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1.SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD 有权
Title translation: LÖTLEGIERUNG,LÖTPASTEUND ELEKTRONISCHE LEITERPLATTE公开(公告)号:EP2868424B1
公开(公告)日:2017-05-03
申请号:EP13810587
申请日:2013-06-25
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
CPC classification number: B23K35/025 , B23K1/00 , B23K1/0016 , B23K35/0244 , B23K35/26 , B23K35/262 , C22C13/00 , C22C13/02 , H05K1/02 , H05K3/3463 , H05K3/3484 , H05K2201/2081
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公开(公告)号:EP2985112A4
公开(公告)日:2016-11-30
申请号:EP14782208
申请日:2014-04-02
Applicant: HARIMA CHEMICALS INC
Inventor: OTA YASUO , PIAO JINYU
IPC: B23K35/363 , B23K1/00 , B23K1/19 , B23K1/20 , B23K35/02 , B23K35/28 , B23K35/36 , B23K101/14 , B23K103/10 , C08L75/04 , C09D175/04 , C22C21/00
CPC classification number: B23K35/0222 , B23K1/0012 , B23K1/203 , B23K35/286 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K2201/14 , B23K2203/10 , C08G18/0823 , C08G18/3206 , C08G18/348 , C08G18/4202 , C08G18/4238 , C08G18/44 , C08G18/4808 , C08G18/4825 , C08G18/4879 , C08G18/6659 , C08G18/6692 , C08G18/722 , C08G18/73 , C08G18/755 , C08G18/758 , C08K2003/2227 , C22C21/00 , C08G18/12 , C08G18/302
Abstract: An aqueous aluminum brazing composition contains, as a binder resin, a water-soluble/dispersible polyurethane resin that exhibits a residual ratio in a 400°C heating environment of 60% by mass or less and exhibits a residual ratio in a 520°C heating environment of 1.0% by mass or less.
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3.LOW-SILVER-CONTENT SOLDER ALLOY AND SOLDER PASTE COMPOSITION 审中-公开
Title translation: 焊料合金焊膏和低银SHARE公开(公告)号:EP2468450A4
公开(公告)日:2013-03-06
申请号:EP11779078
申请日:2011-05-12
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
CPC classification number: B23K35/22 , B22F1/0011 , B23K35/025 , B23K35/262 , B23K35/3006 , C22C1/005 , C22C13/00 , C22C13/02
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公开(公告)号:EP2868424A4
公开(公告)日:2016-01-20
申请号:EP13810587
申请日:2013-06-25
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
CPC classification number: B23K35/025 , B23K1/00 , B23K1/0016 , B23K35/0244 , B23K35/26 , B23K35/262 , C22C13/00 , C22C13/02 , H05K1/02 , H05K3/3463 , H05K3/3484 , H05K2201/2081
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5.SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD 有权
Title translation: LÖTLEGIERUNG,LÖTPASTEUND ELEKTRONISCHE LEITERPLATTE公开(公告)号:EP2868423A4
公开(公告)日:2016-01-20
申请号:EP12879957
申请日:2012-11-16
Applicant: HARIMA CHEMICALS INC
Inventor: IMAMURA YOJI , IKEDA KAZUKI , PIAO JINYU , TAKEMOTO TADASHI
IPC: B23K35/26 , B23K1/00 , B23K35/02 , B23K35/22 , B23K35/363 , B23K101/42 , C22C13/00 , C22C13/02 , H05K1/09 , H05K3/34
CPC classification number: B23K35/262 , B23K1/00 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , C22C13/00 , C22C13/02 , H05K1/092 , H05K3/3463
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