公开(公告)号：EP4177913A1

公开(公告)日：2023-05-10

申请号：EP22205533.7

申请日：2022-11-04

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： BI, Jianguo

IPC分类号： H01F3/10 ,  H01F17/06 ,  H01F27/25 ,  H01F27/255 ,  H01F27/26 ,  H01F27/28

摘要： Embodiments of this application provide a magnetic element and an electronic device. The magnetic element is used in an electronic device, and is configured to suppress outward radiation of an electromagnetic wave generated by a high-speed signal cable in the electronic device. The magnetic element includes a composite magnetic core and a winding, the composite magnetic core includes an external magnetic shell and an internal magnet, the internal magnet is formed by winding a strip material, the external magnetic shell partially or entirely covers a periphery of the internal magnet, the external magnetic shell is fixedly connected to the internal magnet, the winding is wound on an outer surface of the external magnetic shell, the external magnetic shell is configured to protect the internal magnet from pulling force in a process of winding the winding, and the external magnetic shell is configured to increase common-mode impedance of the magnetic element and improve a filtering effect of the magnetic element.

公开(公告)号：EP4401098A1

公开(公告)日：2024-07-17

申请号：EP23218117.2

申请日：2023-12-19

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： BI, Jianguo ,  LIN, Run ,  CHEN, Huicheng

IPC分类号： H01F27/28 ,  H01F5/04 ,  H01F27/29 ,  H01F27/06 ,  H01F41/076

CPC分类号： H01F5/04 ,  H01F2005/04320130101 ,  H01F2005/04620130101 ,  H01F27/2852 ,  H01F2027/29720130101 ,  H01F27/29 ,  H01F2027/06520130101 ,  H01F41/076

摘要： This application provides a magnetic device and a manufacturing method thereof, and an electronic device. The magnetic device includes a magnetic core, a base, a winding, and a plurality of pins. A first metal layer and a second metal layer are sequentially stacked and coated on an outer surface of a pin, which increases a cross-sectional area of the pin, increases soldering strength between the pin and a circuit board, reduces heat generated from a contact point between the pin and the circuit board, and increases a through-current capability of the pin. In this case, the reliability of soldering the magnetic device on the circuit board in high-power scenarios is enhanced.

公开(公告)号：EP4328940A1

公开(公告)日：2024-02-28

申请号：EP23191604.0

申请日：2023-08-16

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： YANG, Gun ,  CHEN, Dehong ,  SONG, Zhengang ,  BI, Jianguo

IPC分类号： H01F3/10 ,  H02M1/12 ,  H02M1/44

摘要： This application provides an inverter. The inverter includes a direct current-alternating current conversion circuit and a filter circuit, where the filter circuit is connected to an alternating current side of the direct current-alternating current conversion circuit. The filter circuit includes an integrated inductor. The integrated inductor includes a common mode magnetic core, a differential mode magnetic core, and at least two windings. The differential mode magnetic core includes a second magnetic core and a third magnetic core. The common mode magnetic core, the second magnetic core, and the third magnetic core are stacked in sequence. Each winding is located between the third magnetic core and the second magnetic core, and is wound on the common mode magnetic core and the second magnetic core. The at least two windings are spaced by the third magnetic core. This application further provides an integrated inductor. According to solutions of this application, a product volume can be reduced while common mode interference and differential mode interference are suppressed.