公开(公告)号：EP2587529B1

公开(公告)日：2018-01-17

申请号：EP11798145.6

申请日：2011-06-21

申请人： Hamamatsu Photonics K.K.

发明人： TERADA Hirotoshi ,  MATSUURA Hiroyuki

IPC分类号： G01N21/95 ,  H01L21/683 ,  H01L21/687 ,  H01L21/66

CPC分类号： G01N21/9501 ,  G01N21/01 ,  H01L21/6838 ,  H01L21/68757 ,  H01L21/68785 ,  H01L22/12

摘要： A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W formed with a semiconductor device D is arranged and a second surface 14 that is a surface opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 onto which light from the semiconductor device D is made incident and a light emitting surface 17 from which light made incident from the light incident surface 16 is emitted, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed.

公开(公告)号：EP3904893A1

公开(公告)日：2021-11-03

申请号：EP19904491.8

申请日：2019-10-09

申请人： Hamamatsu Photonics K.K.

发明人： NAKAMURA Tomonori ,  NONAKA Hirotaka ,  MATSUURA Hiroyuki ,  TERADA Hirotoshi

IPC分类号： G01R31/302 ,  G01R31/26 ,  H01L23/473

摘要： Provided is a cooling unit to be used in an inspection of a semiconductor device. The cooling unit includes a jacket for dissipating heat of the semiconductor device. The jacket is provided with a light passing portion for passing light from the semiconductor device. The jacket has a space defining surface that faces the semiconductor device and defines a space between the space defining surface and the semiconductor device in a state where the light passing portion faces the semiconductor device. The jacket is provided with a supply flow path through which a fluid to be supplied to the space flows.

公开(公告)号：EP2587529A1

公开(公告)日：2013-05-01

申请号：EP11798145.6

申请日：2011-06-21

申请人： Hamamatsu Photonics K.K.

发明人： TERADA Hirotoshi ,  MATSUURA Hiroyuki

IPC分类号： H01L21/66

CPC分类号： G01N21/9501 ,  G01N21/01 ,  H01L21/6838 ,  H01L21/68757 ,  H01L21/68785 ,  H01L22/12

摘要： A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W formed with a semiconductor device D is arranged and a second surface 14 that is a surface opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 onto which light from the semiconductor device D is made incident and a light emitting surface 17 from which light made incident from the light incident surface 16 is emitted, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed.