公开(公告)号：EP3296781A4

公开(公告)日：2018-07-04

申请号：EP15894657

申请日：2015-06-12

申请人： HUAWEI TECH CO LTD

发明人： HUANGFU YOURUI ,  LIU SHAOQING ,  YANG YINGCHUN ,  QIU CHEN

IPC分类号： G02B6/26 ,  H04Q11/00

CPC分类号： G02B6/122 ,  G02B6/26 ,  G02B6/3546 ,  G02B6/43 ,  H04B10/803 ,  H04Q11/0005

摘要： Embodiments of the present invention relate to an on-chip optical interconnection structure and network. The on-chip optical interconnection structure includes M levels of optical switching devices; and m th -level optical switching devices in the M levels of optical switching devices include 2 m -1 optical switching devices. Each optical switching device in (i-1) th -level optical switching devices in the M levels of optical switching devices is connected to two optical switching devices in i th -level optical switching devices. Two optical switching devices that are in the i th -level optical switching devices and that are connected to a same optical switching device in the (i-1) th -level optical switching devices are connected. The on-chip optical interconnection network is divided into levels, and switching devices connected in a grid manner are formed, so that hierarchical switching may be performed, and conflicts and delays in communication are reduced. In addition, optical switching devices at a bottom layer of the on-chip optical interconnection structure allow faster and more effective communication between computer components without accessing an optical switching device at a higher layer.