公开(公告)号：EP1183737A1

公开(公告)日：2002-03-06

申请号：EP00932363.5

申请日：2000-05-11

申请人： INTEL CORPORATION

发明人： ASSADI, Azar ,  MOSSAHEBI, Parvin ,  SENGUPTA, Kabul

IPC分类号： H01L31/0232 ,  G02B3/00 ,  G03F7/00 ,  G02B6/12

CPC分类号： G02B3/0018 ,  G02B3/0056 ,  G02B6/1221 ,  G02B6/1245 ,  G02B6/4204 ,  G03F7/0005 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A photosensitive device (46) with a microlens array (44) may be packaged for surface mount packaging (48) and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.

摘要翻译： 具有微透镜阵列的光敏器件可以被封装以用于表面贴装封装和随后的质量回流处理，而不会显着降低微透镜的光学性能。 微透镜可以使用一系列增加时间和温度的热步骤形成。 此外，微透镜可以被漂白以防止在通常与表面贴装技术相关的温度下其光透射率的降低。

公开(公告)号：EP1183737B1

公开(公告)日：2008-06-25

申请号：EP00932363.5

申请日：2000-05-11

申请人： Intel Corporation

发明人： ASSADI, Azar ,  MOSSAHEBI, Parvin ,  SENGUPTA, Kabul

IPC分类号： H01L31/0232 ,  G02B3/00 ,  G03F7/00 ,  G02B6/12

CPC分类号： G02B3/0018 ,  G02B3/0056 ,  G02B6/1221 ,  G02B6/1245 ,  G02B6/4204 ,  G03F7/0005 ,  H01L31/02325 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A photosensitive device (46) with a microlens array (44) may be packaged for surface mount packaging (48) and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.