摘要:
The present invention can combine fabrics in a seamless manner by forming at least one bonding pattern line by a process comprising: printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, and/or an outer fabric or an optional mesh material in a predetermined pattern, laminating said inner fabric, optional reinforced material and outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, and outer fabric. Since the present invention combines fabrics by employing a high-frequency bonding manner in which a heat-reactive adhesive is used, it is possible to combine fabrics in a seamless manner with a bonding pattern line which is composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with a good clearness and finishing quality.
摘要:
The present invention provides a device for the preparation of a double fabric for down products, which comprises a printing means which can print an adhesive in a predetermined printing pattern on fabric; a drying means which can dry or fix the adhesive; a laminating means which can stack and laminate the fabrics on which an adhesive is printed; and a bonding means which can bond the fabrics with a cured adhesive by pressing with a predetermined pressing means and high-frequency heating to cure the adhesive; wherein said printing pattern and the pressing pattern are the same in pattern (shape), can be overlapped on the basis of the center line and have a difference in size (width) of 20% or less. The device of the present invention makes it possible a mass production of a double fabric for down products by a high-frequency bonding method and/or a pre-bonding post-cutting manner, and a bonding pattern line of the double fabric for down products thus manufactured has an excellent adhesiveness and durability and an aesthetically excellent pattern line with a good clearness and finishing quality.
摘要:
The present invention can manufacture a down product comprising at least one bonding pattern line for the compartment separation without forming sewing holes by a process comprising: printing and drying a heat-reactive adhesive on the inner surface of an inner fabric, an optional mesh material and/or an outer fabric in a predetermined pattern, laminating said inner fabric, optional mesh material and/or outer fabric, and then high-frequency heating them under pressing with a pressing pattern the same as the printing pattern to bond the inner fabric, optional mesh material and outer fabric. Since the present invention manufactures a double fabric by employing a high-frequency bonding manner in which a heat-reactive adhesive is used and/or a pre-bonding post-cutting manner in which firstly a double fabric is manufactured by forming a compartment separation line and secondly the double fabric is subjected to a cutting process, it is possible to manufacture a down product having a bonding pattern line which is composed of a bonding line with excellent adhesiveness and durability and an aesthetically excellent pattern line with a good clearness and finishing quality as well as to achieve a mass production of down products by mechanization and automation.