Resin sealed electronic device and method of fabricating the same and ignition coil for internal combustion engine using the same
    5.
    发明公开
    Resin sealed electronic device and method of fabricating the same and ignition coil for internal combustion engine using the same 有权
    Verfahren zur Herstellung einer Harzvergossenen elektronischen Anordnung

    公开(公告)号:EP1043771A2

    公开(公告)日:2000-10-11

    申请号:EP00107061.4

    申请日:2000-04-04

    IPC分类号: H01L23/29 H01L21/56

    摘要: In order to provide a resin sealed electronic device which is capable of securing high reliability by packaging with a transfer molding resin (4) without using any under filler material, and a method, a resin sealed electronic device which mounts a flip chip type monolithic IC (1) on a hybrid circuit board (3) through bumps (2) and is packaged with a thermosetting resin through transfer molding, wherein the transfer molding resin (4) has a linear expansion coefficient of 3X10 -6 to 17X10 -6 and contains a filler having a particle size smaller than a height of the bump by more than 10 µm, and the resin sealed electronic device is integrated in a unit including the hybrid circuit board (3) mounting the flip chip type monolithic IC (1) through transfer molding with the transfer molding resin (4), and the bump (2) is restrained from moving by the transfer molding resin (4) flowing around at transfer-molding.

    摘要翻译: 为了提供一种树脂密封电子器件,该树脂密封电子器件能够通过用传递模塑树脂(4)封装而不使用任何填充材料来确保高可靠性,以及一种树脂密封电子器件,其安装倒装芯片型单片IC (1)通过凸块(2)在混合电路板(3)上,并通过传递模塑与热固性树脂包装,其中传递模塑树脂(4)的线性膨胀系数为3×10 -6至17×10 -3, 6>,并且包含具有比凸块的高度小于10μm的粒子的填料,并且树脂密封电子器件集成在包括安装倒装芯片型单片IC的混合电路板(3)的单元中 (1)通过传递模塑树脂(4)的传递模塑,并且通过在传递模塑过程中流动的传递模塑树脂(4)来限制凸块(2)移动。

    Ignition apparatus for use in internal combustion engine
    6.
    发明公开
    Ignition apparatus for use in internal combustion engine 失效
    Zündapparatfüreine Brennkraftmaschine

    公开(公告)号:EP0796993A3

    公开(公告)日:1999-09-01

    申请号:EP97104865.7

    申请日:1997-03-21

    IPC分类号: F02P3/02 H01F38/12

    摘要: An ignition apparatus is received in a plug hole (43a) which is formed by a cylinder head (41a) and a cylinder head cover (42a) of an internal combustion engine. A side core (18) has a slit between two horizontally extending side wall ends. The side core (18) comprises one selected from a laminated sheet structure comprised of two grain oriented silicon steel sheets, each having a slit between two horizontally extending side wall ends, and the plural slits align at a substantially same position. The slit prevents an one-turn short of a magnetic flux of the side core (18), thereby a predetermined secondary voltage more than an engine requirement secondary voltage is obtained. An ignitor reception portion comprises an independent and individual ignitor reception portion and an independent and individual coil reception portion, and the ignitor reception portion and the coil reception portion are combined.

    摘要翻译: 点火装置被容纳在由内燃机的气缸盖(41a)和汽缸盖罩(42a)形成的塞孔(43a)中。 侧芯(18)在两个水平延伸的侧壁端之间具有狭缝。 侧芯(18)包括从由两个晶粒取向的硅钢板组成的层压片结构中的一个,每个晶粒取向硅钢片在两个水平延伸的侧壁端之间具有狭缝,并且多个狭缝在基本相同的位置对准。 狭缝防止侧芯(18)的磁通小一圈,从而获得比发动机要求二次电压多的预定二次电压。 点火器接收部分包括独立且单独的点火器接收部分和独立且单独的线圈接收部分,并且点火器接收部分和线圈接收部分被组合。

    Igniter unit equipped with coil and igniter circuit for internal combustion engine
    7.
    发明公开
    Igniter unit equipped with coil and igniter circuit for internal combustion engine 失效
    点火单元包括线圈和点火电路的用于内燃发动机

    公开(公告)号:EP0826879A3

    公开(公告)日:1999-05-19

    申请号:EP97115102.2

    申请日:1997-09-01

    申请人: HITACHI, LTD.

