公开(公告)号：EP4359152A1

公开(公告)日：2024-05-01

申请号：EP22734584.0

申请日：2022-06-17

Applicant: AB Sandvik Coromant

Inventor： DAHL, Leif ,  ULITZKA, Tim

IPC: B22F7/06 ,  B22F5/00 ,  B23K1/00 ,  B23K1/008 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  C22C5/06 ,  C22C5/08 ,  C22C38/06 ,  C22C38/10 ,  C22C38/12 ,  C22C38/14 ,  C22C38/44 ,  C22C38/50 ,  C22C38/52

CPC classification number: B23K35/3006 ,  B23K35/0233 ,  B23K35/025 ,  B23K1/0008 ,  B23K1/008 ,  B22F2005/00120130101 ,  B23K35/004 ,  B22F7/06 ,  C22C38/105 ,  C22C38/12 ,  C22C38/14 ,  C22C38/44 ,  C22C38/50 ,  C22C38/52 ,  C22C38/06 ,  C22C5/06 ,  C22C5/08 ,  B23K1/19 ,  B23K31/025 ,  B23K2101/2020180801 ,  B23K2103/0420180801 ,  B23K2103/1620180801 ,  B23K2103/1820180801

公开(公告)号：EP3137253B1

公开(公告)日：2018-12-12

申请号：EP14891039.1

申请日：2014-10-21

Applicant: LIBURDI ENGINEERING LIMITED

Inventor： GONCHAROV, Alexander B. ,  LIBURDI, Joseph ,  LOWDEN, Paul

IPC: B23K35/02 ,  B23K35/30 ,  C22C19/05 ,  B23K1/00 ,  B23K9/167 ,  B23K103/02 ,  B23K103/18

CPC classification number: C22C19/055 ,  B23K1/00 ,  B23K9/167 ,  B23K26/211 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/0261 ,  B23K35/304 ,  B23K2103/02 ,  B23K2103/26

Abstract: A ductile boron bearing nickel based welding material which includes boron within the range of 0.4 - 0.6 wt. % B, carbon from a trace amount to 0.04 wt. % C, 17 - 23 wt. % Cr, 0.35 - 10 wt. % Mo, 0.1 - 4.15 wt. % Nb with nickel or iron and impurities to balance for manufacturing of welding and brazing wires, powders and foils used in the repair of various articles made of nickel, cobalt and iron based alloys.

公开(公告)号：EP3027350B8

公开(公告)日：2018-10-31

申请号：EP14745146.2

申请日：2014-07-31

Applicant: SAXONIA Technical Materials GmbH

Inventor： WIEHL, Gunther ,  KEMPF, Bernd ,  SCHNEE, Daniel ,  STARCK, Sebastian ,  RIES, Helmut ,  THIEROLF, Steven

IPC: B23K35/28 ,  B23K35/30 ,  C22C5/06 ,  C22C5/08 ,  C22C9/04 ,  C22C9/05 ,  C22C30/02 ,  C22C30/06

CPC classification number: B23K35/302 ,  B23K1/0006 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0266 ,  B23K35/24 ,  B23K35/28 ,  B23K35/282 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/362 ,  B32B15/01 ,  B32B15/013 ,  B32B15/015 ,  B32B2250/40 ,  C21D9/0068 ,  C22C1/02 ,  C22C9/00 ,  C22C30/00 ,  C22C30/02 ,  C22C30/04 ,  C22C30/06 ,  C22F1/08 ,  C22F1/14

Abstract: The present invention relates to novel brazing filler metals comprising copper, silver, zinc, manganese and at least one metal selected from the group indium, gallium and tin.

公开(公告)号：EP2803438B1

公开(公告)日：2018-10-24

申请号：EP13865331.6

申请日：2013-11-22

Applicant: MITSUBISHI ALUMINUM CO., LTD. ,  Taiyo Nippon Sanso Corporation

Inventor： EDO Masakazu ,  MIYAKE Hideyuki ,  AKIYAMA Masatoshi ,  NOMURA Yuji ,  NOSE Norihiro ,  AMANO Hiroki

IPC: B23K1/19 ,  B23K1/00 ,  B23K31/02 ,  B23K35/22 ,  B23K35/28 ,  C22C21/00 ,  B23K101/14 ,  B23K103/10 ,  B23K35/38

CPC classification number: B23K1/008 ,  B23K1/0012 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/22 ,  B23K35/28 ,  B23K35/286 ,  B23K35/38 ,  B23K2103/10 ,  B32B15/016 ,  C22C21/00 ,  C22C21/02 ,  Y10T428/12764

