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公开(公告)号：EP2315314A4
公开(公告)日：2011-08-17
申请号：EP10746234
申请日：2010-02-24
发明人： TATSUZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOUJI , FUJINAWA TOHRU , ARIFUKU MOTOHIRO , SEKI KOTARO
CPC分类号： H01R4/04 , B65H18/28 , B65H2701/377 , C09J7/22 , C09J7/38 , H05K3/323 , H05K3/361 , H05K2203/0191
摘要： The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.
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公开(公告)号：EP2030936A4
公开(公告)日：2010-12-22
申请号：EP07745221
申请日：2007-06-14
发明人： OCHI TAKATO , SEKI TAKASHI
IPC分类号： B65H75/14
CPC分类号： B65H75/14 , B65H2701/377
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公开(公告)号：EP2312697A4
公开(公告)日：2012-03-21
申请号：EP10755894
申请日：2010-03-12
发明人： TATSUZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOUJI , FUJINAWA TOHRU , ARIFUKU MOTOHIRO , SEKI KOTARO
CPC分类号： B65H75/28 , B65H2701/377 , H01R4/04 , H01R12/52 , H05K3/323 , Y10T428/14 , Y10T428/266 , Y10T428/28
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公开(公告)号：EP2030937A4
公开(公告)日：2010-12-22
申请号：EP07745222
申请日：2007-06-14
发明人： OCHI TAKATO , SEKI TAKASHI
IPC分类号： B65H75/14
CPC分类号： B65H75/14 , B65H54/12 , B65H2301/41368 , B65H2701/377
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