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532 条记录 (耗时 0.019 秒)

    INFRARED IMAGE-FORMING LENS
    4.
    发明公开
    INFRARED IMAGE-FORMING LENS 审中-公开

    公开(公告)号：EP3385768A1

    公开(公告)日：2018-10-10

    申请号：EP16870681.0

    申请日：2016-11-30

    申请人： Kyocera Optec Co., Ltd.

    发明人： SUZUKI, Akihiko

    IPC分类号： G02B13/14 ,  G02B13/18

    CPC分类号： G02B13/146 ,  G02B5/1814 ,  G02B13/14 ,  G02B13/18 ,  H01L31/02325

    摘要： An object of the present application is to provide an infrared imaging lens at a lower cost than before.
    An infrared imaging lens (10) comprises, in order from an object side, a first lens (L1) formed of silicon whose minimum transmittance of infrared rays with a wavelength of 8µm to 13µm is at least 40% for a thickness of 1mm, and a second lens (L2) formed of chalcogenide glass. The silicon whose minimum transmittance of infrared rays with a wavelength of 8µm to 13µm is at least 40% for a thickness of 1mm can be obtained at low cost for example by controlling the oxygen concentration in CZ method.

    MILLIMETER WAVE AND FAR-INFRARED DETECTOR
    5.
    发明授权
    MILLIMETER WAVE AND FAR-INFRARED DETECTOR 有权
    毫米波和远红外探测器

    公开(公告)号：EP1134814B1

    公开(公告)日：2018-05-02

    申请号：EP00944328.4

    申请日：2000-07-07

    申请人： Japan Science and Technology Agency

    发明人： KOMIYAMA, Susumu ,  OLEG, Astafiev ,  VLADMIR, Antonov ,  HIRAI, Hiroshi ,  KUTSUWA, Takeshi, Sanyo Haitsu No.17

    IPC分类号： H01L31/09 ,  G01J1/44 ,  G01J1/02 ,  H01L29/76

    CPC分类号： H01Q9/28 ,  B82Y10/00 ,  H01L31/02325 ,  H01L31/03046 ,  H01L31/0352 ,  H01L31/101

    摘要： An MR/FIR light detector is disclosed herein that has extraordinarily high degree of sensitivity and a high speed of response. The detector includes an MR/FIR light introducing section (1) for guiding an incident MR/FIR light (2), a semiconductor substrate (14) formed with a single-electron transistor (14) for controlling electric current passing through a semiconductor quantum dot (12) formed therein, and a BOTAI antenna (6, 6a, 6b, 6c) for concentrating the MW/FIR light (2) into a small special zone of sub-micron size occupied by the semiconductor quantum dot (12) in the single-electron transistor (14). The quantum dot (12) forming a two-dimensional electron system absorbs the electromagnetic wave concentrated efficiently, and retains an excitation state created therein for 10 nanoseconds or more, thus permitting electrons of as many as one millions in number or more to be transferred with respect to a single photon absorbed.

    INTEGRATED CIRCUIT WITH DIRECTIONAL LIGHT SENSOR, DEVICE INCLUDING SUCH AN IC
    7.
    发明授权
    INTEGRATED CIRCUIT WITH DIRECTIONAL LIGHT SENSOR, DEVICE INCLUDING SUCH AN IC 有权
    带方向光传感器的集成电路，包括这种集成电路的器件

    公开(公告)号：EP2847797B1

    公开(公告)日：2018-04-04

    申请号：EP13723039.7

    申请日：2013-05-02

    申请人： NXP B.V.

    发明人： ZIVKOVIC, Zoran ,  PONOMAREV, Youri

    IPC分类号： H01L31/02 ,  H01L31/0216 ,  H01L27/144 ,  G01S3/784

    CPC分类号： H01L31/0232 ,  G01S3/784 ,  H01L27/1443 ,  H01L27/14623 ,  H01L31/02024 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/05 ,  H01L2224/4847

    摘要： Disclosed is an integrated circuit comprising a substrate having a major surface; a directional light sensor, the directional light sensor comprising a plurality of photodetectors on a region of said major surface, said plurality of photodetectors comprising a set of first photodetectors for detecting light from a first direction and a set of second photodetectors for detecting light from a second direction, wherein a first photodetector is located adjacent to a second photodetector; and a light blocking structure comprising a first portion extending from said major surface in between the first photodetector and the second photodetector; and a second portion extending from the first portion and at least partially overhanging at least one of the first photodetector and the second photodetector. A device including such an IC and a method of manufacturing such an IC are also disclosed.

    PACKAGE FOR STORING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE
    9.
    发明公开
    PACKAGE FOR STORING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：EP3118895A4

    公开(公告)日：2017-11-15

    申请号：EP15761347

    申请日：2015-03-13

    申请人： KYOCERA CORP

    发明人： KAWAZU YOSHIKI

    IPC分类号： H01L23/057 ,  H01L23/10

    CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/373 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/024 ,  H01L2924/0002 ,  H01S5/02212 ,  H01S5/02284 ,  H01S5/02469 ,  H01L2924/00

    摘要： An electronic component housing package (10) includes a substrate (11) having an upper surface including a mount region (R) on which an electronic component (20) is to be mounted; a frame body (12) disposed on the upper surface of the substrate (11) so as to surround the mount region (R), the frame body being provided with a through-hole portion (H); and an input/output member (13) disposed on the frame body (12) so as to block the through-hole portion (H), the input/output member having a plurality of wiring conductors (131) which are to be electrically connected to the electronic component (20), the wiring conductors (131) extending to an inside and outside of the frame body (12) and also extending along a lower surface of the input/output member on the outside of the frame body (12). The input/output member (13) is provided with a cutout portion (C) which is cut out so as to extend from a gap between the plurality of wiring conductors (131) on the lower surface along the wiring conductors (131) to an outer side surface of the input/output member (13). It is possible to provide a compact electronic component housing package (10) which has good electric properties.

    COMPACT OPTOELECTRONIC MODULES
    10.
    发明公开
    COMPACT OPTOELECTRONIC MODULES 审中-公开
    KOMPAKTE OPTOELEKTRONISCHE模块

    公开(公告)号：EP3072155A4

    公开(公告)日：2017-05-03

    申请号：EP14863553

    申请日：2014-11-18

    申请人： HEPTAGON MICRO OPTICS PTE LTD

    发明人： GEIGER JENS

    IPC分类号： H01L27/146 ,  G01S7/481 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16 ,  H01L31/0232 ,  H01L31/167 ,  H01L31/173 ,  H01L33/44 ,  H01L33/48

    CPC分类号： H01L25/167 ,  G01S7/4813 ,  H01L24/97 ,  H01L25/50 ,  H01L27/14618 ,  H01L31/02325 ,  H01L31/167 ,  H01L31/173 ,  H01L33/44 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/00

    摘要： Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.

    摘要翻译： 描述了紧凑型光电模块，在一些实施方式中，其可以具有减小的高度，同时具有非常小的光学串扰或杂散光的检测。 具有光学通道的光电子模块可以包括其上安装有光电子器件的支撑件，该光电子器件被布置成发射或检测特定的一个或多个波长的光。 该模块具有覆盖物，该覆盖物包括光电装置上的光学透射部分。 透光部分由覆盖物的侧面包围，所述覆盖物对于一个或多个波长基本上不透明。 无源光学元件存在于光学透射部分的表面上。 垫片将支架与盖子分开。 盖可以相对较薄，使得模块的整体高度相对较小。