：EP17000703.3

申请日：2017-04-24

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kazunori, Kondo ,  Yoichiro, Ichioka

IPC: C08G77/52 ,  C08K3/36 ,  C09D183/14 ,  C08G77/26 ,  C08G77/46 ,  C08G77/50 ,  H01L23/00 ,  H01L33/00

CPC classification number: C09D183/06 ,  C08G59/42 ,  C08G77/26 ,  C08G77/46 ,  C08G77/50 ,  C08G77/52 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  C09D183/14 ,  H01L21/56 ,  H01L23/295 ,  H01L23/296 ,  H01L23/31 ,  H01L33/00 ,  C08L83/14

Abstract: The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

Abstract translation: 本发明提供一种树脂组合物，其含有：（A）含有下述组成式（1）所示的结构单元且重均分子量为3000〜500000的有机硅树脂; （B）环氧树脂固化剂; 和（C）填料; 其中组分（C）的质量分数基于总质量为50至95质量％。 由此，能够提供能够一次成型晶片的树脂组合物，特别是对于直径大的薄膜晶片的成型性良好，低翘曲性，同时具有良好的晶片保护特性，高可靠性，良好的成型性 成型后的耐热性，可以良好地进行成型加工，可以良好地用于晶片级的包装。

公开(公告)号：EP3225660A1

公开(公告)日：2017-10-04

申请号：EP15862296.9

申请日：2015-11-05

Applicant: KYOCERA Corporation

Inventor： UCHIDA, Ken ,  KAZAMA, Shinichi ,  TERASHI, Yoshitake

IPC: C08L63/00 ,  C08K3/04 ,  C08K3/30 ,  C08K3/36 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C08L63/04 ,  C08K3/04 ,  C08L61/06 ,  C08L63/00 ,  C08L91/06 ,  C08L2203/206 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/293 ,  H01L23/295 ,  H01L23/31 ,  H01L2924/0002 ,  H01L2924/186 ,  H01L2924/00 ,  C08L61/04

Abstract: A resin composition for semiconductor encapsulation, containing (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) amorphous carbon, wherein the amorphous carbon of the component (D) contains 30 atomic% or more of an SP 3 structure and 55 atomic% or less of an SP 2 structure.

Abstract translation: 一种半导体封装用树脂组合物，其含有（A）环氧树脂，（B）酚醛树脂类固化剂，（C）无机填料和（D）无定形碳，其中成分（D） 包含30原子％以上的SP3结构和55原子％以下的SP2结构。

公开(公告)号：EP3219749A1

公开(公告)日：2017-09-20

申请号：EP17290033.4

申请日：2017-03-03

Applicant: MBDA France

Inventor： DUPRE, René

IPC: C08K7/28 ,  C08L63/00 ,  H01L23/00 ,  H01L23/29

CPC classification number: C08K7/28 ,  C08L63/00 ,  C08L2205/20 ,  H01L23/295 ,  H01L23/573 ,  C08L61/04

Abstract: - Matériau de leurrage ultrasonore, en particulier pour système d'arme.
- Le matériau (1) de leurrage ultrasonore comprend au moins une résine (2), ainsi qu'une pluralité de billes creuses (4) noyées dans ladite résine (2), de manière à créer un matériau d'enrobage de masse réduite, apte à rendre inopérant une analyse par détection ultrasonore.

Abstract translation: 超声波诱饵材料，特别是武器系统。 超声诱饵材料（1）包括至少一种树脂（2）以及嵌入所述树脂（2）中的多个空心球（4），以便形成质量减小的涂层材料， 能够使超声检测分析无效。

公开(公告)号：EP3213912A1

公开(公告)日：2017-09-06

申请号：EP15848051.7

申请日：2015-09-28

Applicant: Sekisui Chemical Co., Ltd.