Abstract: In order to enable a satisfactory fluxless brazing without needing flux or vacuum facilities, a brazing object including an aluminum alloy material provided with an Al-Si-Mg brazing filler metal is joined by the Al-Si-Mg brazing filler metal without the use of flux by heating the aluminum alloy material, when raising the temperature in a brazing furnace, at least in a temperature range of 450°C to before melting of the filler metal under a first inert gas atmosphere having an oxygen concentration of preferably 50 ppm and following by heating at least at or above a temperature at which the filler metal starts to melt under a second inert gas atmosphere having an oxygen concentration of preferably 25 ppm and a nitrogen gas concentration of preferably 10% by volume or less. The oxygen concentration and nitrogen concentration in the atmosphere in the course of brazing are controlled in this way, whereby the reliability of a joint is remarkably improved, compared with conventional fluxless brazing methods, while suppressing cost increases as much as possible.

公开(公告)号：EP2799181B1

公开(公告)日：2018-09-26

申请号：EP12861511.9

申请日：2012-12-25

Applicant: Senju Metal Industry Co., Ltd

Inventor： OHNISHI Tsukasa ,  YOSHIKAWA Shunsaku ,  ISHIBASHI Seiko ,  FUJIMAKI Rei

IPC: B23K35/26 ,  B23K1/00 ,  B23K35/14 ,  C22C13/00 ,  H05K3/34 ,  B23K101/40 ,  H05K1/02 ,  H01L27/00 ,  H01L23/552 ,  H01L23/42 ,  B23K35/02 ,  H01L23/373

CPC classification number: B23K35/262 ,  B23K35/0233 ,  B23K35/0244 ,  C22C13/00 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/552 ,  H01L27/00 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10371 ,  H01L2924/00

Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn.

公开(公告)号：EP2743978B1

公开(公告)日：2018-05-02

申请号：EP12823914.2

申请日：2012-08-10

Applicant: Mitsubishi Materials Corporation

Inventor： KUROMITSU Yoshirou ,  NAGATOMO Yoshiyuki ,  TERASAKI Nobuyuki ,  SAKAMOTO Toshio ,  MAKI Kazunari ,  MORI Hiroyuki ,  ARAI Isao

IPC: H01L23/13 ,  H01L23/36 ,  H05K1/02 ,  H05K1/05 ,  C04B35/645 ,  C04B37/02 ,  H01L23/373 ,  H01L23/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  B23K35/26 ,  B23K35/30 ,  B23K35/02 ,  C22C9/00 ,  C22C13/00 ,  C22C21/00

CPC classification number: H05K3/103 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/262 ,  B23K35/3006 ,  C04B35/645 ,  C04B37/021 ,  C04B37/025 ,  C04B37/026 ,  C04B2237/064 ,  C04B2237/121 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/60 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  C22C9/00 ,  C22C13/00 ,  C22C21/00 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/83455 ,  H01L2924/01322 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K3/38 ,  Y10T29/49155 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01029 ,  H01L2924/00

Abstract: A power module substrate (10) includes an insulating substrate (11), and a circuit layer (12) that is formed on one surface of the insulating substrate (11). The circuit layer (12) is formed by bonding a first copper plate (22) onto one surface of the insulating substrate (11). Prior to bonding, the first copper plate (22) has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.

公开(公告)号：EP3302872A1

公开(公告)日：2018-04-11

申请号：EP16728665.7

申请日：2016-06-06

Applicant: Morgan Advanced Ceramics, Inc.

Inventor： CLARK, Richard Angus ,  OYAMA, Toshimasa ,  SLUTZ, David Earl ,  KAMBOJ, Jaspal Singh ,  VANEGAS-HURTADO, Edgar Giovanni

IPC: B23K35/32 ,  B23K35/00 ,  B23K35/02

CPC classification number: B23K35/0222 ,  B23K1/0008 ,  B23K35/00 ,  B23K35/001 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/325 ,  B23K35/36

Abstract: A process for joining articles comprises the steps of: joining the articles together at a brazing temperature to form one or more brazed joints in a brazed assembly, wherein at least one of the one or more brazed joints comprises a filler at least in part capable of age hardening at a temperature below the brazing temperature; and heat treating the brazed assembly at a temperature and for a time sufficient to age harden the filler at least in part; wherein the articles comprise at least one diamond body, and the filler comprises an active brazing alloy for brazing to the at least one diamond body.

