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公开(公告)号:EP2517058A1
公开(公告)日:2012-10-31
申请号:EP09852671.8
申请日:2009-12-21
发明人: TAN, Michael Renne Ty , BINKERT, Nathan Lorenzo , JOUPPI, Norman Paul , MCLAREN, Moray , AHN, Jung Ho
CPC分类号: G02B6/43 , G02B6/351 , G02B6/352 , G02B6/3528 , G02B6/3556 , G02B6/3596 , G02B6/3598
摘要: A circuit switched optical interconnection fabric includes a first hollow metal waveguide and a second hollow metal waveguide which intersects the first hollow metal waveguide to form an intersection. An optical element within the intersection is configured to selectively direct an optical signal between the first hollow metal waveguide and a second hollow metal waveguide.
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公开(公告)号:EP2671365A1
公开(公告)日:2013-12-11
申请号:EP11857735.2
申请日:2011-01-31
发明人: SCHLANSKER, Michael , TAN, Michael Renne Ty , BINKERT, Nathan Lorenzo , MORRIS, Dale C. , SORIN, Wayne V.
摘要: In one implementation, a cable harness switch includes a plurality of input ports, a first plurality of output ports, a second plurality of input ports, and a circuit switch module. Each input port from the plurality of input ports is configured to be coupled to a network link. Each output port from the first plurality of output ports is configured to be coupled to a network link. Each output port from the second plurality of output ports configured to be coupled to a network switch device. The circuit switch module is operatively coupled to the plurality of input ports, the first plurality of output ports, and the second plurality of output ports to define a network circuit including an input port from the plurality of input ports and an output port from the first plurality of output ports and the second plurality of output ports.
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公开(公告)号:EP2666097A1
公开(公告)日:2013-11-27
申请号:EP11855929.3
申请日:2011-01-20
发明人: BEAUSOLEIL, Raymond G. , FIORENTINO, Marco , MCLAREN, Moray , ASTFALK, Greg , BINKERT, Nathan Lorenzo , FATTAL, David A.
IPC分类号: G06F15/16
CPC分类号: G06F15/80 , G06E3/00 , G06F3/00 , G06F13/4063
摘要: In one example, a composite processor (100) includes a circuit board (1200), a first processor element package (1230), and a second processor element package (1240). The circuit board has an optical link (1211) and an electrical link (1221). The first processor element package (1230) includes a substrate (1231) with an integrated circuit (240), a sub-wavelength grating optical coupler (1232), and an electrical coupler (1233) coupled to the electrical link (1221) of the circuit board (1200). The second processor element package (1240) includes a substrate (1241) with an integrated circuit (240), a sub-wavelength grating optical coupler (1242), and an electrical coupler (1243) coupled to the electrical link (1221) of the circuit board (1220). The sub-wavelength grating optical coupler (1232) of the first processor element package (1230), the optical link (1211) of the circuit board (1220), and the sub-wavelength grating optical coupler (1242) of the second processor element package (1240) collectively define an optical communications path (1270) between the substrate (1231) of the first processor element package (1230) and the substrate (1241) of the second processor element package (1240).
摘要翻译: 在一个示例中,复合处理器(100)包括电路板(1200),第一处理器元件封装(1230)和第二处理器元件封装(1240)。 电路板具有光链路(1211)和电链路(1221)。 第一处理器元件封装1230包括具有集成电路240的基板1231,亚波长光栅光耦合器1232以及耦合到第一处理器元件封装1230的电连接1221的电耦合器1233。 电路板(1200)。 第二处理器元件封装1240包括具有集成电路240的基板1241,亚波长光栅光耦合器1242以及耦合到第二处理器元件封装1240的电连接1221的电耦合器1243。 电路板(1220)。 第一处理器元件封装(1230)的亚波长光栅光耦合器(1232),电路板(1220)的光链路(1211)以及第二处理器元件(1230)的亚波长光栅光耦合器(1242) 封装1240共同限定了第一处理器元件封装1230的衬底1231与第二处理器元件封装1240的衬底1241之间的光学通信路径1270。
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