Inventor： SUN, Ren-de ,  NOZATO, Shoji ,  NAKASUGA, Akira ,  NAKAMURA, Masanori

IPC: B32B9/00 ,  B32B15/04 ,  C01B21/072 ,  C01F5/02 ,  C08G14/073 ,  C09K5/14

CPC classification number: H01L23/29 ,  B32B9/00 ,  B32B15/04 ,  C01B21/072 ,  C01B21/0728 ,  C09K5/14 ,  F28F13/18 ,  H01L23/295 ,  H01L2223/58

Abstract: The present invention provides a carbon-coated thermal conductive material which can improve water resistance, oxidation resistance, and dispersibility at the time of being kneaded with a resin while maintaining excellent thermal conductive performance. The present invention is a carbon-coated thermal conductive material having a coating layer composed of amorphous carbon on the surface of a thermal conductive material, in which the thermal conductive material is composed of a metal oxide, a metal nitride, a metal material, or a carbon-based material having a thermal conductivity of 10 W/mK or greater; the amorphous carbon is derived from carbon contained in an oxazine resin; in a case where the amorphous carbon is analyzed by Raman spectroscopy, a ratio of a peak intensity of a G band to a peak intensity of a D band is 1.0 or greater; an average film thickness of the coating layer is 500 nm or less; and a coefficient of variation (CV value) of a film thickness of the coating layer is 15% or less.

Abstract translation: 本发明提供一种碳涂覆的导热材料，其能够在保持优异的导热性能的同时提高在与树脂捏合时的耐水性，耐氧化性和分散性。 本发明是在导热性材料的表面具有由无定形碳构成的被覆层的碳被覆导热性材料，其中，导热性材料由金属氧化物，金属氮化物，金属材料或 导热率为10W / mK或更大的碳基材料; 无定形碳来源于恶嗪树脂中所含的碳; 在通过拉曼光谱分析无定形碳的情况下，G带的峰值强度与D带的峰值强度之比为1.0或更大; 涂层的平均膜厚度为500nm或更小; 并且涂层的膜厚度的变化系数（CV值）为15％以下。

公开(公告)号：EP3187561A1

公开(公告)日：2017-07-05

申请号：EP15836357.2

申请日：2015-08-06

Applicant: Nitto Denko Corporation

Inventor： IINO,Chie ,  SHIGA,Goji ,  ISHII,Jun

IPC: C09K3/10 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/31 ,  B32B7/12 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L23/12 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3114 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162 ,  H01L2924/3511

Abstract: In order to provide a sealing sheet capable of preventing same from falling off a suction collet during conveyancing, etc., and whereby semiconductor chips can be suitably buried, the sum α of a thickness t [mm] and a storage elastic modulus G' [Pa] at 50°C, for this sealing sheet, fulfils 300 ≤ α ≤ 1.5 × 10 5 .

Abstract translation: 为了提供一种密封片，其能够防止在传送过程中等从吸嘴夹脱落并且由此可以适当地掩埋半导体芯片，厚度t [mm]和储存弹性模量G'[ Pa]为50℃时，该密封片满足300≤α≤1.5×105。

公开(公告)号：EP3058588A4

公开(公告)日：2017-05-31

申请号：EP13895640

申请日：2013-10-15

Applicant: INTEL CORP

Inventor： SANKMAN ROBERT L ,  NIKONOV DMITRI E ,  PAN JIN

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/552 ,  H01L25/065

CPC classification number: H01L43/02 ,  G06F1/1633 ,  H01L23/295 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L43/12 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06537 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19104 ,  H01L2924/3025 ,  H05K9/0075 ,  H01L2224/45099

公开(公告)号：EP1633678B1

公开(公告)日：2017-05-17

申请号：EP04736701.6

申请日：2004-06-11

Applicant: Showa Denko K.K.

Inventor： KAMIMURA, Katsuhiko, Showa Denko K.K. Yokohama Pl. ,  YAMADA, Tomiharu, Showa Denko K.K. Yokohama Plant

IPC: C01F7/00

CPC classification number: C04B35/6262 ,  C01F7/02 ,  C01F7/023 ,  C01F7/441 ,  C01F7/442 ,  C01P2004/03 ,  C01P2004/32 ,  C01P2004/52 ,  C01P2004/60 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/44 ,  C04B35/101 ,  C04B35/111 ,  C04B35/628 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3218 ,  C04B2235/3409 ,  C04B2235/36 ,  C04B2235/444 ,  C04B2235/445 ,  C04B2235/483 ,  C04B2235/5436 ,  C04B2235/549 ,  C09C1/407 ,  H01L23/295 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01M2/1072 ,  H01M10/613 ,  H01M10/653 ,  H01M10/6554 ,  H01L2924/00