PHOTOCURABLE ADHESIVE COMPOSITION AND USE OF THE SAME
    3.
    发明公开
    PHOTOCURABLE ADHESIVE COMPOSITION AND USE OF THE SAME 审中-公开
    LIFTHÄRTBAREKLEBSTOFFZUSAMMENSETZUNG UND IHRE VERWENDUNG

    公开(公告)号:EP2736988A4

    公开(公告)日:2015-06-24

    申请号:EP12818272

    申请日:2012-07-05

    摘要: The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of ≧160° C., preferably, from 160° C. to 260° C., more preferably from 240° C. to 250° C.

    摘要翻译: 本发明涉及光固化性粘合剂组合物及其用途。 具体而言,所述光固化性粘合剂组合物主要包含100重量份的粘合剂组合物,成分A:70〜99重量份的一种或多种携带(甲基)丙烯酰氧基的聚合物; 组分B:0至30重量份,优选0至25重量份的一种或多种(甲基)丙烯酸酯单体; 组分C:0.5至10重量份的至少一种UV吸收剂; 和组分D:0至5重量份的抗氧化剂。 本发明还涉及上述粘合剂组合物在生产用于临时粘合基材和临时载体并经历例如在> 160℃的温度下的高温加工的ITO基材中的用途。 ,优选为160℃至260℃,更优选为240℃至250℃。