公开(公告)号：EP4016148A1

公开(公告)日：2022-06-22

申请号：EP21195423.5

申请日：2021-09-08

申请人： INTEL Corporation

发明人： TODA, Asako ,  CHIU, Chia-Pin ,  LI, Xiaoqian ,  BAI, Yiqun

IPC分类号： G02B6/42

摘要： Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate

公开(公告)号：EP4020529A1

公开(公告)日：2022-06-29

申请号：EP21198864.7

申请日：2021-09-24

申请人： Intel Corporation

发明人： ZIADEH, Bassam ,  HUANG, Jingyi ,  BAI, Yiqun ,  LIN, Ziyin ,  MEHTA, Vipul ,  VAN NAUSDLE, Joseph

IPC分类号： H01L21/56

摘要： Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.