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1.发明公开ALUMINUM CONDUCTOR PASTE FOR BACK SURFACE PASSIVATED CELLS WITH LOCALLY OPENED VIAS 审中-公开以局部的开口通孔ALUMINIUMLEITPASTE是后表面钝化细胞
公开(公告)号：EP2805334A4
公开(公告)日：2015-10-28
申请号：EP13739078
申请日：2013-01-11
发明人： KHADILKAR CHANDRASHEKHAR S , KHATRI HIMAL , SRIDHARAN SRINIVASAN , GRADDY GEORGE E JR , SHAIKH AZIZ S , MERCHANT NAZARALI N
CPC分类号： H01L31/022425 , C03C8/04 , C03C8/10 , C03C8/18 , H01B1/22 , H01L31/02008 , H01L31/02167 , H01L31/068 , H01L31/1804 , Y02E10/547 , Y02P70/521
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公开(公告)号：EP2754185A4
公开(公告)日：2015-06-03
申请号：EP12829901
申请日：2012-09-05
IPC分类号： H01L31/0224
CPC分类号： H01L31/022425 , H01B1/16 , H01L31/02167 , H01L31/02245 , H01L31/022458 , H01L31/028 , Y02E10/50
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3.发明公开SOLAR CELL CONTACTS WITH NICKEL INTERMETALLIC COMPOSITIONS 审中-公开SOLARZELLENKONTAKTE MIT INTERMETALLISCHEN NICKELZUSAMMENSETZUNGEN
公开(公告)号：EP2839511A4
公开(公告)日：2015-12-02
申请号：EP13778458
申请日：2013-04-18
发明人： KHATRI HIMAL , SHAIKH AZIZ S , SRIDHARAN SRINIVASAN , KUNZE KLAUS
IPC分类号： H01L31/0224
CPC分类号： H01L31/022425 , H01B1/22 , H01L31/02168 , H01L31/02245 , Y02E10/50
摘要： Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain a nickel intermetallic compound such as nickel silicide, nickely boride or nickel phosphide, a glass frit, a metal additive and an organic vehicle system. The paste can be used for making a solar cell contact.
摘要翻译： 公开了糊剂组合物，制备糊剂组合物的方法和制造太阳能电池接触的方法。 糊料组合物可以含有镍金属间化合物如硅化镍，镍硼化物或磷化镍，玻璃料，金属添加剂和有机载体体系。 该糊状物可用于制造太阳能电池接触。
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4.发明公开
公开(公告)号：EP2764000A4
公开(公告)日：2015-10-14
申请号：EP12828290
申请日：2012-08-16
发明人： ZHANG DONGSHE , SHAIKH AZIZ , SRIDHARAN SRINIVASAN , KHATRI HIMAL , JIANG HONG , GRADDY GEORGE E
IPC分类号： C07F9/11 , C03C8/08 , C03C8/10 , C03C8/16 , C03C8/18 , C03C8/22 , H01B1/22 , H01L21/22 , H01L31/0224
CPC分类号： H01B1/22 , C03C8/08 , C03C8/10 , C03C8/16 , C03C8/18 , C03C8/22 , C07F9/11 , H01L21/2225 , H01L31/022425 , H01L31/022441 , Y02E10/50
摘要： Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.
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