LOW FRICTION, DUCTILE, MULTILAYER ELECTRODEPOSITS
    1.
    发明公开
    LOW FRICTION, DUCTILE, MULTILAYER ELECTRODEPOSITS 失效
    MULTI-LAYER伸缩性电解涂覆低摩擦

    公开(公告)号:EP0914691A1

    公开(公告)日:1999-05-12

    申请号:EP97917849.0

    申请日:1997-04-04

    申请人: Handy & Harman

    IPC分类号: C25D15 C25D5 H05K3

    摘要: The present invention relates to composite articles including a surface layer (4) of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of friction and low insertion force and fretting corrosion in separable electronic connectors, and to methods for preparing the plated articles. The polymeric particles have a size between about 0.1 to 0.45 ν in diameter to reduce the coefficient of friction of the resultant deposit to about 0.45 or below. Also, the deposit has excellent electrical properties and can be successfully soldered. The invention also relates to a solution for plating the surface layer (4) of the composite articles, which surface layer (4) reduces insertion force and fretting corrosion of separable electronic connectors.