-
1.发明公开
公开(公告)号：EP2426787A4
公开(公告)日：2013-11-20
申请号：EP10769664
申请日：2010-04-22
IPC分类号： H01R11/01 , C09D5/25 , C09D133/00 , C09D179/08 , C09D183/04 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , H01B1/00 , H01B1/22 , H01B1/24 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H05K3/323 , B82Y10/00 , H01L2224/83101 , H01L2924/12044 , H05K3/361 , H05K2201/0224 , H05K2201/026 , H05K2201/0323 , Y10T29/49117 , Y10T29/532 , H01L2924/00
摘要： The circuit connecting material of the invention is situated between mutually opposing circuit electrodes, and provides electrical connection between the electrodes in the pressing direction when the mutually opposing circuit electrodes are pressed, the circuit connecting material comprising anisotropic conductive particles wherein conductive fine particles are dispersed in an organic insulating material.
-
公开(公告)号：EP2211596A4
公开(公告)日：2011-08-10
申请号：EP08835704
申请日：2008-09-29
IPC分类号： H05K1/14 , C08F283/00 , C08F290/06 , C08G18/32 , C08G18/67 , C08G18/76 , C08K5/29 , C08K5/49 , C08L79/08 , C09J4/00 , C09J9/02 , C09J163/02 , C09J175/04 , C09J175/06 , H01B1/22 , H01R11/01 , H05K3/36
CPC分类号： H01R4/04 , C08G18/3256 , C08G18/4213 , C08G18/4277 , C08G18/672 , C08G18/718 , C08G18/755 , C08G18/7671 , C08K5/29 , C08L63/00 , C08L75/16 , C08L79/08 , C08L2205/02 , C08L2666/20 , C09J163/00 , C09J175/06 , H05K3/323 , H05K3/361 , C08G18/42
摘要： The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. Wherein R represents an organic group, R 1 and R 2 each represent a C1-C4 monovalent aliphatic hydrocarbon group, and R 1 and R 2 may be linked together to form a cycloalkyl group.
-
公开(公告)号：EP2315314A4
公开(公告)日：2011-08-17
申请号：EP10746234
申请日：2010-02-24
发明人： TATSUZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOUJI , FUJINAWA TOHRU , ARIFUKU MOTOHIRO , SEKI KOTARO
CPC分类号： H01R4/04 , B65H18/28 , B65H2701/377 , C09J7/22 , C09J7/38 , H05K3/323 , H05K3/361 , H05K2203/0191
摘要： The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.
-
公开(公告)号：EP2205052A4
公开(公告)日：2011-03-09
申请号：EP08710856
申请日：2008-02-06
IPC分类号： H05K3/36
CPC分类号： H05K3/361 , H05K3/28 , H05K3/323 , H05K2201/0191 , H05K2203/0594 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
-
公开(公告)号：EP2426672A4
公开(公告)日：2012-12-12
申请号：EP10769665
申请日：2010-04-22
CPC分类号： H01R4/04 , H01B1/22 , H01B1/24 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29393 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/12044 , H05K3/323 , H05K2201/0224 , H05K2201/0323 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
-
公开(公告)号：EP2312697A4
公开(公告)日：2012-03-21
申请号：EP10755894
申请日：2010-03-12
发明人： TATSUZAWA TAKASHI , SEKI TAKASHI , KOBAYASHI KOUJI , FUJINAWA TOHRU , ARIFUKU MOTOHIRO , SEKI KOTARO
CPC分类号： B65H75/28 , B65H2701/377 , H01R4/04 , H01R12/52 , H05K3/323 , Y10T428/14 , Y10T428/266 , Y10T428/28
-
公开(公告)号：EP2157146A4
公开(公告)日：2011-02-02
申请号：EP07745185
申请日：2007-06-13
CPC分类号： H05K3/323 , H01R4/04 , H01R12/52 , H05K2201/0133
-
8.发明公开CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL 审中-公开电路连接材料和电路元件的连接结构的电路元件的连接方法在电路连接材料的基
公开(公告)号：EP2178094A4
公开(公告)日：2013-02-20
申请号：EP08791996
申请日：2008-07-31
发明人： TOMISAKA KATSUHIKO , KOBAYASHI KOUJI , TAKETATSU JUN , ARIFUKU MOTOHIRO , KOJIMA KAZUYOSHI , MOCHIZUKI NICHIOMI
IPC分类号： C09J9/02 , C09J11/04 , C09J163/00 , H05K3/32 , H05K3/36
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/04 , C09J163/00 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/13144 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29439 , H01L2224/29447 , H01L2224/29455 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R11/01 , H01R12/52 , H01R13/03 , H05K2201/0218 , H05K2201/0221 , Y10T29/49117 , Y10T428/256 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A circuit connection material 10 comprising an adhesive composition 11 and conductive particles 12, wherein the conductive particles 12 are conductive particles 12 with protrusions 14 comprising one or more metal layers 22 on a core 21, with the metal layer 22 being formed on at least surfaces of the protrusions 14 and the metal layer 22 being composed of nickel or a nickel alloy, and compression modulus of the conductive particles 12 under 20% compression is 100-800 kgf/mm 2 .
摘要翻译： 一种电路连接材料10，其包括粘合剂组合物11和导电粒子12，worin导电性粒子12是导电性粒子12与突起部14上的芯21，其包括一个或多个金属层22，与金属层22的至少表面上形成 突起部14和金属层22的部分由镍或镍合金，和导电性粒子12在20％的压缩是100-800千克力/毫米2的压缩模量的。
-
9.发明公开
公开(公告)号：EP2148393A4
公开(公告)日：2012-03-28
申请号：EP08752686
申请日：2008-05-14
CPC分类号： H05K3/323 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01B1/02 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05669 , H01L2224/05671 , H01L2224/13016 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/2989 , H01L2224/81903 , H01L2224/838 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H01R12/714 , H01R13/03 , H05K3/361 , H05K2201/0221 , Y10T428/2998 , H01L2924/01028 , H01L2924/01026 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 µm and the thickness of the metal layer being 65-125 nm.
-
公开(公告)号：EP2081222A4
公开(公告)日：2011-11-30
申请号：EP07830824
申请日：2007-10-30
CPC分类号： H01B1/22 , C08K7/16 , C08K9/02 , C09J9/02 , C09J11/02 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L2224/0401 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00 , H01L2924/01028 , H01L2924/01026 , H01L2924/01027 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.01 秒)
