公开(公告)号：EP3185285A1

公开(公告)日：2017-06-28

申请号：EP15834099.2

申请日：2015-08-18

申请人： Nitto Denko Corporation

发明人： MAENO, Youhei

IPC分类号： H01L21/683 ,  B82B1/00 ,  C01B32/05 ,  H01L21/677

CPC分类号： H01L21/68757 ,  B82B1/00 ,  B82Y30/00 ,  C01B32/05 ,  H01L21/677 ,  H01L21/683 ,  H01L21/68785

摘要： Provided is a semiconductor transport member that includes a semiconductor mounting member capable of expressing a strong gripping force and unlikely to cause a contaminant to adhere and remain on a semiconductor side. Also provided is a semiconductor mounting member capable of expressing a strong gripping force and unlikely to cause a contaminant to adhere and remain on a semiconductor side. The semiconductor transport member of the present invention includes: a carrying base; and a semiconductor mounting member, in which: the semiconductor mounting member includes a fibrous columnar structure; the fibrous columnar structure includes a fibrous columnar structure including a plurality of fibrous columnar objects; the fibrous columnar objects are each aligned in a direction substantially perpendicular to the carrying base; and a surface of the fibrous columnar structure on an opposite side to the carrying base has a coefficient of static friction against a glass surface of 4.0 or more.

摘要翻译： 本发明提供一种半导体输送部件，该半导体输送部件具有半导体搭载部件，该半导体搭载部件能够表现出较强的把持力，不易引起污染物附着并残留在半导体侧。 还提供了一种半导体安装构件，其能够表现出强大的夹持力并且不易引起污染物粘附并保留在半导体侧。 本发明的半导体传送部件包括：承载台; 以及半导体安装部件，其中：所述半导体安装部件包括纤维状柱状结构; 所述纤维状柱状结构体包含具有多个纤维状柱状体的纤维状柱状结构体， 纤维状柱状物各自在基本垂直于承载底座的方向上对齐; 所述纤维状柱状结构体的与所述输送基体相反一侧的表面的相对于玻璃面的静摩擦系数为4.0以上。

公开(公告)号：EP2537304B1

公开(公告)日：2017-04-12

申请号：EP11704239.0

申请日：2011-02-18

申请人： Mapper Lithography IP B.V.

发明人： DE JONG, Hendrik Jan

IPC分类号： H04L21/00 ,  G03F7/00 ,  H01L21/67 ,  G03F7/20 ,  H01J37/317 ,  G03B27/58 ,  H01L21/687 ,  H01J37/20 ,  B82Y10/00

CPC分类号： H01L21/6875 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/707 ,  H01J37/3174 ,  H01L21/68757

公开(公告)号：EP2955167A4

公开(公告)日：2016-10-26

申请号：EP14748688

申请日：2014-01-28

申请人： TOYO TANSO CO

发明人： SHINOHARA MASATO

IPC分类号： C04B41/89 ,  C04B41/87 ,  C23C16/458 ,  C30B25/12 ,  C30B29/36 ,  H01L21/683

CPC分类号： C04B41/89 ,  C04B35/522 ,  C04B41/00 ,  C04B41/009 ,  C04B41/4529 ,  C04B41/5059 ,  C04B41/5061 ,  C04B41/52 ,  C04B41/53 ,  C23C16/4581 ,  C30B29/36 ,  C30B35/00 ,  H01L21/683 ,  H01L21/68757 ,  Y10T428/24612 ,  Y10T428/265 ,  Y10T428/30 ,  C04B41/4531 ,  C04B41/4519 ,  C04B41/5001 ,  C04B41/5346 ,  C04B41/455 ,  C04B41/5057

摘要： Provided is a silicon carbide-tantalum carbide composite having excellent durability. A silicon carbide-tantalum carbide composite (1) includes: a body (10) whose surface layer is at least partly formed of a first silicon carbide layer (12); a tantalum carbide layer (20) ; and a second silicon carbide layer (13). The tantalum carbide layer (20) is disposed over the first silicon carbide layer (12). The second silicon carbide layer (13) is interposed between the tantalum carbide layer (20) and the first silicon carbide layer (12). The second silicon carbide layer (13) has a C/Si composition ratio of not less than 1.2 as measured by X-ray photoelectron spectroscopy. The second silicon carbide layer (13) has a peak intensity ratio G/D of not less than 1.0 between the G-band and D-band of carbon as measured by Raman spectroscopy.

