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公开(公告)号:EP3866234A1
公开(公告)日:2021-08-18
申请号:EP20157590.9
申请日:2020-02-17
申请人: Haldor Topsøe A/S
发明人: HEIREDAL-CLAUSEN, Thomas , RASS-HANSEN, Jeppe , NØRBY, Tobias Holt , BLENNOW, Bengt Peter Gustav , KÜNGAS, Rainer , NIELSEN, Martin Refslund
IPC分类号: H01M8/0202 , H01M8/0247 , H01M8/0271 , H01M8/124 , C25B9/04 , H01M8/0258 , H01M8/0273 , H01M8/0276 , H01M8/028 , H01M8/0286
摘要: A Solid Oxide Cell stack has an integrated interconnect and spacer, which is formed by bending a surplus part of the plate interconnect 180° to form a spacer part on top of the interconnect and connected to the interconnect at least by the bend.