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1.
公开(公告)号:EP4247901A1
公开(公告)日:2023-09-27
申请号:EP21824280.8
申请日:2021-11-03
发明人: YANG, Wei , YU, Naiwo , GAO, Xiaoying , ZHANG, Jun
IPC分类号: C09D5/00 , C09D15/00 , C09D175/04 , C08G18/08
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公开(公告)号:EP4116385A1
公开(公告)日:2023-01-11
申请号:EP21764745.2
申请日:2021-03-02
发明人: CHEN, Hong , YANG, Wei
IPC分类号: C09D163/00 , C09D5/00
摘要: The present application is directed to a two-component waterborne wood sealing primer, including: Component A: a film-forming resin composition including an aqueous epoxy resin emulsion; and Component B: an aqueous curing system including an epoxy reactive curing agent, a filling slurry, and an additional additive; and wherein no organic solvent is added during the preparation process of the two-component waterborne wood sealing primer, and the two-component waterborne wood sealing primer has a solid content during application in the range of 45-50wt% and a VOC content of 80 g/L or less.
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公开(公告)号:EP4433545A1
公开(公告)日:2024-09-25
申请号:EP22843610.1
申请日:2022-11-17
发明人: YANG, Wei
CPC分类号: C08K2003/22220130101 , C08K2003/223720130101 , C09D7/61 , C09D5/00 , C09D4/06 , C08F290/061 , C09D151/003
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公开(公告)号:EP4430127A1
公开(公告)日:2024-09-18
申请号:EP22821284.1
申请日:2022-10-25
发明人: YANG, Wei , ADIKKALATHIL, Mijin
IPC分类号: C09D5/00 , C08G12/06 , C08L61/20 , C09D7/63 , C09D201/06 , C09J167/08
CPC分类号: C09D5/00 , C09D201/06 , C08L61/20 , C08G12/06 , C09D7/63 , C08K5/544 , C09D167/08 , C08L101/06 , C09D201/025
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公开(公告)号:EP4284880A1
公开(公告)日:2023-12-06
申请号:EP22710478.3
申请日:2022-01-17
发明人: YANG, Wei , CHEN, Hong , YU, Naiwo
IPC分类号: C09D5/02 , C09D5/28 , C09D7/65 , C09D133/04
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公开(公告)号:EP4182397A1
公开(公告)日:2023-05-24
申请号:EP21842553.6
申请日:2021-07-19
发明人: LIU, Yijiang , WANG, Qiongbo , YANG, Wei
IPC分类号: C09D133/08 , C09D133/14 , C09D171/00 , C09D167/06 , C09D163/10 , C09D175/14
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8.
公开(公告)号:EP3647383A1
公开(公告)日:2020-05-06
申请号:EP19206041.6
申请日:2019-10-29
IPC分类号: C09D167/08
摘要: The present disclosure refers to an acid-cured coating composition with low free formaldehyde emission and preparation method thereof. The acid-cured coating composition comprises an alkyd resin, an amino resin, and an acetoacetyl-functional silicon-based resin, wherein upon curing, the amino resin itself releases at least 0.8 wt% of formaldehyde, based on the weight of the amino resin; weight ratio of the alkyd resin and the amino resin is in a range of from 70:30 to 45:55. The present disclosure also refers to a coated article.
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