公开(公告)号：EP2940724A4

公开(公告)日：2016-09-14

申请号：EP13868287

申请日：2013-12-11

申请人： KYOCERA CORP

发明人： MOMIKURA HIROYASU

IPC分类号： C23C14/04 ,  C23C14/10 ,  G03F7/20 ,  H01L21/027 ,  H01L21/304 ,  H01L21/687

CPC分类号： H01L21/683 ,  C23C14/042 ,  H01L21/6875 ,  H01L21/68757

摘要： An attachment member (1) according to an embodiment of the present invention includes: a base (4) composed of a ceramic sintered body, which has an annular part (6) corresponding to a shape of an object (2), a bottom surface (7) located inside the annular part (6), and a plurality of column shaped protruding parts (8) protruding from the bottom surface (7), and is provided with an attachment surface (3) supporting and attaching the object (2) inside the annular part (6) by a plurality of the protruding parts (8) ; and a film (5) that covers at least a part of the bottom surface (7), exposes top surfaces (11) of the protruding parts (8), and has higher hydrophilicity than the base (4). Accordingly, it is possible to provide the attachment member (1) that is excellent in attachment force for the object (2), and suppresses contamination of the object (2) .

公开(公告)号：EP3041039A1

公开(公告)日：2016-07-06

申请号：EP14840632.5

申请日：2014-06-27

申请人： KYOCERA Corporation

发明人： SATO, Masahiro

IPC分类号： H01L21/683

CPC分类号： H01L21/67103 ,  C30B25/18 ,  C30B29/06 ,  H01L21/67109 ,  H01L21/67288 ,  H01L21/6835 ,  H01L21/68757

摘要： A sample holder of the present invention includes a base body formed of ceramic substrates laminated to each other and having an upper surface functioning as a sample holding surface. In this sample holder, the base body includes a first ceramic substrate including a flow path for a heating medium and a second ceramic substrate which is laminated at an upper side than the first ceramic substrate, which has an upper surface functioning as the sample holding surface, and which is formed of the same material as that of the first ceramic substrate, and the average grain diameter of ceramic grains forming the second ceramic substrate is smaller than that of ceramic grains forming the first ceramic substrate.

摘要翻译： 本发明的样品保持器包括由彼此层叠的具有用作样品保持表面的上表面的陶瓷基板形成的基体。 在该样本保持器中，基体包括第一陶瓷基板，其包括用于加热介质的流路和层叠在第一陶瓷基板的上侧的第二陶瓷基板，该第二陶瓷基板具有用作样品保持面的上表面 并且由与第一陶瓷基板相同的材料形成，并且形成第二陶瓷基板的陶瓷晶粒的平均粒径小于形成第一陶瓷基板的陶瓷晶粒的平均粒径。

公开(公告)号：EP2610897A4

公开(公告)日：2015-12-30

申请号：EP11819681

申请日：2011-06-30

申请人： MITSUI SHIPBUILDING ENG ,  ADMAP INC

发明人： KAWAMOTO SATOSHI ,  NAKAMURA MASAKI ,  TAKAHARA HIDEYUKI ,  WU ROBERT

IPC分类号： H01L21/3065 ,  C04B41/87 ,  C04B41/91 ,  C23C16/32 ,  C23C16/50 ,  H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC分类号： C04B41/87 ,  H01J37/32477 ,  H01J37/3255 ,  H01J37/32559 ,  H01L21/68757

公开(公告)号：EP2485252B1

公开(公告)日：2015-08-26

申请号：EP12153363.2

申请日：2012-01-31

申请人： Xycarb Ceramics B.V.

