公开(公告)号：EP4462456A1

公开(公告)日：2024-11-13

申请号：EP24167066.0

申请日：2024-03-27

申请人： Delphi Technologies IP Limited

发明人： NGUYEN, Van Thuan ,  LOSADA, Helena Cristobal

IPC分类号： H01F27/28 ,  H01F27/36

摘要： A planar transformer includes: a first primary coil in a first layer of a printed circuit board (PCB); a first secondary coil in one or more second layers in the PCB; and a second secondary coil in the one or more second layers.

公开(公告)号：EP4456096A1

公开(公告)日：2024-10-30

申请号：EP24170511.0

申请日：2024-04-16

申请人： Young In Ace Co., Ltd.

发明人： OSIPOV, Vadim ,  KIM, Eun Do ,  KANG, Sung Won

IPC分类号： H01F27/28 ,  H01J49/02 ,  H01F38/08

摘要： Disclosed is a power supply including an RF power source, a magnetic core transformer including a first transformer and a second transformer, each of which boosts an output of the RF power source. Each of the first transformer and the second transformer includes an input coil, a magnetic core, and an output coil. The input coil includes an outer winding and inner winding. The outer winding and inner winding form a single turn winding, and the outer winding and the inner winding are connected in series to each other.

公开(公告)号：EP4449463A1

公开(公告)日：2024-10-23

申请号：EP22834643.3

申请日：2022-12-13

申请人： Valeo eAutomotive France SAS

发明人： POUILLY, Aurélien ,  BATTISTELLA, Rudy ,  PARIGOT, Baptiste ,  DIALLO, Massourang ,  DA CUNHA ALVES, Wendell

IPC分类号： H01F27/28 ,  H01F27/30 ,  H01F27/24 ,  H01F27/32 ,  H01F41/12

公开(公告)号：EP4434064A1

公开(公告)日：2024-09-25

申请号：EP21816382.2

申请日：2021-11-18

申请人： Hitachi Energy Ltd

发明人： RADU, Ion

IPC分类号： H01F27/28 ,  H01F27/34

CPC分类号： H01F27/2823 ,  H01F27/2876 ,  H01F27/34

公开(公告)号：EP4432317A1

公开(公告)日：2024-09-18

申请号：EP23162470.1

申请日：2023-03-16

申请人： Infineon Technologies Austria AG

发明人： THEUSS, Horst ,  GEIßLER, Christian ,  HARTNER, Walter

IPC分类号： H01F27/28 ,  H01F27/40 ,  H01L23/52 ,  H01L23/64 ,  H05K1/16 ,  H05K1/18

CPC分类号： H01F27/2804 ,  H01F2019/08520130101 ,  H01F2027/280920130101 ,  H01L23/5227 ,  H01F27/40 ,  H05K1/165 ,  H05K1/18

摘要： A transformer arrangement is disclosed. The transformer arrangement includes: an electrically insulating carrier (1); a first integrated circuit (2) including a first semiconductor die (20) embedded in or arranged on top of the electrically insulating carrier (1); and a transformer (3) including a first winding (31) and a second winding (32) that are inductively coupled. One of the first and second windings (31, 32) is connected to the first integrated circuit (2), and each of the first and second windings (31, 32) is embedded in or arranged on top of the electrically insulating carrier (1).

公开(公告)号：EP4427251A1

公开(公告)日：2024-09-11

申请号：EP22891108.7

申请日：2022-11-04

申请人： Siemens Healthcare Diagnostics, Inc.

发明人： EDWARDS, Mark

IPC分类号： H01F27/32 ,  H01F5/06 ,  H01F5/04 ,  H01F27/28

CPC分类号： H01F5/003 ,  G01N35/04 ,  G01N2035/04720130101 ,  G01N2035/047720130101 ,  G01N2035/049320130101 ,  G01N35/00732 ,  G01N2035/0076220130101

公开(公告)号：EP4420165A1

公开(公告)日：2024-08-28

申请号：EP22884625.9

申请日：2022-10-17

申请人： Adeia Semiconductor Bonding Technologies Inc.