    IPC分类号: F02P3/02

    CPC分类号: F02P3/02 F02P3/055

    摘要: In order to make bulk and weight of the upper igniter case division of the armor case, small, and to design center of the gravity of the total apparatus to be lower underneath so as to provide an igniter which is tough to the oscilliation, the igniter for the internal combustion engine has the armor case equipped with the coil department and igniter unit (30) therein, and said armor case has the igniter case having the coil department case (15 b) and the connector department (34), furthermore, said coil department case (15 b) mentioned above is inserted in the plug hole (5) of the internal combustion engine, and the igniter unit (30) is mounted in the igniter case, and furthermore, the igniter unit (30) mentioned above has the semiconductor device (31) of the simple substance silicon chip built-in the simple substance silicon chip mounting the semi-conductor for switching and the current limiting circuitry (31 b) therein, and the semi-conductor for switching mentioned above consists of the insulated bipolar transistor (IGBT) (31 a) or the power transistor.

    Induction discharge type ignition device for an internal combustion engine
    9.
    发明公开
    Induction discharge type ignition device for an internal combustion engine 失效
    Induktionsentladungsprinzip-Zündeinrichtungfüreine innere Brennkraftmaschine。

    公开(公告)号:EP0521207A1

    公开(公告)日:1993-01-07

    申请号:EP91306098.4

    申请日:1991-07-04

    申请人: HITACHI, LTD.

    IPC分类号: F02P3/04

    CPC分类号: F02P3/0552

    摘要: An induction discharge system ignition device for an internal combustion engine includes a power switching device (P sw ) for producing a voltage to be applied to the primary winding of an induction coil (11). The secondary of the induction coil is connected to apply a high-tension voltage to a spark plug (P₁ - P₆). The power switching device and the coil are particularly arranged to produce a voltage of at least 6.0kV across the electrodes of the spark plug when the spark plug has a leakage of 100kΩ. The turns ratio of the coil is, preferably, 70 or less.

    摘要翻译: 用于内燃机的感应放电系统点火装置包括用于产生施加到感应线圈(11)的初级绕组的电压的电力开关装置(Psw)。 感应线圈的次级连接以向火花塞(P1-P6)施加高压电压。 电源开关器件和线圈特别设置成当火花塞具有100k欧姆的泄漏时,在火花塞的电极上产生至少6.0kV的电压。 线圈的匝数比优选为70以下。

    Electronic device
    10.
    发明公开
    Electronic device 失效
    Elektronische Vorrichtung。

    公开(公告)号:EP0467259A2

    公开(公告)日:1992-01-22

    申请号:EP91111754.7

    申请日:1991-07-15

    申请人: HITACHI, LTD.

    IPC分类号: H01L25/16 H01L23/373

    摘要: An electronic device is formed by connecting a wiring plate (19) and an insulating plate (2) mounting semiconductor chips (1) to a base (4). A composite material plate (3), which is made by combining material (3a, 3b) having different linear thermal expansion coefficients, is inserted between the base (4) and the insulating plate through solders (5). The thickness ratio (h a /h b ) of the materials of the composite material plate (3) is selected in the manner that a strain of the solder (5) between the base (4) and the composite material plate (3) is equal to the strain of the solder (5) between the insulating plate (2) and the composite material plate (3).

    摘要翻译: 通过将布线板(19)和安装半导体芯片(1)的绝缘板(2)连接到基座(4)而形成电子设备。 通过组合具有不同线性热膨胀系数的材料(3a,3b)制成的复合材料板(3)通过焊料(5)插入到基座(4)和绝缘板之间。 复合材料板(3)的材料的厚度比(ha / hb)以基体(4)和复合材料板(3)之间的焊料(5)的应变等于 绝缘板(2)和复合材料板(3)之间的焊料(5)的应变。