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    ON-CHIP OPTICAL INTERCONNECTION STRUCTURE AND NETWORK
    2.
    发明公开
    ON-CHIP OPTICAL INTERCONNECTION STRUCTURE AND NETWORK 审中-公开

    公开(公告)号：EP3296781A4

    公开(公告)日：2018-07-04

    申请号：EP15894657

    申请日：2015-06-12

    申请人： HUAWEI TECH CO LTD

    发明人： HUANGFU YOURUI ,  LIU SHAOQING ,  YANG YINGCHUN ,  QIU CHEN

    IPC分类号： G02B6/26 ,  H04Q11/00

    CPC分类号： G02B6/122 ,  G02B6/26 ,  G02B6/3546 ,  G02B6/43 ,  H04B10/803 ,  H04Q11/0005

    摘要： Embodiments of the present invention relate to an on-chip optical interconnection structure and network. The on-chip optical interconnection structure includes M levels of optical switching devices; and m th -level optical switching devices in the M levels of optical switching devices include 2 m -1 optical switching devices. Each optical switching device in (i-1) th -level optical switching devices in the M levels of optical switching devices is connected to two optical switching devices in i th -level optical switching devices. Two optical switching devices that are in the i th -level optical switching devices and that are connected to a same optical switching device in the (i-1) th -level optical switching devices are connected. The on-chip optical interconnection network is divided into levels, and switching devices connected in a grid manner are formed, so that hierarchical switching may be performed, and conflicts and delays in communication are reduced. In addition, optical switching devices at a bottom layer of the on-chip optical interconnection structure allow faster and more effective communication between computer components without accessing an optical switching device at a higher layer.

    INTRAPERSONAL DATA COMMUNICATION SYSTEM
    5.
    发明公开
    INTRAPERSONAL DATA COMMUNICATION SYSTEM 审中-公开
    INTRAPERSONALES DATENKOMMUNIKATIONSSYSTEM

    公开(公告)号：EP2812749A1

    公开(公告)日：2014-12-17

    申请号：EP13746322.0

    申请日：2013-02-08

    申请人： N2 Imaging Solutions LLC

    发明人： MASARIK, David, Michael

    IPC分类号： G02B27/01 ,  H04N5/225

    CPC分类号： H04N5/2252 ,  G02B27/017 ,  H04B1/385 ,  H04B10/11 ,  H04B10/114 ,  H04B10/1143 ,  H04B10/22 ,  H04B10/25 ,  H04B10/2504 ,  H04B10/2575 ,  H04B10/40 ,  H04B10/803 ,  H04B2001/3866 ,  H04N5/2253 ,  H04N5/33 ,  H04N5/77 ,  H04N5/772 ,  H04N7/185

    摘要： Intrapersonal communication systems and methods that provide an optical digital signal link between two or more local devices are disclosed. In some embodiments, the system includes a first signal converter disposed at a first end of the optical digital signal link and configured to convert between electrical digital signals from a first local device and optical digital signals from the optical digital signal link. The system can include an optical connector having a non-contact portion configured to couple optical digital signals between the first signal converter and the optical digital signal link across a gap. The system can include a second signal converter disposed at a second end of the optical digital signal link and configured to convert between electrical digital signals from the second local device and optical digital signals from the optical digital signal link.

    摘要翻译： 提供一些实施例用于向个人设备系统上的本地设备提供无线桥接器。 个人设备系统可以包括允许外部系统，用户或两者与个人设备系统上的本地设备进行通信和访问数据的无线通信系统。 个人设备系统被提供有一个或多个与之相连的本地设备并且彼此有线通信。 个人设备系统可以包括连接到头戴系统的无线系统和本地设备，本地设备彼此有线通信并且与外部系统进行无线通信。 无线通信系统被配置为建立与外部系统的无线连接，用于与彼此进行有线通信的本地设备通信并访问本地设备。

    Optical transmission module, electronic instrument, method for assembling optical transmission module, and optical transmission method
    6.
    发明公开
    Optical transmission module, electronic instrument, method for assembling optical transmission module, and optical transmission method 有权
    的光传输模块，电子设备，组装的光传输模块和光传输方法的方法

