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    Cooling fluid flow passage matrix for electronics cooling
    7.
    发明公开
    Cooling fluid flow passage matrix for electronics cooling 审中-公开
    用于电子器件的冷却的冷却剂流的信道矩阵

    公开(公告)号：EP2830088A3

    公开(公告)日：2015-05-27

    申请号：EP14177118.8

    申请日：2014-07-15

    申请人： Hamilton Sundstrand Corporation

    发明人： Himmelmann, Richard A. ,  Turney, Joseph

    IPC分类号： H01L23/473 ,  H05K7/20

    CPC分类号： H05K7/20218 ,  H01L23/473 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling supply package for an electronic component 22 has a supply port 17 communicating with a plurality of outer supply channels, and a return port 19 communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer 34 supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.

    Cooling assembly with direct cooling of active electronic components
    10.
    发明公开
    Cooling assembly with direct cooling of active electronic components 审中-公开
    KühlvorrichtungmitDirektkühlungaktiver elektronischer Komponenten

    公开(公告)号：EP1940213A2

    公开(公告)日：2008-07-02

    申请号：EP08004223.7

    申请日：2002-12-23

    申请人： FormFactor, Inc.

    发明人： Miller, Charles A.

    IPC分类号： H05K7/20 ,  G01R31/28

    CPC分类号： G01R31/2875 ,  G01R1/06733 ,  G01R1/07385 ,  G01R31/2863 ,  G01R31/2877 ,  G01R31/2886 ,  G01R31/2891 ,  H05K7/20218

    摘要： The invention relates to a probe card assembly (300) comprising spring probe elements (305); and a package (400) coupled to the probe elements (305), wherein the package includes at least one die (430a-c) with active electronic components, the die (430a-c) electrically connected to the package by a plurality of first compliant interconnects (432a-c), wherein each of the first compliant interconnects is a structural element that is structurally distinct from each of the probe elements (305), and at least one coolant port (442, 444) that allows a coolant to enter the package (400) and directly cool the active electronic components of each die (430a-c) during a testing operation. Therein the probe elements (305) are directly connected to the package (400).

    摘要翻译： 本发明涉及一种包括弹簧探针元件（305）的探针卡组件（300）。 以及耦合到所述探针元件（305）的封装（400），其中所述封装包括具有有源电子部件的至少一个管芯（430a-c），所述管芯（430a-c）通过多个第一 （432a-c），其中每个第一顺应性互连是在结构上与每个探针元件（305）不同的结构元件，以及允许冷却剂进入的至少一个冷却剂端口（442,444） 所述封装（400）并且在测试操作期间直接冷却每个管芯（430a-c）的有源电子部件。 其中探针元件（305）直接连接到包装（400）。