公开(公告)号：EP2855616A1

公开(公告)日：2015-04-08

申请号：EP13797350.9

申请日：2013-05-30

申请人： Henkel (China) Co. Ltd. ,  Henkel Corporation

发明人： ZHANG, Raymond ,  LU, Daoqiang ,  ATTARWALA, Shabbir

IPC分类号： C09J175/14 ,  C08L75/14

CPC分类号： C09J133/10 ,  B32B37/12 ,  B32B38/0008 ,  B32B2457/202 ,  C08G18/307 ,  C08G18/672 ,  C08G18/8175 ,  C09J5/00 ,  C09J175/16

摘要： The present invention provides an adhesive composition, which can be cured through three ways: UV-radiation curing, thermal-radiation curing and moisture-curing. The adhesive composition comprises a) an oligomer having an isocyanate group and a (meth)acryloxy group; b) a (meth)acrylic monomer and/or oligomer not having an isocyanate group; c) a photoinitiator; and d) a peroxide.

摘要翻译： 本发明提供一种粘合剂组合物，其可以通过三种方式固化：UV辐射固化，热辐射固化和湿固化。 粘合剂组合物包含：a）具有异氰酸酯基和（甲基）丙烯酰氧基的低聚物; b）不具有异氰酸酯基的（甲基）丙烯酸单体和/或低聚物; c）光引发剂; 和d）过氧化物。

公开(公告)号：EP2736998A1

公开(公告)日：2014-06-04

申请号：EP12818089.0

申请日：2012-07-20

申请人： Henkel (China) Co. Ltd. ,  Henkel US IP LLC

发明人： ZHANG, Raymond ,  LU, Daoqiang ,  ATTARWALA, Shabbir

IPC分类号： C09J175/04 ,  C09J133/06

CPC分类号： C09J133/14 ,  C08F290/067 ,  C09J151/08 ,  C09J175/14 ,  C08F222/1006 ,  C08F220/28 ,  C08F2220/343 ,  C08F220/20 ,  C08F2220/282 ,  C08F2222/104

摘要： The present invention relates to an adhesive composition, which comprises, based on the total weight of the adhesive composition: (1) from 38.0 to 75.0 percent by weight of a urethane oligomer carrying (meth)acryloyloxy group; (2) from 0.1 to 10.0 percent by weight of a multifunctional (meth)acrylate monomer; (3) from 15.0 to 60.0 percent by weight of a monofunctional (meth)acrylate monomer; (4) from 0.5 to 5.0 percent by weight of a photoinitiator; (5) from 0.1 to 5.0 percent by weight of a silane coupling agent; and (6) from 0 to 5.0 percent by weight of an additive, which is selected from one or more of the group consisting of a tackifier, a thickening agent, a flame retardant, a leveling agent and a thermal initiator. The cured adhesive composition has a high transparency and a high bonding strength, and the adhesive composition can be used for bonding various substrates in display devices.