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公开(公告)号:EP4328978A2
公开(公告)日:2024-02-28
申请号:EP23219358.1
申请日:2020-06-19
申请人: INTEL Corporation
发明人: METZ, Matthew , GSTREIN, Florian , MITAN, Martin , HOURANI, Rami , CLENDENNING, Scott , LIAO, Szuya , BAUMGARTEL, Lukas , CHIKKADI, Kiran , LANCASTER, Diane , TORRES, Jessica
IPC分类号: H01L29/78
摘要: Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described. In an example, an integrated circuit structure includes a semiconductor fin having a cut along a length of the semiconductor fin. A gate endcap isolation structure has a first portion parallel with the length of the semiconductor fin and is spaced apart from the semiconductor fin. The gate endcap isolation structure also has a second portion in a location of the cut of the semiconductor fin and in contact with the semiconductor fin.
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公开(公告)号:EP3796394A1
公开(公告)日:2021-03-24
申请号:EP20181036.3
申请日:2020-06-19
申请人: INTEL Corporation
发明人: METZ, Matthew , GSTREIN, Florian , MITAN, Martin , HOURANI, Rami , CLENDENNING, Scott , LIAO, Szuya , TORRES, Jessica , CHIKKADI, Kiran , BAUMGARTEL, Lukas , LANCASTER, Diane
摘要: Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described. In an example, an integrated circuit structure includes a semiconductor fin having a cut along a length of the semiconductor fin. A gate endcap isolation structure has a first portion parallel with the length of the semiconductor fin and is spaced apart from the semiconductor fin. The gate endcap isolation structure also has a second portion in a location of the cut of the semiconductor fin and in contact with the semiconductor fin.
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公开(公告)号:EP4328978A3
公开(公告)日:2024-04-24
申请号:EP23219358.1
申请日:2020-06-19
申请人: INTEL Corporation
发明人: METZ, Matthew , GSTREIN, Florian , MITAN, Martin , HOURANI, Rami , CLENDENNING, Scott , LIAO, Szuya , BAUMGARTEL, Lukas , CHIKKADI, Kiran , LANCASTER, Diane , TORRES, Jessica
IPC分类号: H01L29/66 , H01L29/78 , H01L21/8234 , H01L27/088
CPC分类号: H01L29/66795 , H01L29/785 , H01L21/823431 , H01L27/0886 , B82Y10/00 , H01L29/0673 , H01L29/775 , H01L21/823481 , H01L21/823475
摘要: Self-aligned gate endcap (SAGE) architectures without fin end gaps, and methods of fabricating self-aligned gate endcap (SAGE) architectures without fin end gaps, are described. In an example, an integrated circuit structure includes a semiconductor fin having a cut along a length of the semiconductor fin. A gate endcap isolation structure has a first portion parallel with the length of the semiconductor fin and is spaced apart from the semiconductor fin. The gate endcap isolation structure also has a second portion in a location of the cut of the semiconductor fin and in contact with the semiconductor fin.
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公开(公告)号:EP4203062A1
公开(公告)日:2023-06-28
申请号:EP22208658.9
申请日:2022-11-21
申请人: Intel Corporation
发明人: NANDI, Debaleena , BOMBERGER, Cory , LANCASTER, Diane , DEWEY, Gilbert , PATIL, Sandeep K. , KOBRINSKY, Mauro J. , MURTHY, Anand S. , GHANI, Tahir
IPC分类号: H01L29/08 , H01L29/06 , H01L29/423 , H01L29/786
摘要: Gate-all-around integrated circuit structures having confined epitaxial source or drain structures, are described. For example, an integrated circuit structure includes a plurality of nanowires (406) above a sub-fin. A gate stack (428, 426) is over the plurality of nanowires and the sub-fin. Epitaxial source or drain structures are on opposite ends of the plurality of nanowires. The epitaxial source or drain structures comprise i) a first PMOS epitaxial (pEPI) region of germanium and boron, ii) a second pEPI region of silicon, germanium and boron on the first pEPI region at a contact location, iii) titanium silicide conductive contact material (434, 436) on the second pEPI region.
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