公开(公告)号：EP3041627A1

公开(公告)日：2016-07-13

申请号：EP14842807.1

申请日：2014-07-09

申请人： Henkel IP & Holding GmbH

发明人： RECTOR, Louis P. ,  KUDER, Harry Richard ,  SANCHEZ, Juliet Grace ,  PEREZ, Albert P. ,  BEARDEN, Kathryn

IPC分类号： B22F3/10 ,  C22C49/12 ,  C23C26/00 ,  B82Y30/00

CPC分类号： B23K35/3006 ,  B22F1/0025 ,  B22F1/0059 ,  B22F3/10 ,  B22F3/1003 ,  B22F3/1035 ,  B22F3/23 ,  B22F7/08 ,  B23K35/0233 ,  B23K35/262 ,  B23K35/302 ,  B23K35/3066 ,  B23K35/362 ,  B82Y30/00 ,  C22C1/0491 ,  C22C5/06 ,  C22C9/00 ,  C22C13/00 ,  C22C26/00 ,  C22C38/002 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/52 ,  C22C49/12 ,  C22C2026/002 ,  C23C24/106 ,  H01L2224/83101 ,  H01L2224/83825 ,  H01L2224/8384

摘要： A sintering film comprising one or more metals, one or more metal alloys, or blends of one or more metals and one or more metal alloys, is prepared optionally using a solid or semi-solid organic binder. The organic binder can have fluxing functionality; the organic binder can be one that will partially or completely decompose upon sintering of the metal or metal alloy in the composition. In one embodiment, the sintering film is provided on an end use substrate, such as a silicon die or wafer, or a metal circuit board or foil, or the sintering film is provided on a carrier, such as a metal mesh. Preparation is accomplished by dispersing the metal or metal alloy in a suitable solvent, with or without a binder, and exposing the composition to high temperature to evaporate off the solvent and partially sinter the metal or metal alloy.