公开(公告)号：EP2209358A1

公开(公告)日：2010-07-21

申请号：EP09817569.8

申请日：2009-07-15

Applicant: Ibiden Co., Ltd.

Inventor： AKAI Sho ,  IMAI Tatsuya ,  TOKIHISA Iku

IPC: H05K3/46 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/244 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/099 ,  H05K2203/025

Abstract: A multilayer printed wiring board of the present invention is characterized by a first interlayer resin insulation layer; a pad for mounting an electronic component formed on the first interlayer resin insulation layer; a solder-resist layer formed on the first interlayer resin insulation layer and the pad, and having an opening portion that reaches the pad; and a protective film positioned at the bottom of the opening portion and formed on the pad. In such a multilayer printed wiring board, a metal layer is formed on the surface of the pad, containing at least one metal from among Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt and Au; a coating film made of a coupling agent is formed on the metal layer; and at least part of the protective film is formed directly on the exposed surface of the pad, which is exposed through the opening portion.

Abstract translation: 本发明的多层印刷电路板是由第一层间树脂绝缘层为特征的; 用于将形成在第一层间树脂绝缘层上的电子部件的安装垫; 一焊料抗蚀剂来形成第一层间树脂绝缘层和所述焊盘上层，并且具有开口部没达的垫; 和保护膜位于开口部分的底部以及形成在该垫。 在寻求一种多层印刷电路板中，金属层是形成在垫的表面上，从锡，镍，锌，钴，钛，钯，银，Pt和Au中含有至少一种金属; 涂膜制成的偶联剂是形成在金属层上; 和保护膜的至少一部分直接形成在焊盘的暴露的表面，在所有这是通过开口部露出。