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    B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES
    3.
    发明公开
    B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES 审中-公开
    胶粘剂无硬化CLASS B晶圆背面涂层

    公开(公告)号：EP2694611A1

    公开(公告)日：2014-02-12

    申请号：EP11862911.2

    申请日：2011-04-25

    申请人： Henkel Corporation

    发明人： WANG, Eric, C. ,  BECKER, Kevin, Harris ,  ZHUO, Qizhuo

    IPC分类号： C09J163/00 ,  C09J121/00 ,  C09J11/04 ,  C09J4/02

    CPC分类号： C09J163/04 ,  C08G59/08 ,  C08G59/34 ,  C08G59/68 ,  C09J4/06 ,  C09J121/00 ,  C09J163/10

    摘要： This invention is an adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler. The composition is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer (an elastomer having carbon to carbon unsaturation) and an epoxy elastomer, present in an amount within the range of 20% to 40% by weight, and preferably about 30% by weight of the adhesive composition. The epoxy resin is present in the adhesive composition in the range of 3% to 10% by weight, and preferably about 5% by weight. The reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation to react with the acrylate elastomer, providing cross-linking within the composition after cure. One or both must be able to act as a diluent or solvent for the elastomeric polymer, and together are present in the adhesive composition within the range of 35% to 50% by weight of the composition. The filler is a non-conductive filler and makes up the remainder of the composition to a total of 100% by weight.

    PRE- CUT WAFER APPLIED UNDERFILL FILM
    7.
    发明公开
    PRE- CUT WAFER APPLIED UNDERFILL FILM 审中-公开
    在预切晶片安装在填充膜

    公开(公告)号：EP2671249A2

    公开(公告)日：2013-12-11

    申请号：EP12742755.7

    申请日：2012-01-27

    申请人： Henkel Corporation

    发明人： KIM, Younsang ,  HOANG, Gina ,  GUINO, Rose

    IPC分类号： H01L21/50

    CPC分类号： H01L21/02227 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/481 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/73104 ,  H01L2224/83191

    摘要： A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.

    MOISTURE-CURABLE HOT-MELT ADHESIVE AGENT
    10.
    发明公开
    MOISTURE-CURABLE HOT-MELT ADHESIVE AGENT 审中-公开
    FEUCHTIGKEITSHÄRTBARESCHMELZKLEBERZUSAMMENSETZUNG

    公开(公告)号：EP2610321A1

    公开(公告)日：2013-07-03

    申请号：EP11819949.6

    申请日：2011-08-24

    申请人： Henkel Corporation

    发明人： TAMOGAMI, Tsuyoshi ,  YOSHIDA, Yoshio

    IPC分类号： C09J175/04 ,  C09J133/06

    CPC分类号： C09J133/12 ,  C08G2170/20 ,  C09J133/02 ,  C09J133/06 ,  C09J133/10 ,  C09J175/04 ,  C08G18/10 ,  C08G18/307

    摘要： Disclosed is a moisture-curable hot melt adhesive which has a high initial adhesive strength and is also excellent in adhesion to a slightly adhesive material. The adhesive comprises an urethane prepolymer having an isocyanate group at its end, and (A) an acrylic polymer, wherein the acrylic polymer has a polymer (A1) containing a moiety derived from a (meth)acrylic acid derivative (a1) having an alkyl group with 6 or more carbon atoms. In some embodiments, the acrylic polymer (A) has an alicyclic structure.

    摘要翻译： 公开了一种具有高初始粘合强度并且对轻微粘合材料的粘合性也优异的可湿气固化的热熔粘合剂。 粘合剂包含在其末端具有异氰酸酯基团的氨基甲酸酯预聚物和（A）丙烯酸类聚合物，其中所述丙烯酸类聚合物具有含有衍生自具有烷基的（甲基）丙烯酸衍生物（a1）的部分的聚合物（A1） 具有6个或更多个碳原子的基团。 在一些实施方案中，丙烯酸类聚合物（A）具有脂环结构。