发明人： GAO, Guilian ,  FOUNTAIN, Gaius, Gillman, Jr. ,  HABA, Belgacem ,  KATKAR, Rajesh

IPC分类号： H01L23/64 ,  H01L25/065 ,  H01L23/00 ,  H01L23/528 ,  H01F17/00 ,  H01F27/28

CPC分类号： H01L23/645 ,  H01L25/50 ,  H01L25/0657 ,  H01L2225/0656520130101 ,  H01L2225/0654120130101 ,  H01L2225/0652420130101 ,  H01L23/481 ,  H01L23/5227

公开(公告)号：EP4383290A3

公开(公告)日：2024-08-21

申请号：EP24173489.6

申请日：2018-02-14

申请人： Biosense Webster (Israel) Ltd.

发明人： GOVARI, Assaf ,  BAR-TAL, Meir ,  REUVENI, Avi

IPC分类号： A61B5/06 ,  A61B5/00 ,  H01F5/00 ,  H01F41/04 ,  A61B18/00 ,  A61B34/20 ,  H05K1/02 ,  H05K1/16 ,  H01F17/00 ,  H01F27/28

CPC分类号： A61B5/6851 ,  A61B5/6852 ,  A61B5/062 ,  H01F5/003 ,  H01F41/041 ,  H05K1/028 ,  H05K1/165 ,  A61B2560/046820130101 ,  A61B2562/022320130101 ,  A61B2562/0420130101 ,  A61B2562/0620130101 ,  A61B2562/1220130101 ,  A61B2562/12520130101 ,  A61B2562/16420130101 ,  A61B2562/16620130101 ,  H01F2017/00620130101 ,  H05K2201/05120130101 ,  A61B2034/205120160201

摘要： A position sensor includes a flexible substrate formed into a three-dimensional (3D) shape. At least first and second field-sensing coils are formed in first and second respective layers of the flexible substrate, such that in the 3D shape the first and second field-sensing coils have first and second respective axes that are not parallel to one another.

公开(公告)号：EP4376035A3

公开(公告)日：2024-07-31

申请号：EP24167785.5

申请日：2021-09-30

申请人： Sweven Design Ltd

发明人： Gwynne, Robert William

IPC分类号： H01F27/34 ,  H01F30/06 ,  H01F27/36 ,  H01F27/28 ,  H01F27/40

CPC分类号： H01F27/346 ,  H01F30/06 ,  H01F27/2895 ,  H01F27/363 ,  H01F27/2885 ,  H01F27/402

摘要： A drive circuit configured to drive a load, the circuit comprising a transformer (1212, 2412), the transformer (1212, 2412) comprising a transformer primary comprising one or more primary windings (1712) connected to arms (1702) that pass through a magnetic material (1718), a transformer secondary comprising secondary windings (1714) connected to planar secondary conductors (1708) which pass through the inside of the arms (1702), a voltage source (2426) configured to apply a voltage across the transformer primary.

公开(公告)号：EP4372771A3

公开(公告)日：2024-07-31

申请号：EP24163741.2

申请日：2019-11-01

申请人： Delta Electronics (Shanghai) Co., Ltd.

发明人： CAI, Chaofeng ,  XIN, Xiaoni ,  ZENG, Jianhong ,  HONG, Shouyu ,  WU, Rui ,  YE, Haoyi ,  YE, Yiqing ,  ZHOU, Jinping ,  FU, Zhiheng ,  ZHOU, Min ,  KUO, Yu-Ching ,  PAN, Tong-Sheng ,  LIN, Wen-Yu

IPC分类号： H01F27/28 ,  H01F27/29 ,  H01F27/40 ,  H02M3/335 ,  H01F41/063 ,  H01F41/12

CPC分类号： H01F27/2804 ,  H01F2027/280920130101 ,  H01F2027/285720130101 ,  H01F27/2852 ,  H01F27/2895 ,  H01F27/292 ,  H01F27/40 ,  H01F41/12 ,  H01F41/063

摘要： The present disclosure provides a transformer module, a power module, and a manufacturing method of a metal winding of a transformer module, where the power module includes a transformer module, and the transformer module comprises: a magnetic core, wherein a first wiring layer, a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from outside to inside; a first metal winding, formed in the first wiring layer and wound around the magnetic core in a foil structure; the first insulating layer, at least partially covered by the first metal winding; and a second metal winding, formed on in the second wiring layer and wound around the magnetic core in a foil structure, wherein the second metal winding is at least partially covered by the first insulating layer, and at least partially covered by the first metal winding.