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1.SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD 有权
Title translation: LÖTLEGIERUNG,LÖTPASTEUND ELEKTRONISCHE LEITERPLATTE公开(公告)号:EP2868424B1
公开(公告)日:2017-05-03
申请号:EP13810587
申请日:2013-06-25
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
CPC classification number: B23K35/025 , B23K1/00 , B23K1/0016 , B23K35/0244 , B23K35/26 , B23K35/262 , C22C13/00 , C22C13/02 , H05K1/02 , H05K3/3463 , H05K3/3484 , H05K2201/2081
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2.LOW-SILVER-CONTENT SOLDER ALLOY AND SOLDER PASTE COMPOSITION 审中-公开
Title translation: 焊料合金焊膏和低银SHARE公开(公告)号:EP2468450A4
公开(公告)日:2013-03-06
申请号:EP11779078
申请日:2011-05-12
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
CPC classification number: B23K35/22 , B22F1/0011 , B23K35/025 , B23K35/262 , B23K35/3006 , C22C1/005 , C22C13/00 , C22C13/02
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公开(公告)号:EP2868424A4
公开(公告)日:2016-01-20
申请号:EP13810587
申请日:2013-06-25
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
CPC classification number: B23K35/025 , B23K1/00 , B23K1/0016 , B23K35/0244 , B23K35/26 , B23K35/262 , C22C13/00 , C22C13/02 , H05K1/02 , H05K3/3463 , H05K3/3484 , H05K2201/2081
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4.SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD 有权
Title translation: LÖTLEGIERUNG,LÖTPASTEUND ELEKTRONISCHE LEITERPLATTE公开(公告)号:EP2868423A4
公开(公告)日:2016-01-20
申请号:EP12879957
申请日:2012-11-16
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
IPC: B23K35/26 , B23K1/00 , B23K35/02 , B23K35/22 , B23K35/363 , B23K101/42 , C22C13/00 , C22C13/02 , H05K1/09 , H05K3/34
CPC classification number: B23K35/262 , B23K1/00 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , C22C13/00 , C22C13/02 , H05K1/092 , H05K3/3463
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