摘要:
Disclosed is an adhesive composition, comprising: (A) a silane terminated oligomer; (B) a (meth)acrylate monomer; (C) optionally a (meth)acrylate oligomer; (D) a photoinitiator; and (E) optionally an organometallic catalyst. The adhesive composition is both ultraviolet curable and moisture curable. Also disclosed is a method of applying the adhesive composition, comprising: (i) coating the adhesive onto the substrate to be bonded; (ii) laminating or stacking the substrate to be bonded to form an assembly; (iii) irradiating the assembly by ultraviolet irradiation; and (iv) placing the assembly under the room temperature. The adhesive composition is useful in display panels, touch panels and optical devices.
摘要:
The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.
摘要:
The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of ≧160° C., preferably, from 160° C. to 260° C., more preferably from 240° C. to 250° C.
摘要:
The present invention relates to an optical transparent dual cure adhesive, and process for preparing this dual cure adhesive, and uses thereof. More particularly, the present invention relates to optical transparent adhesive, which is both capable of being UV-light cured and thermal cured, for example, it can be used for the bonding of touch screen of an electronic device and substrate.