    公开(公告)号：EP2333598A3

    公开(公告)日：2013-11-20

    申请号：EP10191934.8

    申请日：2010-11-19

    申请人： OMRON Corporation

    发明人： Hosokawa, Hayami ,  Yasuda, Naru ,  Hamana, Kentaro

    IPC分类号： G02B6/43 ,  H04M1/02

    CPC分类号： G02B6/43 ,  G02B6/4214 ,  H04B10/803 ,  H04M1/0235 ,  H05K1/0274 ,  H05K1/14

    摘要： Even if a board-to-board distance is lower than a bending resistance limit of an optical transmission path (4) (bending resistance cannot be maintained), the optical transmission path (4) is accommodated within the distance to realize a reduced accommodation space. An optical transmission module (1) includes the optical transmission path (4) that performs optical transmission between a first circuit board (20) and a second circuit board (30), and the first circuit board (20) and the second circuit board (30) are disposed opposite to each other. The optical transmission path (4) includes a bending portion (4C) having a folded structure having a bending radius R, and a circumferential portion drawn by the bending radius R is provided substantially perpendicular to board surfaces of the first circuit board (20) and the second circuit board (30).

    Optical transmission module, electronic instrument, method for assembling optical transmission module, and optical transmission method
    7.
    发明公开
    Optical transmission module, electronic instrument, method for assembling optical transmission module, and optical transmission method 有权
    OptischesÜbertragungsmodul，elektronischesGerätund optischesÜbertragungsverfahren

    公开(公告)号：EP2333598A2

    公开(公告)日：2011-06-15

    申请号：EP10191934.8

    申请日：2010-11-19

    申请人： OMRON Corporation

    发明人： Hosokawa, Hayami ,  Yasuda, Naru ,  Hamana, Kentaro

    IPC分类号： G02B6/43

    CPC分类号： G02B6/43 ,  G02B6/4214 ,  H04B10/803 ,  H04M1/0235 ,  H05K1/0274 ,  H05K1/14

    摘要： Even if a board-to-board distance is lower than a bending resistance limit of an optical transmission path (4) (bending resistance cannot be maintained), the optical transmission path (4) is accommodated within the distance to realize a reduced accommodation space. An optical transmission module (1) includes the optical transmission path (4) that performs optical transmission between a first circuit board (20) and a second circuit board (30), and the first circuit board (20) and the second circuit board (30) are disposed opposite to each other. The optical transmission path (4) includes a bending portion (4C) having a folded structure having a bending radius R, and a circumferential portion drawn by the bending radius R is provided substantially perpendicular to board surfaces of the first circuit board (20) and the second circuit board (30).

    摘要翻译： 即使板对板距离低于光传输路径（4）的弯曲阻力极限（不能保持弯曲阻力），光传输路径（4）容纳在距离内以实现缩小的容纳空间 。 光传输模块（1）包括在第一电路板（20）和第二电路板（30）之间执行光传输的光传输路径（4），以及第一电路板（20）和第二电路板 30）彼此相对设置。 光传输路径（4）包括具有弯曲半径R的折叠结构的弯曲部分（4C），并且由弯曲半径R绘制的圆周部分基本上垂直于第一电路板（20）的板表面和 第二电路板（30）。

    OPTICAL INTERCONNECT
    9.
    发明公开
    OPTICAL INTERCONNECT 审中-公开
    光连接器

    公开(公告)号：EP2176695A1

    公开(公告)日：2010-04-21

    申请号：EP08768551.7

    申请日：2008-06-16

    申请人： Hewlett-Packard Development Company, L.P.

    发明人： WANG, Shih-yuan ,  SIGALAS, Mihail ,  WU, Wei

    IPC分类号： G02B6/36

    CPC分类号： H04B10/803

    摘要： An optical interconnect has a plurality of optical data sources, a plurality of optical data receivers, a diffractive optical element configured to diffract an optical beam from at least one alignment optical source to at least one sensor, and an aligning element configured to align optical beams from the optical data sources to said optical data receivers, according to readings from the sensor.