发明人： Van Munster, Marcus Gerardus ,  Van Velzen, Wilhelmus Johannes Mattheus ,  Van Der Heijden, Johannes Leonardus Lamberdina

IPC分类号： H01L21/66

CPC分类号： H01L21/68757 ,  C23C16/4581 ,  C30B25/12 ,  H01L22/14

公开(公告)号：EP2891174A1

公开(公告)日：2015-07-08

申请号：EP13833578.1

申请日：2013-09-02

申请人： Semiconductor Technologies & Instruments Pte Ltd.

发明人： LIN, Jing

IPC分类号： H01L21/68 ,  H01L21/677 ,  H01L21/683

CPC分类号： H01L21/681 ,  B25J11/0095 ,  B25J15/0616 ,  B25J15/0658 ,  B25J15/0666 ,  G01B11/27 ,  G01N21/9501 ,  G01N2201/025 ,  H01L21/67144 ,  H01L21/67706 ,  H01L21/6838 ,  H01L21/68757 ,  Y10T29/49826

摘要： A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

公开(公告)号：EP2742016A1

公开(公告)日：2014-06-18

申请号：EP12768735.8

申请日：2012-08-08

申请人： Carl Zeiss SMT GmbH

发明人： CHUNG, Hin Yiu Anthony ,  DOCHNAHL, Axel ,  STAMPE, Tim ,  PETZOLD, Werner ,  REIMANN, Bernd

IPC分类号： C04B37/00 ,  G03F7/20 ,  H01L21/67 ,  H01L21/683 ,  C04B37/04

CPC分类号： C03C27/00 ,  C04B35/63452 ,  C04B37/008 ,  C04B37/047 ,  C04B2235/96 ,  C04B2237/341 ,  C04B2237/365 ,  C04B2237/52 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/70 ,  H01L21/68757 ,  H01L21/68785

摘要： The invention relates to a method for connecting two components (1, 2) having different stiffnesses (E1, E2), comprising: bonding a plate-shaped body (3) onto the component (1) having greater stiffness (E1), the bonding being preferably performed using a joining agent, in particular an adhesive, correcting deformations produced by the bonding on the plate-shaped body (3), and connecting the component (2) having the lower stiffness (E2) to the plate- shaped body (3), in particular by wringing, by anodic bonding or by fusion bonding. The invention also relates to a composite structure (5), which has been produced according to the method and which can serve, for example, as a holding device for a wafer (6). Moreover, the first component (1) can serve as a carrier for the second component (2), e.g. if the latter is embodied as an EUV mirror.

公开(公告)号：EP2660225A1

公开(公告)日：2013-11-06

申请号：EP11853630.9

申请日：2011-07-15

申请人： Toyo Tanso Co., Ltd.

发明人： SETANI, Kaoru ,  MATSUNAGA, Hiroaki ,  TAKEDA, Akiyoshi

IPC分类号： C04B41/87 ,  C01B31/30 ,  C01B31/34 ,  C04B35/52

CPC分类号： H01L21/68757 ,  C01B32/20 ,  C01B32/914 ,  C01B32/949 ,  C04B41/009 ,  C04B41/5057 ,  C04B41/87 ,  Y10T156/10 ,  Y10T428/30 ,  C04B35/522 ,  C04B41/4517 ,  C04B41/4545 ,  C04B41/4556

摘要： A carbon material, a jig, and a method of manufacturing the carbon material are provided that can prevent dust emission and also improve the temperature resistance under a nitrogen atmosphere. In a carbon material having a carbon substrate and a metal carbide layer formed on a surface of the carbon substrate, the metal carbide layer includes molybdenum carbide and/or iron carbide. The carbon substrate embedded in a surface modifying agent containing a pyrolytic hydrogen halide generating agent and molybdenum particles and/or iron particles is heat-treated together with a carbon member other than the carbon substrate.

摘要翻译： 提供碳材料，夹具和碳材料的制造方法，其可以防止粉尘的发射，并且还可以在氮气气氛下提高耐温性。 在具有碳基板和形成在碳基板的表面上的金属碳化物层的碳材料中，金属碳化物层包括碳化钼和/或碳化铁。 嵌入含有热解卤化物发生剂和钼颗粒和/或铁颗粒的表面改性剂中的碳基板与碳基板以外的碳构件一起进行热处理。