摘要:
Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.
摘要:
Curable compositions contain a polyphenylene ether, preferably of low molecular weight, and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts and dried antimony pentoxide. Said compositions are free from hardeners for epoxy resins. They may be used in the preparation of printed circuits as well as bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies.
摘要:
Curable compositions contain a polyphenylene ether, preferably of low molecular weight, and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts and dried antimony pentoxide. Said compositions are free from hardeners for epoxy resins. They may be used in the preparation of printed circuits as well as bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies.
摘要:
Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.