公开(公告)号：EP4325694A1

公开(公告)日：2024-02-21

申请号：EP23190866.6

申请日：2023-08-10

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： LIN, Run ,  HUANG, Changyao

IPC分类号： H02K1/02 ,  H02K1/2796 ,  H02K1/32

摘要： This application provides a rotor, a disc-type motor, a motor-driven system, and a vehicle. The rotor includes: a fastening sleeve, including 2P accommodation grooves provided along a circumferential direction of the fastening sleeve, where P is an integer greater than or equal to 1; and a magnetic field concentration structure, including 2P composite magnetic field concentration components, where each composite magnetic field concentration component is fixedly accommodated in a corresponding accommodation groove, and the composite magnetic field concentration component includes a permanent magnet structure and a soft magnet structure that are embedded in each other. The magnetic field concentration structure is obtained by splicing the 2P composite magnetic field concentration components along the circumferential direction of the fastening sleeve, but not an integrated structure obtained through winding. In this way, outer walls of the composite magnetic field concentration components can well fit with inner walls of the accommodation grooves. This improves stability of a connection between the magnetic field concentration structure and the fastening sleeve (or another mechanical part of the rotor, for example, a rotating shaft), so that strength of the rotor is improved.

公开(公告)号：EP4401098A1

公开(公告)日：2024-07-17

申请号：EP23218117.2

申请日：2023-12-19

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： BI, Jianguo ,  LIN, Run ,  CHEN, Huicheng

IPC分类号： H01F27/28 ,  H01F5/04 ,  H01F27/29 ,  H01F27/06 ,  H01F41/076

CPC分类号： H01F5/04 ,  H01F2005/04320130101 ,  H01F2005/04620130101 ,  H01F27/2852 ,  H01F2027/29720130101 ,  H01F27/29 ,  H01F2027/06520130101 ,  H01F41/076

摘要： This application provides a magnetic device and a manufacturing method thereof, and an electronic device. The magnetic device includes a magnetic core, a base, a winding, and a plurality of pins. A first metal layer and a second metal layer are sequentially stacked and coated on an outer surface of a pin, which increases a cross-sectional area of the pin, increases soldering strength between the pin and a circuit board, reduces heat generated from a contact point between the pin and the circuit board, and increases a through-current capability of the pin. In this case, the reliability of soldering the magnetic device on the circuit board in high-power scenarios is enhanced.