公开(公告)号：EP3078929B1

公开(公告)日：2018-01-31

申请号：EP15199686.5

申请日：2015-12-11

Applicant: Alfa Laval Corporate AB

Inventor： SJÖDIN, Per

IPC: F28D9/00 ,  F28F3/04 ,  F28F21/08 ,  B23K1/00 ,  B23K1/008 ,  B23K35/02 ,  B23K35/30

CPC classification number: B21D53/04 ,  B23K1/0012 ,  B23K1/008 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/30 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/14 ,  B23K2103/14 ,  B23P15/26 ,  F28D9/005 ,  F28D9/0093 ,  F28F3/042 ,  F28F21/086 ,  F28F21/089 ,  F28F2275/045

Abstract: A method of producing a heat exchanger, comprising: obtaining a titanium plate (201) that has been cladded with a melting depressant foil (208), and heat treated for improving ductile properties; pressing a pattern in the titanium plate (201); stacking the titanium plate (201) on a number of similar titanium plates (201, 401); heating the stack of titanium plates to a temperature above 850 ºC and below the melting point of titanium, the melting depressant foil (208) causing surface layers (214) of the titanium plates (201, 401) to melt and flow to contact points (240) between adjacent titanium plates (201, 401); and allowing the melted titanium to solidify, such that joints (241) are obtained at the contact points (240) between adjacent titanium plates (201, 401).

公开(公告)号：EP2672549B1

公开(公告)日：2017-11-15

申请号：EP12800398.5

申请日：2012-06-15

Applicant: LG Chem, Ltd.

Inventor： YANG, Jung-Hoon ,  CHOI, Seung-Don ,  JEON, Ji-Hoon ,  CHO, Young-Suk

IPC: H01M2/34 ,  H01M2/20 ,  H01M2/26 ,  B23K35/26 ,  B23K26/22 ,  B23K35/02 ,  H01H85/11 ,  B23K31/02 ,  B23K26/32 ,  B23K26/24

CPC classification number: H01M2/26 ,  B23K26/22 ,  B23K26/244 ,  B23K26/323 ,  B23K31/02 ,  B23K35/0233 ,  B23K35/262 ,  B23K2201/34 ,  B23K2201/38 ,  B23K2203/08 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/18 ,  H01H85/11 ,  H01M2/204 ,  H01M2/206 ,  H01M2/266 ,  H01M2/348 ,  H01M10/0525 ,  H01M2200/101 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2220/30 ,  Y10T29/49108

公开(公告)号：EP3231881A1

公开(公告)日：2017-10-18

申请号：EP17155336.5

申请日：2017-02-09

Applicant: United Technologies Corporation

Inventor： Bochiechio, Mario P. ,  Szela, Edward R. ,  Lin, Wangen ,  Raghavan, Aswin

IPC: C22C19/05 ,  B23K35/30

CPC classification number: B23K35/3033 ,  B23K1/0018 ,  B23K1/19 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C19/056 ,  F01D5/02 ,  F04D29/321 ,  F05D2220/32 ,  F05D2230/237 ,  F05D2300/175 ,  F05D2300/177

Abstract: A nickel braze alloy may include less than about 2.0 wt. % aluminum, about 18.0-23.0 wt. % cobalt, about 12.0-15.0 wt. % chromium, about 3.8-4.5 wt. % molybdenum, about 0.8-1.5 wt. % niobium, about 1.8-3.0 wt. % tantalum, less than about 2.0 wt. % titanium, about 2.0-3.5 wt. % tungsten, about 0.8-1.2 wt. % boron, about 0.02-0.10 wt. % carbon, about 0.03-0.06 wt. % zirconium, and a balance of nickel and minor amounts of impurities.

Abstract translation: 镍钎焊合金可以包括小于约2.0wt。 ％的铝，约18.0-23.0wt。 ％的钴，约12.0-15.0wt。 ％铬，约3.8-4.5wt。 ％的钼，约0.8-1.5wt。 ％铌，约1.8-3.0wt。 ％钽，小于约2.0wt。 ％的钛，约2.0-3.5wt。 ％的钨，约0.8-1.2wt。 ％的硼，约0.02-0.10wt。 ％的碳，约0.03-0.06wt。 ％的锆以及余量的镍和少量的杂质。