公开(公告)号：EP2879986A4

公开(公告)日：2016-03-23

申请号：EP12882090

申请日：2012-07-31

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： WALMSLEY ROBERT G ,  ZHANG ZHUQING ,  WU JENNIFER ,  BERNARD SHELDON A ,  CHOY SILAM J

IPC: B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  G01P15/02 ,  G01P15/08

CPC classification number: H05K1/18 ,  B81B7/0048 ,  B81B2201/0235 ,  G01P15/0802 ,  H01L24/32 ,  H01L2224/32014 ,  H05K13/0469 ,  H05K2203/06 ,  Y10T156/10

Abstract: A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.