HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE

    公开(公告)号:EP4099809A1

    公开(公告)日:2022-12-07

    申请号:EP22159744.6

    申请日:2017-09-27

    IPC分类号: H05K7/20

    摘要: The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.

    CIRCUIT BOARD, CIRCUIT BOARD MANUFACTURING METHOD AND ELECTRONIC DEVICE

    公开(公告)号:EP3934390A1

    公开(公告)日:2022-01-05

    申请号:EP20779595.6

    申请日:2020-03-27

    IPC分类号: H05K1/02 H05K3/00

    摘要: This application provides a circuit board, a method for manufacturing the circuit board, and an electronic component and an electronic device that include the circuit board. By changing a liquid phase and a vapor phase of a cooling medium in a thermally conductive layer of the circuit board, heat can be efficiently transferred from a high temperature zone to a low temperature zone, thereby enhancing a heat transfer effect of the circuit board. In the electronic device, the circuit board is used to connect different modules or structures, so that heat of a module with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby avoiding a local high temperature in the electronic device and ensuring uniform heat of all parts of the electronic device. In addition, a heat dissipation effect of the electronic device can be improved.

    INJECTION MOULDING DEVICE
    4.
    发明公开
    INJECTION MOULDING DEVICE 审中-公开
    注射成型装置

    公开(公告)号:EP3281761A1

    公开(公告)日:2018-02-14

    申请号:EP15890276.7

    申请日:2015-04-30

    发明人: YANG, Guo

    IPC分类号: B29C45/17 B29C45/26

    摘要: The present invention provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove. At least one of the first positive electrode module and the first negative electrode module is insulated from the fixed mold component and the movable mold component. In the present invention, electric field excitation on injection-molding melt in a flow state is implemented.

    摘要翻译: 本发明提供一种注射成型装置,包括固定模具部件,可动模具部件,第一正极模块以及第一负极模块。 固定的模具部件具有注入口和传输流道,以接收注塑熔体。 可动模具部件具有与传动装置连通的成型槽。 第一正极模块与第一负极模块分别设置于模槽的第一侧与第二侧,其中第一侧与第二侧彼此相对。 第一正电极模块与第一负电极模块配合以在成型凹槽的第一侧和第二侧之间形成电场,以对流入成型凹槽的注塑成型熔体执行电场激励。 第一正电极模块和第一负电极模块中的至少一个与固定模具部件和活动模具部件绝缘。 在本发明中,实现了在流动状态下对注塑熔体进行电场激励。

    FAN AND MOBILE TERMINAL
    6.
    发明公开

    公开(公告)号:EP3736449A1

    公开(公告)日:2020-11-11

    申请号:EP18903083.6

    申请日:2018-02-02

    IPC分类号: F04D29/30

    摘要: This application provides a fan and a mobile terminal. The fan includes a housing and a centrifugal impeller disposed inside the housing and rotatable relative to the housing, where the centrifugal impeller includes a plurality of blades, at least one of the plurality of blades is provided with a plurality of grooves arranged along a radial direction of the blade, and the grooves are inclined at an angle relative to a normal direction of a radial tangent of the blade. In use, movement of an airflow relative to the blade is a combination of velocity along a tangential direction of the blade and velocity relative to a radius of the centrifugal impeller, that is, final relative velocity is not parallel to the normal direction (a direction perpendicular to the radial tangent of the blade) of the blade. Therefore, to enable air to flow through the grooves more smoothly, the grooves disposed in embodiments of this application are inclined relative to the radial direction, so that a length direction of the grooves is the same as a direction of the relative velocity as much as possible, thereby improving passage of the air through the grooves, further improving a passing effect, and reducing noise caused by the fan.

    WIRELESS CHARGING DEVICE
    7.
    发明公开

    公开(公告)号:EP3694301A1

    公开(公告)日:2020-08-12

    申请号:EP18873394.3

    申请日:2018-10-27

    IPC分类号: H05K7/20

    摘要: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board PCB, and a fan. The induction coil is attached to the ferrite, and the ferrite, the PCB, and the fan are accommodated inside the housing. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. The ferrite is disposed close to the first surface. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB. The gap forms a part of the air duct, or the gap forms an auxiliary air duct of the air duct. In the embodiments of the present invention, a dissipation effect of the to-be-charged device such as a mobile phone is good.

    WIRELESS CHARGING DEVICE
    8.
    发明公开

    公开(公告)号:EP4195895A1

    公开(公告)日:2023-06-14

    申请号:EP22206095.6

    申请日:2018-10-27

    IPC分类号: H05K7/20 H02J7/00

    摘要: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board PCB, and a fan. The induction coil is attached to the ferrite, and the ferrite, the PCB, and the fan are accommodated inside the housing. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. The ferrite is disposed close to the first surface. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB. The gap forms a part of the air duct, or the gap forms an auxiliary air duct of the air duct. In the embodiments of the present invention, a dissipation effect of the to-be-charged device such as a mobile phone is good.

    HEAT-CONDUCTING ASSEMBLY AND TERMINAL
    9.
    发明公开

    公开(公告)号:EP3764760A1

    公开(公告)日:2021-01-13

    申请号:EP19777721.2

    申请日:2019-03-06

    IPC分类号: H05K7/20 H04M1/02

    摘要: This application pertains to the field of electronic technologies and discloses a heat-conducting assembly and a terminal. The heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, the middle frame has a first side surface and a second side surface that are opposite to each other, and the middle frame is provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor and a heat insulator. The conductor is connected to the heat dissipation part, and the conductor is fastened in the first through hole through the heat insulator, and is in contact with a heat source. The heat source is close to one end that is of the first through hole and that is located on the first side surface. This application resolves a problem of how to dissipate heat from the heat source, and this application is used to dissipate heat from the heat source.

    HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

    公开(公告)号:EP3512318A1

    公开(公告)日:2019-07-17

    申请号:EP17854914.3

    申请日:2017-09-27

    IPC分类号: H05K7/20

    摘要: The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.