摘要:
A method includes forming a coating that covers at least part of a conduction substrate, where the conduction substrate is configured to transport thermal energy. The method also includes forming at least part of an optical waveguide on the coating. The optical waveguide includes multiple cladding layers and a core, and the optical waveguide is configured to transport optical signals. The conduction substrate, the coating, and the optical waveguide form an integrated monolithic waveguide structure.
摘要:
Embodiments of the present invention relate to an on-chip optical interconnection structure and network. The on-chip optical interconnection structure includes M levels of optical switching devices; and m th -level optical switching devices in the M levels of optical switching devices include 2 m -1 optical switching devices. Each optical switching device in (i-1) th -level optical switching devices in the M levels of optical switching devices is connected to two optical switching devices in i th -level optical switching devices. Two optical switching devices that are in the i th -level optical switching devices and that are connected to a same optical switching device in the (i-1) th -level optical switching devices are connected. The on-chip optical interconnection network is divided into levels, and switching devices connected in a grid manner are formed, so that hierarchical switching may be performed, and conflicts and delays in communication are reduced. In addition, optical switching devices at a bottom layer of the on-chip optical interconnection structure allow faster and more effective communication between computer components without accessing an optical switching device at a higher layer.
摘要:
An embodiment of a waveguide has a Brillouin bandwidth, and includes cladding and a core. The cladding includes first layers of a first material, each first layer having a physical characteristic of approximately a first value, and includes second layers of a second material, each second layer having the physical characteristic of approximately a second value, the second layers alternating with the first layers such that the Brillouin bandwidth is wider than the Brillouin bandwidth would be if the cladding excluded the first layers or excluded the second layers. For example, the first and second cladding layers can be formed from different materials, or can be formed having different values of a physical characteristic such as thickness, acoustic velocity, or index of refraction. Such a waveguide can facilitate alignment of the waveguide's optical bandwidth with the waveguide's Brillouin bandwidth because the Brillouin bandwidth is widened compared to conventional waveguides.
摘要:
An acousto-optic waveguide (100) comprises a cladding region (110) comprising a first material having a first refractive index and a first acoustic velocity, and a pair of optical waveguide layers (120,122) embedded in and extending through the cladding region. The optical waveguide layers are separated from one another by a gap region (130) comprising the first material. The optical waveguide layers (120,122) each comprise a second material having a second refractive index that is higher than the first refractive index and a second acoustic velocity that is higher than the first acoustic velocity. The optical waveguide layers (120,122) substantially confine acoustic waves that are generated during optical signal propagation through the acousto-optic waveguide. The acoustic waves are substantially confined to the area around the optical waveguide layers (120,122) and the gap region (130) along the direction of the optical signal propagation.
摘要:
A pad-array arrangement structure on a substrate for mounting an IC chip on the substrate, wherein a structure with which it is possible to maximally avoid an increase in the number of wiring layers on the substrate is obtained by devising the pad arrangement in an IC pad-array region. A embodiment of the present invention provides a pad-array structure on a substrate for mounting an IC chip on the substrate. The present invention is characterized in that: a plurality of ground pads arrayed equidistantly in a first row, and a plurality of signal pads arrayed equidistantly in a second row on the inside of and parallel to the first row, are provided on a first circumferential edge in the pad-array region; each of the signal pads passes between two adjacent ground pads in the first row and is connected to an external circuit on the substrate; and electrical signals are input to and output from the external circuit.
摘要:
The present invention provides a Point-Symmetric Mach-Zehnder-Interferometer (PSMZI) device 100, comprising three consecutive path delay sections (PDSs) provided as two outer PDS 102 and one center PDS 101, each PDS 101, 102 including an upper waveguide arm 103 and a lower waveguide arm 104. The PSMZI device 100 also includes four asymmetric couplers (ACs) each AC 105 including an upper waveguide portion 106 and a lower waveguide portion 107. One AC 105 is arranged directly on each side of each PDS 101, 102, the upper and lower waveguide portions 106, 107 being respectively coupled to the upper and lower waveguide arms 103, 104. Further, the AC 105 on the one side of the PDS 101, 102 is point-symmetric to the AC 105 on the other side of the PDS 101, 102, and the two ACs 105 and the one outer PDS 102 arranged on the one side of the center PDS 101 are together point-symmetric to the two ACs 105 and the one outer PDS 102 arranged on the other side of the center PDS 101.
摘要:
A portion of an optical waveguide extending laterally within a photonic integrated circuit (PIC) chip is at least partially freed from the substrate to allow physical displacement of a released waveguide end relative to the substrate and relative to an adjacent photonic device also fabricated in the substrate. The released waveguide end may be displaced to modulate interaction between the photonic device and an optical mode propagated by the waveguide. In embodiments where the photonic device is an optical coupler, employing for example an Echelle grating or arrayed waveguide grating (AWG), mode propagation through the coupler may be modulated via physical displacement of the released waveguide end. In one such embodiment, thermal sensitivity of an integrated optical wavelength division multiplexer (WDM) is reduced by displacing the released waveguide end relative to the coupler in a manner that counters a temperature dependence of the optical coupler.